LIGHT EMITTING DIODE REPLACEMENT LAMP

• US 20100320499A1
• Filed: 07/12/2010
• Published: 12/23/2010
• Est. Priority Date: 09/12/2003
• Status: Active Grant

• Current Assignee: LEDVANCE LLC (MLS Co. Ltd.)
• Original Assignee: TerraLUX Incorporated
• Inventors: Hall, John, Catalano, Anthony, Harrison, Daniel
• Granted Patent: US 8,400,081 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: F21K 9/23 Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• CPC Class Codes: F21K 9/233 specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
• CPC Class Codes: F21K 9/238 Arrangement or mounting of circuit elements integrated in the light source
• CPC Class Codes: F21V 23/003 the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
• CPC Class Codes: F21V 23/005 the substrate is supporting also the light source
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48464 the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H05B 45/10 Controlling the intensity of the light
• CPC Class Codes: H05B 45/14 using electrical feedback from LEDs or from LED modules
• CPC Class Codes: H05B 45/18 using temperature feedback
• CPC Class Codes: H05B 45/3574 Emulating the electrical or functional characteristics of incandescent lamps
• CPC Class Codes: H05B 45/3725 Switched mode power supply [SMPS]
• CPC Class Codes: H05B 45/38 using boost topology
• CPC Class Codes: H05B 45/40 Details of LED load circuits
• CPC Class Codes: H05B 45/56 : involving measures to prevent abnormal temperature of the LEDs
• CPC Class Codes: Y02B 20/30 : Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Abstract

Thermal management and control techniques for light emitting diode and other incandescent replacement light technologies using a current controller are disclosed.

Claims

1-46. -46. (canceled)

47. A lighting apparatus comprising:

a light-emitting diode (LED) having a metal slug disposed thereon;

a printed circuit board (PCB) comprising circuitry electrically connected to the LED, a first surface of the PCB being disposed in contact with the metal slug; and

a heat sink disposed in contact with a second surface of the PCB opposite the first surface,

wherein the PCB comprises a via extending therethrough and thermally connecting the metal slug and the heat sink.

48. The lighting apparatus of claim 47, wherein the via is plated.

49. The lighting apparatus of claim 47, wherein the via is substantially filled with at least one of copper, aluminum, or solder.

50. The lighting apparatus of claim 47, wherein the PCB comprises a copper sheet on at least one of the first surface or the second surface.

51. The lighting apparatus of claim 47, further comprising a plurality of additional vias extending through the PCB and thermally connecting the metal slug and the heat sink.

52. The lighting apparatus of claim 51, wherein a center-to-center distance between the vias is approximately 0.050 inches or less.

53. The lighting apparatus of claim 47, further comprising a temperature-dependent resistance disposed in thermal contact with at least one of the PCB or the heat sink.

54. The lighting apparatus of claim 53, further comprising circuitry for controlling current to the LED based at least in part on a resistance of the temperature-dependent resistance.

55. A method of forming a lighting apparatus, the method comprising:

disposing a light-emitting diode over a first surface of a printed circuit board (PCB); and

disposing a heat sink over a second surface of the PCB opposing the first surface,

wherein a via extending through a thickness of the PCB thermally connects the LED and the heat sink.

56. The method of claim 55, further comprising disposing a temperature-dependent resistance in thermal contact with at least one of the PCB or the heat sink.

57. The method of claim 56, further comprising providing circuitry for controlling current to the LED based at least in part on a resistance of the temperature-dependent resistance.

58. A lighting apparatus comprising:

a light-emitting diode (LED) disposed over a hole in a printed circuit board (PCB), the hole extending through a thickness of the PCB; and

a heat sink disposed under the hole, the heat sink comprising a raised portion extending at least partially through the hole,

wherein the LED is thermally connected to the raised portion.

59. The lighting apparatus of claim 58, wherein the raised portion has a height substantially equal to the thickness of the PCB.

60. The lighting apparatus of claim 58, wherein the heat sink comprises a plurality of additional raised portions each extending at least partially through an additional hole in the PCB and being in thermal communication with an additional LED.

61. The lighting apparatus of claim 58, further comprising a temperature-dependent resistance disposed in thermal contact with at least one of the PCB or the heat sink.

62. The lighting apparatus of claim 61, further comprising circuitry for controlling current to the LED based at least in part on a resistance of the temperature-dependent resistance.

63. A method of forming a lighting apparatus, the method comprising:

disposing a light-emitting diode (LED) over a hole in a printed circuit board (PCB); and

disposing a heat sink beneath the PCB such that a raised portion of the heat sink extends at least partially through the hole and is thermally connected to the LED.

64. The method of claim 63, further comprising disposing a temperature-dependent resistance in thermal contact with at least one of the PCB or the heat sink.

65. The method of claim 64, further comprising providing circuitry for controlling current to the LED based at least in part on a resistance of the temperature-dependent resistance.