3D INTEGRATION OF VERTICAL COMPONENTS IN RECONSTITUTED SUBSTRATES
1 Assignment
0 Petitions
Accused Products
Abstract
A reconstituted electronic device including: a first face and a second face; a plurality of individual chips placed perpendicular to the faces, each individual chip carrying, on one of its surfaces, at least one component, tracks, and a connection mechanism that are flush with one or other of the faces of the reconstituted electronic device; and an encapsulant that encapsulates the individual chips.
29 Citations
48 Claims
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1-24. -24. (canceled)
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25. A method of producing a reconstituted electronic device including, between a first face and a second face, a plurality of individual dies placed perpendicular to the faces, each individual die being bare, without packaging, tracks and connections being integrated in the die, only ends of the connections being flush, each die including a first side and a second side opposite to the first side, and including at least one component, the connections of the die being directed from the component to the first side or the second side, the method comprising:
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a) positioning of one of the first and second sides of each individual die on a reference surface, so that each individual die is placed perpendicular to the reference surface; b) encapsulating the individual dies with an encapsulant, so that the connections of each individual die are flush with one or other of the faces of the reconstituted substrate. - View Dependent Claims (26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39)
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40. A reconstituted electronic device comprising:
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a first face and a second face, a plurality of bare, non encapsulated individual dies placed perpendicular to the faces, each individual die comprising at least one component, and tracks and connections that are flush with one or other of the faces of the reconstituted substrate; and an encapsulant that encapsulates the individual dies. - View Dependent Claims (41, 42, 43, 44, 45, 46, 47, 48)
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Specification