System for Cooling an Electronic Display

• US 20100238394A1
• Filed: 02/16/2010
• Published: 09/23/2010
• Est. Priority Date: 03/03/2008
• Status: Active Grant

• Current Assignee: Manufacturing Resources International, Inc.
• Original Assignee: Manufacturing Resources International, Inc.
• Inventors: Dunn, William R.
• Granted Patent: US 8,358,397 B2
• Time in Patent Office: Days
• US Class Current: 349/161
• CPC Class Codes: F28F 3/12 Elements constructed in the shape of a hollow panel, e.g. with channels F28D1/02, F28D1/03 take precedence
• CPC Class Codes: G02F 1/133385 with cooling means, e.g. fans
• CPC Class Codes: G02F 1/133603 with LEDs
• CPC Class Codes: G02F 1/133628 with cooling means
• CPC Class Codes: G02F 2201/36 Airflow channels, e.g. constructional arrangements facilitating the flow of air
• CPC Class Codes: H05K 7/20145 Means for directing air flow, e.g. ducts, deflectors, plenum or guides
• CPC Class Codes: H05K 7/20972 Forced ventilation, e.g. on heat dissipaters coupled to components

Abstract

A system for cooling an electronic display where an isolating structure may be used to allow ambient air to cool power modules. The isolating structure substantially prohibits containments which may be present within the ambient air from contacting sensitive electrical components on the power modules or otherwise. A gasket may be used to seal the interface between the power modules and the isolating structure. Heat sinks may be placed in thermal communication with the power supplies and fans may draw air through a narrow channel in which the heat sinks are located. In some embodiments the narrow channel may have the opposing surface of the channel defined by the rear portion of an LED assembly. Exemplary embodiments may use the ambient air to cool both the power modules and a closed loop of isolated gas within the electronic display.

Claims

1. A cooling system for an electronic display assembly comprising:

an isolating structure placed behind the electronic image assembly;

a channel defined by the space between the isolating structure and the electronic image assembly;

a power module having electronic components on a first side and a baseplate on the second side, where the power module is attached to the isolating structure so that the baseplate is within the channel and the electronic components are outside the channel; and

a fan positioned so as to draw ambient gas through the channel.

2. The cooling system of claim 1 further comprising:

a rib placed within the channel.

3. The cooling system of claim 1 further comprising:

a gasket surrounding the power module.

4. The cooling system of claim 1 further comprising:

a heat sink attached to the baseplate.

5. A light-emitting diode (LED) assembly comprising:

a mounting substrate;

a plurality of LEDs mounted on the front side of the mounting substrate;

an isolating structure placed behind the mounting substrate;

a channel defined by the space between the isolating structure and the mounting substrate;

a power module having electronic components on a first side and a heat sink on the second side, where the power module is attached to the isolating structure so that the heat sink is within the channel and the electronic components are outside the channel; and

a fan positioned so as to draw ambient gas through the channel.

6. The LED assembly of claim 5 further comprising:

a thermally-conductive surface placed on the rear surface of the mounting substrate.

7. The LED assembly of claim 5 wherein:

the mounting substrate is a printed circuit board (PCB).

8. The LED assembly of claim 5 wherein:

the mounting substrate is metallic.

9. The LED assembly of claim 5 wherein:

the mounting substrate is a metal core PCB.

10. The LED assembly of claim 5 further comprising:

a rib placed within the channel.

11. The LED assembly of claim 5 further comprising:

a gasket surrounding the power module.

12. An electronic image assembly comprising:

an electronic display assembly having a front and rear portion;

a surface on the rear portion of the electronic image assembly and in thermal communication with the electronic display assembly;

an isolating structure spaced apart from the surface;

a first channel defined by the space between the isolating structure and the surface;

a power module having electronic components on a first side and a heat sink on the second side, where the power module is attached to the isolating structure so that the heat sink is within the channel and the electronic components are outside the channel; and

a first fan positioned so as to draw ambient gas through the first channel.

13. The electronic image assembly of claim 12 further comprising:

a rib placed within the first channel.

14. The electronic image assembly of claim 12 further comprising:

a front display surface spaced apart from the front portion of the electronic display assembly;

a second channel defined by the space between the front display surface and the front portion of the electronic display assembly;

a heat exchanger in gaseous communication with the second channel, the heat exchanger having first and second gas pathways, where the first gas pathway is in gaseous communication with the second channel;

a second fan positioned so as to force ambient gas through the second gas pathway; and

a third fan positioned so as to force circulating gas through the second channel and the first gas pathway.

15. The electronic image assembly of claim 12 wherein:

the electronic display assembly is a LCD.

16. The electronic image assembly of claim 12 wherein:

the electronic display assembly is an OLED.

17. The electronic image assembly of claim 12 wherein:

the electronic display assembly is an LED-backlit LCD.

18. The electronic image assembly of claim 12 wherein:

the surface on the rear portion of the electronic image assembly is the rear surface of an LED backlight.