METHOD AND SYSTEM FOR CONFIGURING A LEAKY WAVE ANTENNA UTILIZING MICRO-ELECTRO MECHANICAL SYSTEMS

• US 20100309072A1
• Filed: 03/31/2010
• Published: 12/09/2010
• Est. Priority Date: 06/09/2009
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Rofougaran, Ahmadreza
• Granted Patent: US 9,088,075 B2
• Time in Patent Office: Days
• US Class Current: 343/772
• CPC Class Codes: G01S 13/06 Systems determining position data of a target
• CPC Class Codes: G06K 7/10316 using at least one antenna particularly designed for interrogating the wireless record carriers antennas in general H01Q1/22
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 13/20 Non-resonant leaky-waveguide or transmission-line antennas; Equivalent structures causing radiation along the transmission path of a guided wave
• CPC Class Codes: H01Q 13/22 Longitudinal slot in boundary wall of waveguide or transmission line H01Q13/203 takes precedence
• CPC Class Codes: H01Q 15/006 Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
• CPC Class Codes: H01Q 15/0066 said selective devices being reconfigurable, tunable or controllable, e.g. using switches
• CPC Class Codes: H01Q 15/23 Combinations of reflecting surfaces with refracting or diffracting devices
• CPC Class Codes: H01Q 19/06 using refracting or diffracting devices, e.g. lens radome H01Q1/42
• CPC Class Codes: H04B 1/0458 Arrangements for matching and coupling between power amplifier and antenna or between amplifying stages matching circuits in general H03H
• CPC Class Codes: H04B 5/72 for local intradevice communication
• CPC Class Codes: H04B 7/24 for communication between two or more posts wireless communication networks H04W

Abstract

Methods and systems for configuring a leaky wave antenna (LWA) utilizing micro-electromechanical systems (MEMS) are disclosed and may include configuring a resonant frequency of one or more LWAs in a wireless device utilizing MEMS actuation. RF signals may be communicated using the LWAs. The LWAs may be integrated in metal layers in a chip, an integrated circuit package, and/or a printed circuit board in the wireless device. The LWAs may include microstrip waveguides where a cavity height of the LWAs may be dependent on a spacing between conductive lines in the microstrip waveguides. The LWAs may be configured to transmit the wireless signals at a desired angle. The integrated circuit package may be affixed to a printed circuit board and an integrated circuit may be flip-chip-bonded to the integrated circuit package. An air gap may be integrated adjacent to one or more of the metal layers for the MEMS actuation.

Claims

1. A method for communication, the method comprising:

in a wireless device;

configuring a resonant frequency of one or more leaky wave antennas utilizing micro-electromechanical system (MEMS) actuation; and

communicating RF signals at said configured resonant frequency via said one or more leaky wave antennas

2. The method according to claim 1, wherein said one or more leaky wave antennas are integrated in metal layers in a chip in said wireless device.

3. The method according to claim 1, wherein said one or more leaky wave antennas are integrated in metal layers in an integrated circuit package in said wireless device.

4. The method according to claim 1, wherein said one or more leaky wave antennas are integrated in metal layers in a printed circuit board in said wireless device.

5. The method according to claim 1, wherein said leaky wave antennas comprise microstrip waveguides.

6. The method according to claim 5, comprising adjusting a cavity height of said leaky wave antennas utilizing said MEMS actuation.

7. The method according to claim 1, comprising configuring said leaky wave antennas to transmit said wireless signals at a desired angle from a surface of said leaky wave antenna.

8. The method according to claim 1, wherein said integrated circuit package is affixed to a printed circuit board.

9. The method according to claim 1, wherein an integrated circuit is flip-chip-bonded to said integrated circuit package.

10. The method according to claim 1, wherein an air gap is integrated adjacent to one or more of said metal layers for said MEMS actuation.

11. A system for enabling communication, the system comprising:

a wireless device comprising one or more leaky wave antennas, said wireless device is operable to;

configure a resonant frequency of said one or more leaky wave antennas utilizing micro-electromechanical system (MEMS) actuation; and

communicate RF signals at said resonant frequency via said one or more leaky wave antennas.

12. The system according to claim 11, wherein said one or more leaky wave antennas are integrated in metal layers in a chip in said wireless device.

13. The system according to claim 11, wherein said one or more leaky wave antennas are integrated in metal layers in an integrated circuit package in said wireless device.

14. The system according to claim 11, wherein said one or more leaky wave antennas are integrated in metal layers in a printed circuit board in said wireless device.

15. The system according to claim 11, wherein said leaky wave antennas comprise microstrip waveguides.

16. The system according to claim 15, wherein said wireless device is operable to adjust a cavity height of said leaky wave antennas utilizing MEMS actuation.

17. The system according to claim 11, wherein said wireless device is operable to configure said leaky wave antennas to transmit said wireless signals at a desired angle from a surface of said leaky wave antenna.

18. The system according to claim 11, wherein said integrated circuit package is affixed to a printed circuit board.

19. The system according to claim 11, wherein an integrated circuit is flip-chip-bonded to said integrated circuit package.

20. The system according to claim 11, wherein an air gap is integrated adjacent to one or more of said metal layers for said MEMS actuation.