SILICON MICROPHONE PACKAGE

• US 20100303271A1
• Filed: 05/25/2010
• Published: 12/02/2010
• Est. Priority Date: 05/29/2009
• Status: Active Grant

• Current Assignee: Neomems Technologies, Inc.
• Original Assignee: General Motors Corporation (Motors Liquidation Co. GUC Trust)
• Inventors: Wang, Yunlong
• Granted Patent: US 8,571,249 B2
• Time in Patent Office: Days
• US Class Current: 381/355
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 31/00 Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182

Abstract

A silicon microphone package is provided, including an integrated microphone die having opposing first and second surfaces, a first cover member formed over the first surface of the integrated microphone die to form a first chamber therebetween, and a second cover member formed over the second surface of the integrated microphone die to form a second chamber therebetween.

Claims

1. A silicon microphone package, comprising:

an integrated microphone die having opposing first and second surfaces;

a first cover member formed over the first surface of the integrated microphone die, forming a first chamber therebetween; and

a second cover member formed over the second surface of the integrated microphone die, forming a second chamber therebetween.

2. The silicon microphone package as claimed in claim 1, wherein the first and second cover members respectively comprise an enclosed conductive ring disposed around an edge portion of a surface thereof, contacting the first surface or the second surface of the integrated microphone die.

3. The silicon microphone package as claimed in claim 2, wherein the first cover member comprises a conductive layer electrically contacting the enclosed conductive ring.

4. The silicon microphone package as claimed in claim 2, wherein the second cover member comprises a conductive layer electrically contacting the enclosed conducive ring.

5. The silicon microphone package as claimed in claim 1, wherein the first cover member or the second cover member comprises an acoustic opening, and the integrated microphone die comprises an acoustic sensing element, wherein the acoustic opening allows acoustic waves to pass therethrough and contact the acoustic sensing element.

6. The silicon microphone package as claimed in claim 1, wherein the integrated microphone die comprise a cavity formed therein, and the cavity contacts one of the first and second chambers.

7. The silicon microphone package as claimed in claim 2, wherein the integrated microphone die comprises a continuous interconnect structure disposed around an edge portion of the integrated microphone die.

8. The silicon microphone package as claimed in claim 1, further comprising a solder pad formed over a surface of the first or second cover member not facing the integrated microphone die for surface mounting.

9. A silicon microphone package, comprising:

an integrated microphone die having opposing first and second surfaces, wherein the integrated microphone die comprises an acoustic sensing element and a cavity;

a first cover member formed over the first surface of the integrated microphone die, forming a first chamber therebetween;

an acoustic opening formed in a portion of the first cover member, partially exposing the integrated microphone die; and

a second cover member formed over the second surface of the integrated microphone die, forming a second chamber therebetween, wherein the second chamber contacts the cavity of the integrated microphone die.

10. The silicon microphone package as claimed in claim 9, wherein the first and second cover members respectively comprise an enclosed conductive ring disposed around an edge portion of a surface thereof, contacting the first surface or the second surface of the integrated microphone die.

11. The silicon microphone package as claimed in claim 10, wherein the first cover member comprises a conductive layer electrically contacting the enclosed conductive ring.

12. The silicon microphone package as claimed in claim 10, wherein the second cover member comprises a conductive layer electrically contacting the enclosed conducive ring.

13. The silicon microphone package as claimed in claim 9, wherein the acoustic opening allows acoustic waves to contact the acoustic sensing element.

14. The silicon microphone package as claimed in claim 10, wherein the integrated microphone die comprises a continuous interconnect structure disposed around an edge portion of the integrated microphone die.

15. The silicon microphone package as claimed in claim 9, further comprising a solder pad formed over a surface of the first cover member not facing the integrated microphone die for surface mounting.

16. The silicon microphone package as claimed in claim 9, wherein the acoustic sensing element comprises a membrane and a perforated member with perforation holes therein.

17. The silicon microphone package as claimed in claim 16, wherein the perforated member with perforation holes therein is disposed in a location that is close to the acoustic opening.

18. The silicon microphone package as claimed in claim 16, wherein the membrane is disposed in a location that is close to the acoustic opening.

19. A silicon microphone package, comprising:

an integrated microphone die having opposing first and second surfaces, wherein the integrated microphone die comprises an acoustic sensing element and a cavity;

a first cover member formed over the first surface of the integrated microphone die, forming a first chamber therebetween;

a second cover member formed over the second surface of the integrated microphone die, forming a second chamber therebetween, wherein the second chamber contacts the cavity of the integrated microphone die; and

an acoustic opening formed in a portion of the second cover member, partially exposing the integrated microphone die.

20. The silicon microphone package as claimed in claim 19, wherein the first and second cover members respectively comprise an enclosed conductive ring disposed around an edge portion of a surface thereof, contacting the first surface or the second surface of the integrated microphone die.

21. The silicon microphone package as claimed in claim 19, wherein the first cover member comprises a conductive layer electrically contacting the enclosed conductive ring.

22. The silicon microphone package as claimed in claim 19, wherein the second cover member comprises a conductive layer electrically contacting the enclosed conducive ring.

23. The silicon microphone package as claimed in claim 19, wherein the acoustic opening allows acoustic waves through the cavity to contact the acoustic sensing element.

24. The silicon microphone package as claimed in claim 20, wherein the integrated microphone die comprises a continuous interconnect structure disposed around an edge portion of the integrated microphone die.

25. The silicon microphone package as claimed in claim 19, further comprising a solder pad formed over a surface of the first cover member not facing the integrated microphone die for surface mounting.

26. The silicon microphone package as claimed in claim 19, wherein the acoustic sensing element comprises a membrane and a perforated member with perforation holes therein.

27. The silicon microphone package as claimed in claim 26, wherein the perforated member with perforation holes therein is disposed in a location that is close to the cavity and the acoustic opening.

28. The silicon microphone package as claimed in claim 26, wherein the membrane is disposed in a location that is close to the cavity and the acoustic opening.