CMP Pad Dressers with Hybridized Abrasive Surface and Related Methods

• US 20100248596A1
• Filed: 03/18/2010
• Published: 09/30/2010
• Est. Priority Date: 11/16/2006
• Status: Active Grant

• Current Assignee: Kinik Company
• Original Assignee: Kinik Company
• Inventors: Sung, Chien-Min
• Granted Patent: US 8,622,787 B2
• Time in Patent Office: Days
• US Class Current: 451/56
• CPC Class Codes: B24B 53/017 Devices or means for dressing, cleaning or otherwise conditioning lapping tools

Abstract

The present invention provides CMP pad dressers and methods for dressing or conditioning CMP pads. In one aspect, a method for conditioning a CMP pad can include cutting the CMP pad with superabrasive cutting elements and controlling a degree of contact between the CMP pad and the cutting elements using control elements. The degree of contact is established through placement of the control elements relative to the cutting elements.

Claims

1. A method for conditioning a CMP pad, comprising:

cutting the CMP pad with superabrasive cutting elements; and

controlling a degree of contact between the CMP pad and the cutting elements using control elements, wherein the degree of contact is established through placement of the control elements relative to the cutting elements.

2. The method of claim 1, wherein controlling the degree of contact includes alternating regions of cutting elements with regions of control elements.

3. The method of claim 2, wherein controlling the degree of contact includes locating the regions of control elements at a distance from the regions of cutting elements to establish the degree of contact in relation to material characteristics of the CMP pad.

4. The method of claim 2, wherein controlling the degree of contact includes locating the regions of control elements at a distance from the regions of cutting elements to affect a degree of compression of the CMP pad along a leading edge of the regions of cutting elements.

5. A CMP pad dresser, comprising:

an organic matrix;

a plurality of cutting elements partially embedded directly in the organic matrix, the cutting elements being arranged into a plurality of distinct cutting element regions;

a plurality of control elements partially embedded directly in the organic matrix, the control elements being arranged into a plurality of distinct control element regions; and

wherein the cutting element regions and the control element regions are positioned in an alternating pattern, and wherein the control element regions are spaced relative to the cutting element regions to control a degree of contact between the cutting elements and a CMP pad.

6. The CMP pad dresser of claim 5, wherein the organic matrix is coupled to a CMP pad dresser support substrate.

7. The CMP pad dresser of claim 5, wherein the cutting elements include a member selected from the group consisting of particle elements, blade elements, and combinations thereof.

8. The CMP pad dresser of claim 7, wherein at least a portion of the blade elements have a serrated cutting edge.

9. The CMP pad dresser of claim 7, wherein at least a portion of the blade elements have a flat cutting edge.

10. The CMP pad dresser of claim 7, wherein the control elements include a member selected from the group consisting of particle elements, blade elements, and combinations thereof.

11. The CMP pad dresser of claim 5, wherein each of the plurality of cutting elements and each of the plurality of control elements includes a CMP pad contact region, and wherein the contact regions are leveled relative to one another such that no contact region protrudes above another contact region by more than about 30 microns.

12. The CMP pad dresser of claim 5, wherein the control elements are made of a member selected from the group consisting of single crystal diamond, polycrystalline diamond, and combinations thereof.

13. The CMP pad dresser of claim 5, wherein the cutting elements are made of a member selected from the group consisting of single crystal diamond, polycrystalline diamond, and combinations thereof.

14. The CMP pad dresser of claim 5, wherein the alternating pattern includes single blade elements alternating between regions of particle elements.

15. The CMP pad dresser of claim 5, wherein the alternating pattern includes groups of two or more blade elements alternating between regions of particle elements.

16. The CMP pad dresser of claim 5, wherein the organic matrix includes a member selected from the group consisting of amino resins, acrylate resins, alkyd resins, polyester resins, polyamide resins, polyimide resins, polyurethane resins, phenolic resins, phenolic/latex resins, epoxy resins, isocyanate resins, isocyanurate resins, polysiloxane resins, reactive vinyl resins, polyethylene resins, polypropylene resins, polystyrene resins, phenoxy resins, perylene resins, polysulfone resins, acrylonitrile-butadiene-styrene resins, acrylic resins, polycarbonate resins, polyimide resins, and combinations thereof.

17. The CMP pad dresser of claim 16, wherein the organic matrix is an epoxy resin.

18. The CMP pad dresser of claim 16, wherein the organic matrix is a polyimide resin.

19. The CMP pad dresser of claim 16, wherein the organic matrix is a polyurethane resin.