METHOD OF MAKING AN ELECTRICAL CIRCUIT

• US 20100218978A1
• Filed: 04/23/2010
• Published: 09/02/2010
• Est. Priority Date: 04/22/2003
• Status: Abandoned Application

• Current Assignee: Touchsensor Technologies LLC (Methode Electronics Incorporated)
• Original Assignee: Touchsensor Technologies LLC (Methode Electronics Incorporated)
• Inventors: Caldwell, David W., Marshall, Michael L., Taylor, Michael Jon
• Application Number:
  US12/766,002
• Publication Number:
  US 20100218978A1
• Time in Patent Office: Days
• US Class Current: 174/250
• CPC Class Codes: C23C 14/562 for coating elongated substrates
• CPC Class Codes: G06F 2203/04113 Peripheral electrode pattern in resistive digitisers, i.e. electrodes at the periphery of the resistive sheet are shaped in patterns enhancing linearity of induced field
• CPC Class Codes: H01L 31/0232 Optical elements or arrangements associated with the device H01L31/0236 takes precedence; for photovoltaic cells H01L31/054; for photovoltaic modules H02S40/20
• CPC Class Codes: H05K 1/02 Details
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 2201/0108 Transparent
• CPC Class Codes: H05K 2201/0326 Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
• CPC Class Codes: H05K 2203/0361 Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
• CPC Class Codes: H05K 2203/1545 Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
• CPC Class Codes: H05K 3/06 the conductive material being removed chemically or electrolytically, e.g. by photo-etch process semi-additive methods H05K3/108
• CPC Class Codes: H05K 3/24 Reinforcing the conductive pattern by solder coating H05K3/3457
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49156 with selective destruction of conductive paths
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base

Abstract

A layer of transparent conductive material is disposed on a surface of a substrate. Further layers of conductive material are deposited on the layer of transparent conductive material or on an opposite surface of the substrate. The layers are selectively etched to yield a layout of pads for mounting electrical components and conductive traces forming an electrical circuit.

Claims

1. A method for fabricating an electrical circuit, comprising the steps of:

depositing a layer of a first conductive material onto a surface of a substrate;

depositing a layer of a second conductive material onto said layer of a first conductive material;

selectively etching a portion of said layer of a second conductive material; and

selectively etching a portion of said layer of a first conductive material.

2. The method of claim 1 wherein said layer of first conductive material is substantially transparent.

3. The method of claim 1 wherein said first conductive material is indium tin oxide.

4. The method of claim 1 wherein said second conductive material is copper.

5. The method of claim 4 further comprising the step of electrically connecting an electrical component to said second conductive material.

6. The method of claim 5 wherein said step of electrically connecting said electrical component to said second conductive material comprises soldering said electrical component to said second conductive material.

7. The method of claim 1 further comprising the step of depositing a layer of a third conductive material onto said layer of second conductive material.

8. The method of claim 7 wherein said layer of second conductive material is substantially transparent.

9. The method of claim 7 wherein said second conductive material is an oxide of niobium.

10. The method of claim 7 wherein said third material is copper.

11. The method of claim 7 further comprising the step of electrically connecting an electrical component to said second conductive material.

12. The method of claim 11 wherein said step of electrically connecting said electrical component to said second conductive material comprises soldering said electrical component to said second conductive material.

13. The method of claim 1 wherein at least one of said steps of depositing occur in a substantial vacuum.

14. The method of claim 1 further comprising the step of pretreating said surface of said substrate to enhance adhesion of said layer of first conductive material to said substrate.

15. A method for fabricating an electrical circuit, comprising the steps of:

depositing a layer of a first conductive material onto a surface of a substrate;

depositing a layer of a second conductive material onto said layer of a first conductive material;

selectively etching a first portion of said layer of a second conductive material and a portion of said layer of first conductive material; and

selectively etching a second portion of said layer of a second conductive material.

16. The method of claim 15 wherein said portion of said layer of first conductive material substantially corresponds to said first portion of said layer of a second conductive material.

17. The method of claim 15 further comprising the steps of:

depositing a layer of a third conductive material onto said layer of a second conductive material; and

selectively etching a first portion of said layer of a third conductive material.

18. The method of claim 15 wherein said portion of said layer of third conductive material substantially corresponds to said portion of said layer of said first conductive material and said first portion of said layer of a second conductive material.

19. A method for fabricating an electrical circuit, comprising the steps of:

depositing a layer of a first conductive material onto a first surface of a substrate;

depositing a layer of a second conductive material onto a second surface of said substrate;

selectively etching a portion of said layer of a first conductive material;

selectively etching a portion of said layer of a second conductive material;

perforating said substrate at a predetermined location; and

electrically coupling said layer of a first conductive material with said layer of a second conductive material.

20. An electrical circuit platform having transparent and conventional circuit portions, comprising:

a substrate, at least a portion of which is transparent;

a layer of a first conductive material disposed on said substrate in a first predetermined pattern; and

a layer of second conductive material disposed on said first conductive material in a second predetermined pattern.

21. The electrical circuit platform of claim 20 wherein said layer of first conductive material is substantially transparent.

22. The electrical circuit platform of claim 20 wherein said second conductive material is a conventional conductive material.

23. The electrical circuit platform of claim 20, further comprising a layer of a third conductive material disposed on said second conductive material in a third predetermined pattern.

24. The electrical circuit platform of claim 23 wherein said layer of second conductive material is substantially transparent.

25. The electrical circuit platform of claim 24 wherein said third conductive material is a conventional conductive material.