METHODS AND ARRANGEMENTS FOR MANAGING PLASMA CONFINEMENT
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Accused Products
Abstract
A method for confining plasma within a plasma processing chamber while processing a substrate is provided. The method includes igniting the plasma within a plasma generating area, wherein the plasma generating area is surrounded by a set of confinement rings. The method also includes providing a chamber wall outside of the set of confinement rings. The method further includes providing a dielectric liner electrode arrangement positioned between the chamber wall and the set of confinement rings, wherein the dielectric liner electrode arrangement having an electrode encapsulated within a dielectric liner, the dielectric liner electrode arrangement being coupled with the chamber wall to create a modified chamber wall. The method yet also includes providing a parallel LC circuit arrangement, the parallel LC circuit arrangement being coupled between the dielectric liner electrode arrangement and the chamber wall.
24 Citations
45 Claims
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1-25. -25. (canceled)
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26. A method for confining plasma within a plasma processing chamber while processing a substrate, comprising:
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igniting said plasma within a plasma generating area, wherein said plasma generating area is surrounded by a set of confinement rings; providing a chamber wall outside of said set of confinement rings; providing a dielectric liner electrode arrangement positioned between said chamber wall and said set of confinement rings, wherein said dielectric liner electrode arrangement having an electrode encapsulated within a dielectric liner, said dielectric liner electrode arrangement being coupled with said chamber wall to create a modified chamber wall; and providing a parallel LC circuit arrangement, said parallel LC circuit arrangement being coupled between said dielectric liner electrode arrangement and said chamber wall. - View Dependent Claims (27, 28, 29, 30, 31, 32, 33, 34, 35)
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36. An arrangement for confining plasma in a plasma processing chamber, comprising:
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a set of confinement rings, wherein said plasma is formed within an area surrounded by said set of confinement rings; a chamber wall outside of said set of confinement rings; a dielectric liner electrode arrangement positioned between said chamber wall and said set of confinement rings, wherein said dielectric liner electrode arrangement having an electrode encapsulated within a dielectric liner, said dielectric liner electrode arrangement being coupled with said chamber wall to create a modified chamber wall; and a parallel LC circuit arrangement, said parallel LC circuit arrangement being coupled between said dielectric liner electrode arrangement and said chamber wall; and a lower electrode coupled to an RF power source configured to generate said plasma. - View Dependent Claims (37, 38, 39, 40, 41, 42, 43, 44, 45)
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Specification