CHIP COATED LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF

• US 20100289051A1
• Filed: 07/23/2010
• Published: 11/18/2010
• Est. Priority Date: 01/10/2006
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung LED Co., Ltd. (Samsung Electronics Co. Ltd.)
• Inventors: LEE, Seon Goo, Han, Kyung Taeg, Han, Seong Yeon
• Granted Patent: US 8,324,646 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 33/508 having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.

Claims

1. A chip coated Light Emitting Diode (LED) package comprising:

a light emitting chip including a chip die attached to a submount and a resin layer covering an outer surface of the chip die;

at least one bump ball provided on the chip die and exposed through an upper surface of the resin layer and an electrode part electrically connected to the at least one bump ball by a metal wire; and

a package body having the electrode part and the light emitting chip mounted thereon.

2. The chip coated LED package according to claim 1, wherein the resin layer contains a fluorescent material for converting the wavelength of light generated from the chip die.

3. The chip coated LED package according to claim 1, wherein the electrode part comprises a lead frame integrally provided to the package body.

4. The chip coated LED package according to claim 1, wherein the package body comprises a resin structure which is injection molded with resin to have a cavity formed therein, the cavity for exposing the electrode part with the light emitting chip mounted thereon.

5. The chip coated LED package according to claim 4, wherein the cavity comprises a reflecting part formed on an inner surface thereof for reflecting the light generated from the light emitting chip.

6. The chip coated LED package according to claim 4, wherein the cavity comprises a filler made of transparent resin filled therein and the package body further comprises a lens provided on an upper part thereof.

7. The chip coated LED package according to claim 1, wherein the package body has a disposition hole formed therein, the disposition hole exposing a metallic chassis with the light emitting chip mounted thereon, and the package body comprises a substrate having the electrode part pattern-printed on an upper surface thereof.

8. The chip coated LED package according to claim 7, wherein the disposition hole comprises a reflecting part formed on an inner surface thereof for reflecting the light generated from the light emitting chip.

9. The chip coated LED package according to claim 7, wherein the disposition hole comprises a filler made of transparent resin filled therein and the package body further comprises a lens provided on an upper part thereof.

10. A method of manufacturing a chip coated Light Emitting Diode (LED) package comprising:

die-attaching a plurality of chip dies on a wafer;

providing at least one bump ball on an upper surface of each of the chip dies;

forming a resin layer to cover the chip dies including the bump balls;

polishing an upper surface of the resin layer to expose the bump balls; and

cutting the wafer and the resin layer between the chip dies into individual light emitting chips.

11. The method according to claim 10, wherein the step of forming a resin layer comprises printing a resin material on the wafer to cover the chip dies including the bump balls and thermally curing the printed resin layer.

12. The method according to claim 10, wherein the resin layer is made of a resin material containing a fluorescent material for converting the wavelength of light generated from the chip dies.

13. The method according to claim 10, further comprising:

mounting each of the light emitting chips comprising the chip die mounted on a submount and the resin layer covering an outer surface of the chip die on an electrode part of a package body formed by injection molding to have an upward-opening cavity, and wire bonding the light emitting chip with the electrode part comprising a lead frame by a metal wire.

14. The method according to claim 10, further comprising:

mounting each of the light emitting chips comprising a chip die mounted on a submount and a resin layer covering an outer surface of the chip die on an upper surface of a metallic chassis, and wire bonding the light emitting chip with the electrode part comprising an electrode pattern formed on an upper surface of the package body having a disposition hole formed therein, the disposition hole exposing the light emitting diode chip, by a metal wire.