METHOD AND SYSTEM FOR COMMUNICATING VIA LEAKY WAVE ANTENNAS WITHIN A FLIP-CHIP BONDED STRUCTURE

• US 20100311369A1
• Filed: 03/31/2010
• Published: 12/09/2010
• Est. Priority Date: 06/09/2009
• Status: Abandoned Application

• Current Assignee: Avago Technologies General IP PTE Limited (Broadcom, Inc.)
• Original Assignee: Avago Technologies General IP PTE Limited (Broadcom, Inc.)
• Inventors: Rofougaran, Maryam, Rofougaran, Ahmadreza
• Application Number:
  US12/751,759
• Publication Number:
  US 20100311369A1
• Time in Patent Office: Days
• US Class Current: 455/129
• CPC Class Codes: G01S 13/06 Systems determining position data of a target
• CPC Class Codes: G06K 7/10316 using at least one antenna particularly designed for interrogating the wireless record carriers antennas in general H01Q1/22
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 13/20 Non-resonant leaky-waveguide or transmission-line antennas; Equivalent structures causing radiation along the transmission path of a guided wave
• CPC Class Codes: H01Q 13/22 Longitudinal slot in boundary wall of waveguide or transmission line H01Q13/203 takes precedence
• CPC Class Codes: H01Q 15/006 Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
• CPC Class Codes: H01Q 15/0066 said selective devices being reconfigurable, tunable or controllable, e.g. using switches
• CPC Class Codes: H01Q 15/23 Combinations of reflecting surfaces with refracting or diffracting devices
• CPC Class Codes: H01Q 19/06 using refracting or diffracting devices, e.g. lens radome H01Q1/42
• CPC Class Codes: H04B 1/0458 Arrangements for matching and coupling between power amplifier and antenna or between amplifying stages matching circuits in general H03H
• CPC Class Codes: H04B 5/72 for local intradevice communication
• CPC Class Codes: H04B 7/24 for communication between two or more posts wireless communication networks H04W

Abstract

Methods and systems for communicating via leaky wave antennas (LWAs) within a flip-chip bonded structure are disclosed and may include communicating RF signals in a wireless device including one or more LWAs between a plurality of support structures, the structures being coupled via flip-chip bonding. Low-frequency signals may be communicated via flip-chip bonding contacts. The RF signals may be communicated perpendicular to a surface and/or at a desired angle from the surface of the structures, which may include at least one of: an integrated circuit, an integrated circuit package, and a printed circuit board. The LWAs may include microstrip and/or coplanar waveguides where a cavity height of the LWAs may be configured by controlling spacing between conductive lines in the waveguides. The low-frequency signals may include DC bias voltages. The RF signals may be communicated from a single LWA to a plurality of LWAs.

Claims

1. A method for communication, the method comprising:

in a wireless device comprising one or more leaky wave antennas integrated within and/or on a plurality of support structures, said support structures being coupled via flip-chip-bonding;

communicating RF signals between said support structures via said one or more integrated leaky wave antennas; and

communicating low-frequency signals via contacts defined via said flip-chip bonding.

2. The method according to claim 1, comprising communicating said RF signals between said support structures perpendicular to a surface of said support structures.

3. The method according to claim 1, comprising configuring said leaky wave antennas to transmit said RF signals at a desired angle from said surface of said support structures.

4. The method according to claim 1, wherein said support structures comprise at least one of:

an integrated circuit, an integrated circuit package, and a printed circuit board.

5. The method according to claim 1, wherein said leaky wave antennas comprise microstrip waveguides.

6. The method according to claim 5, comprising configuring a cavity height of said leaky wave antennas by controlling spacing between conductive lines in said microstrip waveguides.

7. The method according to claim 1, wherein said leaky wave antennas comprise coplanar waveguides.

8. The method according to claim 7, comprising configuring a cavity height of said leaky wave antennas by controlling spacing between conductive lines in said coplanar waveguides.

9. The method according to claim 1, wherein said low-frequency signals comprise DC bias voltages.

10. The method according to claim 1, comprising communicating said RF signals from a single leaky wave antenna to a plurality of leaky wave antennas.

11. A system for enabling communication, the system comprising:

one or more circuits for use in a wireless device comprising one or more leaky wave antennas integrated within and/or on a plurality of support structures, said support structures being coupled via flip-chip-bonding, wherein said one or more circuits are operable to;

communicate RF signals between said support structures via said one or more integrated leaky wave antennas; and

communicate low-frequency signals via contacts defined via said flip-chip bonding.

12. The system according to claim 11, wherein said one or more circuits are operable to communicate said RF signals between said support structures perpendicular to a surface of said support structures.

13. The system according to claim 11, wherein said one or more circuits are operable to configure said leaky wave antennas to transmit said RF signals at a desired angle from said surface of said support structures.

14. The system according to claim 11, wherein said support structures comprise at least one of:

an integrated circuit, an integrated circuit package, and a printed circuit board.

15. The system according to claim 11, wherein said leaky wave antennas comprise microstrip waveguides.

16. The system according to claim 15, wherein said one or more circuits are operable to configure a cavity height of said leaky wave antennas by controlling spacing between conductive lines in said microstrip waveguides.

17. The system according to claim 11, wherein said leaky wave antennas comprise coplanar waveguides.

18. The system according to claim 17, wherein said one or more circuits are operable to configure a cavity height of said leaky wave antennas by controlling spacing between conductive lines in said coplanar waveguides.

19. The system according to claim 11, wherein said low-frequency signals comprise DC bias voltages.

20. The system according to claim 11, wherein said one or more circuits are operable to communicate said RF signals from a single leaky wave antenna to a plurality of leaky wave antennas.