Method of manufacturing led lamp

• US 20100244071A1
• Filed: 03/25/2010
• Published: 09/30/2010
• Est. Priority Date: 03/26/2009
• Status: Active Grant

• Current Assignee: Toyoda Gosei Company Limited (Toyota Motor Corporation)
• Original Assignee: Toyoda Gosei Company Limited (Toyota Motor Corporation)
• Inventors: Wada, Satoshi, Moriyama, Miki
• Granted Patent: US 8,759,123 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: B29C 43/021 characterised by the shape of the surface
• CPC Class Codes: B29C 43/18 incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles B29C43/206 takes precedence
• CPC Class Codes: B29K 2709/08 Glass
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/49107 on the semiconductor or solid-state body
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/15787 Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin

Abstract

A method of manufacturing a LED lamp that is formed by sealing a LED element mounted on a substrate with glass, includes a mounting process for mounting the LED element on the substrate, a sealing member preparation process for preparing a glass sealing member that includes a concave portion being capable of housing the LED element, and a sealing process wherein the sealing member is arranged so that a forming surface of the concave portion faces the LED element, the sealing member is bonded to the substrate by thermal compression bonding, and the forming surface of the concave portion is made along the LED element.

Claims

1. A method of manufacturing a LED lamp that is formed by sealing a LED element mounted on a substrate with glass, comprising:

a mounting process for mounting the LED element on the substrate;

a sealing member preparation process for preparing a glass sealing member that includes a concave portion being capable of housing the LED element; and

a sealing process wherein the sealing member is arranged so that a forming surface of the concave portion faces the LED element, the sealing member is bonded to the substrate by thermal compression bonding, and the forming surface of the concave portion is made along the LED element.

2. The method of manufacturing a LED lamp according to claim 1, wherein the LED element is flip-chip mounted or face-up mounted in the mounting process.

3. The method of manufacturing a LED lamp according to claim 1, comprising:

a phosphor supply process for supplying phosphor to the vicinity of the LED element before the sealing process.

4. The method of manufacturing a LED lamp according to claim 1, comprising:

a reflective layer forming process for forming a reflective layer on a surface of the sealing member opposite to a substrate after the sealing process.

5. The method of manufacturing a LED lamp according to claim 1, wherein, in the sealing member preparation process, the forming surface of the concave portion comprises a substrate-facing surface that faces a side surface of the substrate;

and

in the sealing process, the substrate-facing surface faces the side surface of the substrate when the forming surface of the concave portion faces the LED element, and the substrate-facing surface is along the side surface of the substrate when the sealing member is bonded on the substrate side by the thermal compression.

6. The method of manufacturing a LED lamp according to claim 1, wherein a plurality of LED elements are mounted on the one substrate in the mounting process;

and

the method further comprises a separation process for separating the substrate after the mounting process.

7. The method of manufacturing a LED lamp according to claim 6, wherein each of the separated substrates is set to one lower die in a state that the substrates are isolated from each other in the sealing process.

8. The method of manufacturing a LED lamp according to claim 7, wherein each of the separated substrates is set to the lower die in a state that a spacer each intervenes therebetween in the sealing process.

9. The method of manufacturing a LED lamp according to claim 7, wherein each of the separated substrates is set in a substrate housing portion formed on the lower die in the sealing process;

and

the substrate housing portion is each formed for every separated substrate.

10. The method of manufacturing a LED lamp according to claim 6, wherein the sealing member is provided with a main body comprising the concave portion and a basal portion bonded to the substrate by thermal compression, and is an integrated object in that the main body is coupled to the basal portion;

and

the sealing member as the integrated object is set to a die.

11. The method of manufacturing a LED lamp according to claim 10, wherein an upper die for pressing the sealing member has a void portion at a portion thereof facing the basal portion of the sealing member.

12. The method of manufacturing a LED lamp according to claim 6, wherein the sealing member is provided with a main body comprising the concave portion and a basal portion bonded to the substrate by thermal compression;

and

the sealing member is set to a die for each of the separated substrate in a state that the basal portion is isolated.

13. The method of manufacturing a LED lamp according to claim 1, wherein a plurality of the LED elements are mounted on the one substrate in the mounting process;

the sealing member is provided with a main body comprising the concave portion and a basal portion bonded to the substrate by thermal compression; and

the sealing member is set to one die in a state that the basal portion is isolated.

14. The method of manufacturing a LED lamp according to claim 10, wherein the main body has a lens shape.

15. The method of manufacturing a LED lamp according to claim 1, wherein the sealing member is prevented from moving toward a surface direction of the substrate in the sealing process.

16. A die used for the method of manufacturing a LED lamp according to claim 15, comprising:

a restricting means for preventing the sealing member from moving toward the surface direction.

17. The die according to claim 16, wherein the restricting means comprises a convex portion provided on an upper or lower die.

18. The die according to claim 17, wherein a plurality of the LED elements are set to the lower die;

and

the convex portion is provided so as to surround each of the plurality of the LED elements.

19. The die according to claim 17, wherein a plurality of the LED elements are set to the lower die;

and

the convex portion is provided along a peripheral edge of the upper or lower die.

20. The die according to claim 16, wherein a contact avoidance portion for avoiding contact with a tip portion of the convex portion is formed in the sealing member.