ENCAPSULATED ELECTROMECHANICAL DEVICES

• US 20100290102A1
• Filed: 07/27/2010
• Published: 11/18/2010
• Est. Priority Date: 07/17/2008
• Status: Active Grant

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Qualcomm MEMS Technologies Incorporated (Qualcomm, Inc.)
• Inventors: Lan, Je-Hsiung
• Granted Patent: US 8,988,760 B2
• Time in Patent Office: Days
• US Class Current: 359/290
• CPC Class Codes: B81B 2201/047 Optical MEMS not provided for in B81B2201/042 - B81B2201/045
• CPC Class Codes: B81B 2207/095 through the lid
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: B81C 2203/0136 Growing or depositing of a covering layer
• CPC Class Codes: B81C 2203/0145 Hermetically sealing an opening in the lid

Abstract

Encapsulation is provided to electromechanical devices to protect the devices from such environmental hazards as moisture and mechanical shock. In addition to the encapsulation layer providing protection from environmental hazards, the encapsulation layer is additionally planarized so as to function as a substrate for additional circuit elements formed above the encapsulation layer.

Claims

1. An electromechanical device, comprising:

a substrate;

an electromechanical element on the substrate, the electromechanical element comprising a movable component;

a layer encapsulating the electromechanical element, wherein the layer is planarized; and

an electronic element on or over the layer.

2. The electromechanical device of claim 1, wherein the electronic element comprises an active device.

3. The electromechanical device of claim 1, wherein the electronic element comprises a passive device.

4. The electromechanical device of claim 1, wherein the electronic element comprises display driver circuitry.

5. The electromechanical device of claim 1, wherein the electronic element comprises sense circuitry.

6. The electromechanical device of claim 1, wherein the electronic element comprises digital signal processing functions.

7. The electromechanical device of claim 6, wherein the digital signal processing functions comprises data filtering.

8. The electromechanical device of claim 6, wherein the digital signal processing functions comprises control information decoding.

9. The electromechanical device of claim 1, wherein the electronic element comprises a variable element.

10. The electromechanical device of claim 9, wherein the variable element is a variable resistor.

11. The electromechanical device of claim 9, wherein the variable element is a variable capacitor.

12. The electromechanical device of claim 1, wherein the electronic element further comprises ESD protection.

13. The electromechanical device of claim 1, wherein the electronic element further comprises EM shielding.

14. The electromechanical device of claim 1, wherein the electronic element further comprises interconnect routing.

15. The electromechanical device of claim 1, wherein the electronic element comprises RF functions.

16. The electromechanical device of claim 15, wherein the RF functions comprise an antenna and a power amp.

17. The electromechanical device of claim 15, wherein the RF functions comprises data converters.

18. The electromechanical device of claim 1, wherein the electronic element comprises a thin film transistor.

19. The electromechanical device of claim 1, wherein the electronic element provides a means for electrically communicating with the electromechanical element.