ELECTRONIC COMPONENT MODULE

• US 20100265663A1
• Filed: 04/02/2010
• Published: 10/21/2010
• Est. Priority Date: 04/21/2009
• Status: Active Grant

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Murakami, Masahiro, YAMASHITA, Mitsuyoshi, Kushino, Masahiko, Amano, Yoshihisa, Deguchi, Akiteru
• Granted Patent: US 8,179,678 B2
• Time in Patent Office: Days
• US Class Current: 361/715
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H05K 1/0243 Printed circuits associated with mounted high frequency components
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/10371 Shields or metal cases
• CPC Class Codes: H05K 2201/10522 Adjacent components
• CPC Class Codes: H05K 9/006 specially adapted for signal processing applications, e.g. CATV, tuner, antennas amplifier

Abstract

Provided is an electronic component module which has high reliability and is capable of suppressing reduction in handling performance of a mounting machine. An electronic component module includes a plurality of electronic components mounted on a top surface of a module substrate, a planar top plate covering the electronic components, and a top plate holding member for holding the top plate. The plurality of electronic components include a quartz resonator, and a RF-IC which has a height smaller than that of the quartz resonator and is disposed on the top surface of the module substrate so as to be side by side with the quartz resonator. In addition, the top plate is fixed to the quartz resonator, and the top plate holding member for holding the top plate is disposed between the RF-IC and the top plate.

Claims

1. An electronic component module comprising:

a first electronic component which is disposed on a top surface of a substrate;

a second electronic component which has a height lower than that of the first electronic component and is disposed on the top surface of the substrate so as to be side by side with the first electronic component;

a planar top plate which is fixed to the first electronic component so as to cover the first electronic component and the second electronic component; and

a top plate holding member which is disposed between the second electronic component and the top plate so as to hold the top plate.

2. An electronic component module according to claim 1, wherein a thickness of the top plate holding member is substantially equal to a difference between the height of the first electronic component and the height of the second electronic component.

3. An electronic component module according to claim 1, wherein the second electronic component is a mount component including an integrated circuit element.

4. An electronic component module according to claim 1, wherein the second electronic component is a mount component including a high frequency integrated circuit element, and the top plate holding member is made of an electromagnetic shield material.

5. An electronic component module according to claim 1, wherein the second electronic component is a heat generating component which generates heat by being driven, and the top plate holding member is made of a thermal conductive material.

6. An electronic component module according to claim 1, wherein the top plate holding member is made of a metal material.

7. An electronic component module according to claim 1, wherein the top plate holding member is made of a resin material including a thermal conductive resin or an electrically conductive resin.

8. An electronic component module according to claim 7, wherein the resin material forming the top plate holding member contains a thermosetting resin.

9. An electronic component module according to claim 1, wherein the top plate is made of metal plate.

10. An electronic component module according to claim 1, wherein the top plate is constituted of resin insulating plate.

11. An electronic component module according to claim 1, wherein the top plate has a composite structure including an insulating base material portion, and an electrically conductive foil formed on the base material portion.

12. An electronic component module according to claim 11, wherein the base material portion of the top plate is made of a glass epoxy material, and the electrically conductive foil of the top plate is made of copper foil.

13. An electronic component module according to claim 11, wherein the electrically conductive foil has a flat surface area smaller than that of the base material portion, and the electrically conductive foil is disposed so that an outer edge of the electrically conductive foil is inside an outer edge of the base material portion in a plan view.

14. An electronic component module according to claim 11, wherein the top plate further includes an insulating member which covers the electrically conductive foil.

15. An electronic component module according to claim 14, wherein the insulating member has an opening portion which exposes a part of the electrically conductive foil.

16. An electronic component module according to claim 15, wherein the top plate is adapted so that the opening portion is disposed on the opposite side to the substrate.

17. An electronic component module according to claim 1, further comprising an elastic member having an elastic function disposed between the top plate and the electronic component, and the top plate is fixed to the first electronic component via the elastic member.

18. An electronic component module according to claim 17, wherein the elastic member is formed in a sheet-like shape having a predetermined thickness and is fixed to the top plate in advance.

19. An electronic component module according to claim 17, wherein the elastic member is made of an epoxy resin having low elasticity.

20. An electronic component module according to claim 1, wherein the top plate has a flat surface area smaller than that of the substrate, and the top plate is disposed so that an outer edge of the top plate is inside an outer edge of the substrate.