Chip antenna apparatus and methods
1 Assignment
0 Petitions
Accused Products
Abstract
A chip component with dielectric substrate and plurality of radiating antenna elements on the surface thereof. In one embodiment, two (2) substantially symmetric elements are used, each covering an opposite head and upper surface portion of the device. The surface between the elements comprises a slot. The chip is mounted on a circuit board (e.g.,. PCB) whose conductor pattern is part of the antenna. No ground plane is used under the chip or its sides to a certain distance. One of the antenna elements is coupled to the feed conductor on the PCB and to the ground plane, while the parasitic element is coupled only to the ground plane. The parasitic element is fed through coupling over the slot, and both elements resonate at the operating frequency. The antenna can be tuned and matched without discrete components, is substantially omni-directional, and has low substrate losses due to simple field image.
47 Citations
90 Claims
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1-57. -57. (canceled)
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58. A chip component comprising a feed structure, the chip component further comprising:
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a dielectric substrate comprising a plurality of surfaces; a first antenna element at least partially disposed on a first surface of said substrate and at least partially on a second surface of said substrate, the first antenna element adapted to couple to a ground plane at a first location; a second antenna element at least partially disposed on a third surface of said substrate, the third surface substantially opposing the first surface, and at least partially on the second surface, the second antenna element adapted to couple to the ground plane at a second location; and an electromagnetic coupling element disposed substantially between the first element and the second element; wherein the feed structure is galvanically coupled to the first antenna element at a third location, and is coupled to the second antenna element through the electromagnetic coupling element so as to form a resonant structure between the first antenna element, the second antenna element, the dielectric substrate, and the ground plane. - View Dependent Claims (59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73)
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74. A chip component comprising a feed structure, and further comprising:
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a dielectric substrate; a first resonant element; a second resonant element; and a coupling element disposed electrically between at least a portion of the first and the second resonant elements; wherein the feed structure is galvanically connected to the first resonant element and is electromagnetically coupled through the coupling element to the second resonant element so as to form a resonant structure between the first resonant element, the second resonant element, the dielectric substrate, and a ground plane to which the chip component is to be mated. - View Dependent Claims (75, 76, 78, 79)
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77. The chip component of claim 77, wherein the conductive material forms a plurality of projections extending between the first resonant element and the second resonant element.
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80. A chip antenna, comprising:
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a first layer, comprising a ground plane; a second layer, comprising a conductive coating and having a first end and a second end; a dielectric substrate, disposed substantially between the first and the second layer; wherein; at least a portion of said second layer proximate the first end and coupled to the ground plane at a first location forms a first antenna element; and at least a portion of said second layer proximate the second end and coupled to the ground plane at a second location forms a second antenna element; an electromagnetic coupling element disposed between the first antenna element and the second antenna element; a feed structure galvanically coupled to the first antenna element at a third location and coupled to the second antenna element through the electromagnetic coupling element so as to form a resonant structure between the first antenna element, the second antenna element, the dielectric substrate, and the ground plane. - View Dependent Claims (81, 82)
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83. A radio frequency device adapted for wireless communications, the radio frequency device comprising:
a printed circuit board comprising a ground plane and a chip component for enabling at least a portion of the wireless communications, the chip component comprising; a dielectric substrate comprising a plurality of surfaces; a first antenna element at least partially disposed on a first surface of the dielectric substrate and at least partially on a second surface of the dielectric substrate, the first antenna element coupled to the ground plane at a first location; a second antenna element at least partially disposed on a third surface of the dielectric substrate, the third surface substantially opposing the first surface, and at least partially on the second surface, the second antenna element coupled to the ground plane at a second location; and an electromagnetic coupling element disposed substantially between the first element and the second element; wherein the feed structure is galvanically coupled to the first antenna element at a third location and is coupled to the second antenna element through the electromagnetic coupling element so as to form a resonant structure between the first antenna element, the second antenna element, the dielectric substrate, and the ground plane. - View Dependent Claims (84, 85, 86, 87, 88, 89, 90)
Specification