ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD HAVING THE SAME

• US 20100252320A1
• Filed: 12/30/2009
• Published: 10/07/2010
• Est. Priority Date: 04/07/2009
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Kim, Young Soo, Kim, Yoon Jung, CHO, Won Woo, Kim, Hyung Ho, Yang, Dek Gin, Chong, Myung Gun
• Granted Patent: US 8,399,777 B2
• Time in Patent Office: Days
• US Class Current: 174/377
• CPC Class Codes: H05K 1/0236 Electromagnetic band-gap structures
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/09309 Core having two or more power planes; Capacitive laminate of two power planes
• CPC Class Codes: H05K 2201/09627 Special connections between adjacent vias, not for grounding vias redundant conductors or connections H05K2201/0979

Abstract

Disclosed herein are an electromagnetic bandgap structure and a printed circuit board having the same. The bandgap structure includes a conductive layer including a plurality of conductive plates, a first metal layer disposed under the conductive layer and including a first stitching pattern electrically connected to a first conductive plate of the plurality of conductive plates, and a second metal layer disposed under the first metal layer and including a second stitching pattern electrically connected to both the first stitching pattern and a second conductive plate of the plurality of conductive plates. The bandgap to structure includes stitching patterns formed in two layers different from the conductive layer, thus offering a stop-band having a desired bandwidth in a compact structure.

Claims

1. An electromagnetic bandgap structure comprising:

a conductive layer including a plurality of conductive plates;

a first metal layer disposed under the conductive layer and including a first stitching pattern electrically connected to a first conductive plate of the plurality of conductive plates; and

a second metal layer disposed under the first metal layer and including a second stitching pattern electrically connected to both the first stitching pattern and a second conductive plate of the plurality of conductive plates.

2. The electromagnetic bandgap structure according to claim 1, wherein the first stitching pattern includes a pattern part having a spiral shape, a staggered shape or a curved horseshoe shape.

3. The electromagnetic bandgap structure according to claim 1, wherein the second stitching pattern includes a pattern part having a spiral shape, a staggered shape or a curved horseshoe shape.

4. The electromagnetic bandgap structure according to claim 1, further comprising:

a first dielectric layer disposed between the conductive layer and the first metal layer;

a second dielectric layer disposed between the first metal layer and the second metal layer;

a first via penetrating through the first dielectric layer so as to form an electrical connection between the first conductive plate and the first stitching pattern;

a second via penetrating through the second dielectric layer so as to form an electrical connection between the first stitching pattern and the second stitching pattern; and

a third via penetrating through the first and second dielectric layers so as to form an electrical connection between the second conductive plate and the second stitching pattern.

5. The electromagnetic bandgap structure according to claim 1, wherein the conductive layer includes a peripheral part surrounding the plurality of conductive plates with clearances formed therebetween.

6. The electromagnetic bandgap structure according to claim 1, wherein the first metal layer includes a first peripheral part surrounding the first stitching pattern with clearances formed therebetween.

7. The electromagnetic bandgap structure according to claim 1, wherein the second metal layer includes a second peripheral part surrounding the second stitching pattern with clearances formed therebetween.

8. The electromagnetic bandgap structure according to claim 1, wherein the plurality of conductive plates is electrically connected to each other through the first and second stitching patterns.

9. The electromagnetic bandgap structure according to claim 1, wherein the conductive layer is a power layer or a ground layer.

10. The electromagnetic bandgap structure according to claim 5, wherein the peripheral part is electrically connected to the plurality of conductive plates.

11. An electromagnetic bandgap structure comprising:

a plurality of conductive plates; and

a stitching via including a first stitching pattern disposed under the plurality of conductive plates and electrically connected to a first conductive plate of the plurality of conductive plates, and a second stitching pattern disposed under the first stitching pattern and electrically connected to both the first stitching pattern and a second conductive plate of the plurality of conductive plates, so as to connect the first conductive plate to the second conductive plate.

12. An electromagnetic bandgap structure comprising:

a plurality of conductive plates; and

a stitching via formed in two metal layers different from the plurality of conductive plates so as to connect the plurality of conductive plates to each other.

13. A printed circuit board comprising:

two electronic circuits with different operating frequencies; and

an electromagnetic bandgap structure comprising;

a plurality of conductive plates; and

a stitching via including a first stitching pattern disposed under the plurality of conductive plates and electrically connected to a first conductive plate of the plurality of conductive plates, and a second stitching pattern disposed under the first stitching pattern and electrically connected to both the first stitching pattern and a second conductive plate of the plurality of conductive plates, so as to connect the first conductive plate to the second conductive plate.