MEMS DEVICES HAVING SUPPORT STRUCTURES WITH SUBSTANTIALLY VERTICAL SIDEWALLS AND METHODS FOR FABRICATING THE SAME

• US 20100202039A1
• Filed: 04/23/2010
• Published: 08/12/2010
• Est. Priority Date: 08/19/2005
• Status: Active Grant

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Qualcomm MEMS Technologies Incorporated (Qualcomm, Inc.)
• Inventors: Zee, Stephen, Wang, Chun-Ming, Kogut, Lior, Zhong, Fan, Qiu, Chengbin
• Granted Patent: US 8,298,847 B2
• Time in Patent Office: Days
• US Class Current: 359/291
• CPC Class Codes: B81B 2201/047 Optical MEMS not provided for in B81B2201/042 - B81B2201/045
• CPC Class Codes: B81B 2203/0163 Spring holders
• CPC Class Codes: B81B 2203/019 characterized by their profile
• CPC Class Codes: B81B 2203/0307 Anchors
• CPC Class Codes: B81B 2203/053 Translation according to an axis perpendicular to the substrate
• CPC Class Codes: B81B 3/0072 For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
• CPC Class Codes: B81C 1/00142 Bridges deformable micromirrors G02B26/0841
• CPC Class Codes: B81C 1/00666 Treatments for controlling internal stress or strain in MEMS structures
• CPC Class Codes: B81C 2201/0167 by adding further layers of materials having complementary strains, i.e. compressive or tensile strain
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means
• CPC Class Codes: Y10S 359/90 Methods

Abstract

Embodiments of MEMS devices include support structures having substantially vertical sidewalls. Certain support structures are formed through deposition of self-planarizing materials or via a plating process. Other support structures are formed via a spacer etch. Other MEMS devices include support structures at least partially underlying a movable layer, where the portions of the support structures underlying the movable layer include a convex sidewall. In further embodiments, a portion of the support structure extends through an aperture in the movable layer and over at least a portion of the movable layer.

Claims

1. A method of fabricating a MEMS device, comprising:

providing a substrate;

depositing an electrode layer over the substrate;

depositing a sacrificial layer over the electrode layer;

depositing a movable layer over the sacrificial layer;

patterning the movable layer to form an aperture extending through the movable layer, thereby exposing a portion of the sacrifical layer;

etching the exposed portion of the sacrificial layer to form a cavity extending through the sacrificial layer and undercutting a portion of the movable layer; and

depositing a layer of self-planarizing support material to fill the cavity.

2. The method of claim 1, wherein the layer of self-planarizing material extends over the movable layer, additionally comprising patterning the layer of support material to form a support structure, wherein the support structure comprises a convex outer surface corresponding to a re-entrant profile of the cavity.

3. The method of claim 2 additionally comprising patterning the layer of support material, leaving a portion overlying at least a portion of the aperture in the movable layer and extending over at least a portion of the movable layer.

4. The method of claim 3, wherein patterning the layer of support material to form a support structure additionally comprises removing a portion of the support material extending though the aperture in the mechanical layer, forming an aperture extending through the support structure.

5. The method of claim 1, additionally comprising perfoming a release etch to remove the sacrificial layer, forming an air gap located between the movable layer and the electrode layer.

6. The method of claim 1, wherein depositing the layer of support material comprises exposing the partially fabricated MEMS device to a liquid precursor.

7. The method of claim 6, wherein the liquid precursor comprises a spin-on precursor.

8. The method of claim 1, wherein the layer of support material comprises a polymeric material.

9. The method of claim 1, wherein etching the exposed portion of the sacrificial layer to form a cavity comprises performing an isotropic etch.

10. The method of claim 1, wherein depositing a movable layer over the support structure comprises depositing a reflective sublayer over the support structures and depositing a mechanical sublayer over the reflective sublayer.

11. The method of claim 1, wherein the MEMS device comprises an interferometric modulator.

12. A MEMS device formed by the method of claim 1.

13. A MEMS device, comprising:

a substrate;

an electrode layer located over the substrate;

a movable layer located over the electrode layer, wherein the movable layer is generally spaced apart from the electrode layer by an air gap, said movable layer comprising an aperture extending through the movable layer; and

a support structure located at least partially beneath the aperture in the movable layer, said support structure comprising a convex sidewall portion located underneath the movable layer.

14. The MEMS device of claim 13, wherein the support structure comprises a self-planarizing material.

15. The MEMS device of claim 14, wherein the support structure comprises a spin-on material.

16. The MEMS device of claim 14, wherein the support structure comprises a polymeric material.

17. The MEMS device of claim 13, wherein a portion of the support structure extends through the aperture in the movable layer, and wherein said support structure encloses at least a portion of the movable layer located adjacent the aperture in the movable layer.

18. The MEMS device of claim 17, wherein the support structure comprises an aperture extending through support structure to an underlying layer, and wherein said aperture extending though the support structure extends through the aperture in the movable layer.

19. The MEMS device of claim 13, wherein the movable layer comprises a mechanical sublayer and a reflective sublayer located on the side of the mechanical sublayer facing the air gap.

20. The MEMS device of claim 19, additionally comprising a partially reflective layer located on the opposite side of the air gap from the reflective sublayer.

21. A MEMS device, comprising:

first means for electrically conducting;

second means for electrically conducting; and

means for supporting said second conducting means over said first conducting means, wherein said second conducting means is movable relative to said first conducting means in response to generating electrostatic potential between said first and second conducting means, and wherein said supporting means extend through an aperture in said second conducting means and enclose at least a portion of said second conducting means.

22. The MEMS device of claim 21, wherein the first conducting means comprises an electrode layer supported by a substrate.

23. The MEMS device of claim 21, wherein the second conducting means comprises a movable layer, portions of which are spaced apart from said first conducting means by an interferometric gap.

24. The MEMS device of claim 21, wherein the supporting means comprises a support structure which extends through an aperture in the second conducting means and encloses at least a portion of the second conducting means, wherein the support structure is formed from a self-planarizing material.