PACKAGE OF ENVIRONMENTALLY SENSITIVE ELECTRONIC DEVICE AND FABRICATING METHOD THEREOF

• US 20100258346A1
• Filed: 06/19/2009
• Published: 10/14/2010
• Est. Priority Date: 04/10/2009
• Status: Active Grant

• Current Assignee: HannStar Display Corporation
• Original Assignee: Industrial Technology Research Institute
• Inventors: Ho, Jia-Chong, Yeh, Shu-Tang, Chen, Kuang-Jung, Yan, Jing-Yi
• Granted Patent: US 8,093,512 B2
• Time in Patent Office: Days
• US Class Current: 174/521
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 23/293 Organic, e.g. plastic
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/564 Details not otherwise provided for, e.g. protection against moisture getters H01L23/26
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H10K 2102/311 Flexible OLED
• CPC Class Codes: H10K 50/8423 Metallic sealing arrangements
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 50/8428 Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
• CPC Class Codes: H10K 59/8721 Metallic sealing arrangements
• CPC Class Codes: H10K 59/8722 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/8723 Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

A package of an environmentally sensitive electronic device including a first substrate, a second substrate, an environmentally sensitive electronic device, a plurality of barrier structures, and a fill is provided. The second substrate is disposed above the first substrate. The environmentally sensitive electronic device is disposed on the first substrate and located between the first substrate and the second substrate. The barrier structures are disposed between the first substrate and the second substrate, wherein the barrier structures surround the environmental sensitive electronic device, and the water vapor transmission rate of the barrier structures is less than 10⁻¹ g/m²/day. The fill is disposed between the first substrate and the second substrate and covers the environmentally sensitive electronic device and the barrier structures.

Claims

1. A package of an environmentally sensitive electronic device, the package comprising:

a first substrate;

a second substrate disposed over the first substrate;

an environmentally sensitive electronic device disposed on the first substrate and sandwiched between the first substrate and the second substrate;

a plurality of side wall barrier structures disposed between the first substrate and the second substrate, wherein the barrier structures surround the environmentally sensitive electronic device, and a water vapor transmission rate of the barrier structures is less than 10<sup>−

1</sup> g/m²/day; and

a fill disposed between the first substrate and the second substrate, wherein the filler covers the environmentally sensitive electronic device and the side wall barrier structures.

2. The package of the environmentally sensitive electronic device as claimed in claim 1, wherein each of the side wall barrier structures comprises:

a rib disposed on the first substrate or the second substrate; and

a barrier layer covering the rib, wherein the fill covers the barrier layer.

3. The package of the environmentally sensitive electronic device as claimed in claim 2, wherein the ribs are disposed on the first substrate and are spaced at equidistant intervals.

4. The package of the environmentally sensitive electronic device as claimed in claim 2, wherein the ribs are disposed on the second substrate and are spaced at equidistant intervals.

5. The package of the environmentally sensitive electronic device as claimed in claim 2, wherein the ribs comprise:

a plurality of first ribs disposed on the first substrate; and

a plurality of second ribs disposed on the second substrate, wherein the first ribs and the second ribs are alternately arranged.

6. The package of the environmentally sensitive electronic device as claimed in claim 2, wherein a smallest cross-sectional shape of the ribs comprises a trapezoidal shape, a triangular shape, or a rectangular shape.

7. The package of the environmentally sensitive electronic device as claimed in claim 2, wherein a smallest cross-sectional shape of the ribs comprises a bullet shape, and the bullet shape includes a rectangular portion and a rounding portion connected to an upper planar region of the rectangular portion.

8. The package of the environmentally sensitive electronic device as claimed in claim 2, wherein a material of the ribs comprises organic polymer materials or organic-inorganic hybrid materials.

9. The package of the environmentally sensitive electronic device as claimed in claim 2, wherein a material of the barrier layers comprises a metallic material.

10. The package of the environmentally sensitive electronic device as claimed in claim 9, wherein the metallic material comprises molybdenum, titanium, aluminum, chromium, molybdenum/aluminum/molybdenum, or titanium/aluminum/titanium.

11. The package of the environmentally sensitive electronic device as claimed in claim 2, wherein a material of the barrier layers comprises an inorganic material.

12. The package of the environmentally sensitive electronic device as claimed in claim 11, wherein the inorganic material comprises silicon oxide, silicon nitride, silicon oxynitride, or aluminum oxide.

13. The package of the environmentally sensitive electronic device as claimed in claim 1, wherein the environmentally sensitive electronic device comprises an active environmentally sensitive electronic display device or a passive environmentally sensitive electronic display device.

14. The package of the environmentally sensitive electronic device as claimed in claim 1, wherein the first substrate comprises a flexible substrate or a rigid substrate.

15. The package of the environmentally sensitive electronic device as claimed in claim 1, wherein the second substrate comprises a flexible substrate or a rigid substrate.

16. The package of the environmentally sensitive electronic device as claimed in claim 1, wherein the water vapor transmission rate of the side wall barrier structures is less than 10⁻

2 g/m²/day.

17. A method of packaging an environmentally sensitive electronic device, comprising:

forming an environmentally sensitive electronic device on a first substrate;

forming a plurality of barrier structures on the first substrate or on the second substrate, wherein the side wall barrier structures surround the environmentally sensitive electronic device, and the water vapor transmission rate of the side wall barrier structures is less than 10<sup>−

1</sup> g/m²/day.

forming a fill on the first substrate to cover the environmentally sensitive electronic device and the side wall barrier structures; and

pressing the second substrate on the fill.

18. The method of packaging the environmentally sensitive electronic device as claimed in claim 17, wherein a method of forming the side wall barrier structures comprises:

forming a plurality of ribs on the first substrate or the second substrate; and

forming a plurality of barrier layers to cover the ribs.

19. The method of packaging the environmentally sensitive electronic device as claimed in claim 18, wherein a method of forming the side wall barrier structures comprises:

forming a plurality of first ribs on the first substrate; and

forming a plurality of second ribs on the second substrate, wherein the first ribs and the second ribs are alternately arranged.

20. The method of packaging the environmentally sensitive electronic device as claimed in claim 17, wherein the side wall barrier structures are pressed through an alignment roller or a frame press process after pressing the second substrate on the fill, such that the barrier structures are in contact with the first substrate or the second substrate.

21. The method of packaging environmentally sensitive electronic device as claimed in claim 17, wherein a method of forming the fill comprises:

forming a glue on the first substrate to cover the environmentally sensitive electronic device and the side wall barrier structures.

22. The method of packaging the environmentally sensitive electronic device as claimed in claim 21, further comprising curing the glue to form the fill after forming the glue on the first substrate.

23. The method of packaging the environmentally sensitive electronic device as claimed in claim 22, wherein the glue is solidified by ultraviolet curing or thermal curing.

24. The method of packaging the environmentally sensitive electronic device as claimed in claim 17, wherein a method of forming the fill comprises adhering a double-sided tape onto the first substrate to cover the environmentally sensitive electronic device and the side wall barrier structures.

25. The method of packaging the environmentally sensitive electronic device as claimed in claim 17, wherein the water vapor transmission rate of the side wall barrier structures is less than 10⁻

2 g/m²/day.