Method for Fabricating Butt-Coupled Electro-Absorptive Modulators

• US 20100330727A1
• Filed: 08/29/2008
• Published: 12/30/2010
• Est. Priority Date: 10/30/2007
• Status: Active Grant

• Current Assignee: BAE Systems Information and Electronic Systems Integration Incorporated (BAE Systems Plc)
• Original Assignee: BAE Systems Information and Electronic Systems Integration Incorporated (BAE Systems Plc)
• Inventors: Hill, Craig M., Pomerene, Andrew T.S.
• Granted Patent: US 8,871,554 B2
• Time in Patent Office: Days
• US Class Current: 438/69
• CPC Class Codes: G02F 1/025 in an optical waveguide structure G02F1/017, G02F1/2257 take precedence

Abstract

A method for fabricating butt-coupled electro-absorptive modulators is disclosed. A butt-coupled electro-absorptive modulator with minimal dislocations in the electro-absorptive material is produced by adding a dielectric spacer for lining the coupling region before epitaxially growing the SiGe or other electro-absorptive material. It has been determined that during the SiGe growth, the current process has exposed single crystal silicon at the bottom of the hole and exposed amorphous silicon on the sides. SiGe growth on the amorphous silicon is expected to have more dislocations than single crystal silicon. There should also be dislocations or fissures where the SiGe growth from the each nucleation source finally join. Thus, a dielectric sidewall can protect an exposed waveguide face from any etching from an aggressive surface preparation prior to epi growth.

Claims

1. A method for fabricating an electro-absorptive modulator or detector, said method comprising:

forming a doped semiconductor layer on a substrate;

depositing a first cladding layer on said doped semiconductor layer;

depositing and patterning a waveguide layer to form a plurality of waveguides;

depositing a second cladding layer on top of said waveguide layer;

etching a trench through said second cladding layer, said waveguide layer, and said first cladding layer to expose said doped semiconductor layer;

depositing a film spacer layer on top of said second cladding layer to cover said trench;

etching said film spacer layer to form respective sidewalls within said trench; and

forming an electro-absorptive modulator within said trench such that said electro-absorptive modulator is butt-coupled to said waveguides via said sidewalls.

2. The method of claim 1, wherein said waveguide layer is made of silicon.

3. The method of claim 1, wherein said first and second cladding layers are made of SiO₂.

4. The method of claim 1, wherein said film spacer layer is a dielectric.

5. The method of claim 1, wherein said electro-absorptive modulator is made of Ge.

6. The method of claim 1, wherein said electro-absorptive modulator is made of GeSi.