SEALANT COMPOSITION

• US 20100280143A1
• Filed: 08/25/2009
• Published: 11/04/2010
• Est. Priority Date: 05/01/2009
• Status: Active Grant

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Liu, Pei-Ching, Jeng, Jauder, Chen, Man-Lin, Shieh, Tien-Shou
• Granted Patent: US 8,193,258 B2
• Time in Patent Office: Days
• US Class Current: 522/40
• CPC Class Codes: C08G 59/186 with acids
• CPC Class Codes: C08G 59/5073 having two nitrogen atoms in the ring
• CPC Class Codes: C08K 5/07 Aldehydes; Ketones
• CPC Class Codes: C08K 5/5397 Phosphine oxides
• CPC Class Codes: C08L 2666/22 Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
• CPC Class Codes: C08L 63/10 Epoxy resins modified by unsaturated compounds
• CPC Class Codes: C09J 163/10 Epoxy resins modified by unsaturated compounds

Abstract

A sealant composition is provided. The sealant composition includes (a) an oligomer including an unsaturated mono-carboxylic acid modified bisphenol A epoxy resin and an unsaturated mono-carboxylic acid modified bisphenol F epoxy resin, wherein an equivalence ratio of the bisphenol A epoxy resin to the bisphenol F epoxy resin is 0.05:0.95 to 0.3:0.7, the bisphenol A epoxy resin has a melting point higher than 40° C. and the bisphenol F epoxy resin has a melting point lower than 40° C.; (b) an epoxy resin having at least two or more than two epoxy groups; and (c) a photoinitiator.

Claims

1. A sealant composition, comprising:

(a) an oligomer, including an unsaturated mono-carboxylic acid modified bisphenol A epoxy resin and an unsaturated mono-carboxylic acid modified bisphenol F epoxy resin, wherein the sealant composition to the bisphenol F epoxy resin has an equivalence ratio of 0.05;

0.95 to 0.3;

0.7, and the bisphenol A epoxy resin has a melting point higher than 40°

C. and the bisphenol F epoxy resin has a melting point lower than 40°

C.;

(b) an epoxy resin, containing at least two or more than two epoxy groups; and

(c) a photoinitiator.

2. The sealant composition as claimed in claim 1, wherein the bisphenol A epoxy resin has an epoxy equivalent value of 450 to 600.

3. The sealant composition as claimed in claim 1, wherein the bisphenol F epoxy resin has an epoxy equivalent value of 150 to 300.

4. The sealant composition as claimed in claim 1, wherein the unsaturated mono-carboxylic acid comprises acrylic acid, methylacrylic acid, styrene-acrylic acid, furylacrylic acid, crotonic acid or cyano cinnamic acid.

5. The sealant composition as claimed in claim 1, wherein the unsaturated mono-carboxylic acid to the sum of the bisphenol A epoxy resin and the bisphenol F epoxy resin has an equivalence ratio of 1.1:

1.

6. The sealant composition as claimed in claim 1, wherein the epoxy resin containing at least two or more than two epoxy groups comprises bisphenol A epoxy resin or derivatives thereof, bisphenol F epoxy resin or derivatives thereof, phenolic epoxy resin, naphthalene epoxy resin, aliphatic epoxy resin or cycloaliphatic epoxy resin.

7. The sealant composition as claimed in claim 1, wherein the photoinitiator comprises α

-benzoin compound or derivatives thereof, or bis acyl phosphine compound or derivatives thereof.

8. The sealant composition as claimed in claim 1, wherein the oligomer is 100 parts by weight, the epoxy resin containing at least two or more than two epoxy groups is 20 to 60 parts by weight, the photoinitiator is 2 to 10 parts by weight.

9. The sealant composition as claimed in claim 1, further comprising a thermal curing agent.

10. The sealant composition as claimed in claim 9, wherein the thermal curing agent is 1 to 10 parts by weight based on 100 parts by weight of the oligomer.

11. The sealant composition as claimed in claim 9, wherein the thermal curing agent comprises a derivative of a bi-nitrogen epoxy compound.

12. The sealant composition as claimed in claim 11, wherein the derivative of bi-nitrogen epoxy compound comprises 2-phenylimidazole, 2-methylimidazole, 2-undecylimidazole, 2-undecyl-4,5-diformylimidazole, 2-heptadecylimidazole, 2-n-butyl-4,5-diformylimidazole, 2-phenyl-4-thiocarbamoyl-imidazole, 2-ethyl-imidazole, 2-n-propyl-imidazole, 2-n-butyl-imidazole, 2-ethyl-4-methylimidazole, 1-methylimidazole, 1-methyl-2-ethylimidazole, 1-benzyl-imidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 2-methylimidazoline or 2-phenylimidazoline.

13. The sealant composition as claimed in claim 9, wherein the thermal curing agent has a melting point of 60 to 100°

C.

14. The sealant composition as claimed in claim 1, further comprising an acrylic functional group-containing monomer.

15. The sealant composition as claimed in claim 14, wherein the acrylic functional group-containing monomer is 5 to 30 parts by weight based on 100 parts by weight of the oligomer.

16. The sealant composition as claimed in claim 14, wherein the acrylic functional group-containing monomer comprises a mono-functional group, a bi-functional group, a tri-functional group or a multi-functional group acrylic monomer.

17. The sealant composition as claimed in claim 1, further comprising a filler.

18. The sealant composition as claimed in claim 17, wherein the filler is 10 to 50 parts by weight based on 100 parts by weight of the oligomer.

19. The sealant composition as claimed in claim 17, wherein the filler comprises silicon dioxide, talc, aluminum oxide or clay.

20. The sealant composition as claimed in claim 1, further comprising a silane coupling agent.

21. The sealant composition as claimed in claim 20, wherein the silane coupling agent is 2 to 10 parts by weight based on 100 parts by weight of the oligomer.