MODULAR HIGH-POWER DRIVE STACK COOLED WITH VAPORIZABLE DIELECTRIC FLUID

• US 20110013364A1
• Filed: 05/18/2009
• Published: 01/20/2011
• Est. Priority Date: 05/16/2008
• Status: Active Grant

• Current Assignee: Parker Intangibles LLC (Parker-Hannifin Corporation)
• Original Assignee: Parker-Hannifin Corporation
• Inventors: Howes, Jeremy Charles, Levett, David
• Granted Patent: US 8,305,760 B2
• Time in Patent Office: Days
• US Class Current: 361/700
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01R 13/005 Electrical coupling combined with fluidic coupling
• CPC Class Codes: H05K 7/20936 Liquid coolant with phase change

Abstract

A high power drive stack system is provided which includes a cabinet (20) having a vaporizable dielectric fluid cooling system (110) and a plurality of receivers (22) for accepting a plurality of modules (30) containing power electronics. The modules are removably attachable to the receivers by at least two non-latching, dry-break connectors (210). Each of the at least two connectors providing both a fluid connection and an electrical connection between the cabinet and the module.

Claims

1. A high power drive stack system comprising:

a common support structure including;

a system power source,

a dielectric fluid cooling system, and

a plurality of receivers located in predetermined locations,

wherein at least one of the receivers has at least two receiver connectors and the at least two receiver connectors have a predetermined position in one of the receivers;

at least one module including;

a power component,

a dielectric fluid cooling circuit associated with the power component, and

at least two module connectors,

wherein the at least two module connectors are arranged in a predetermined position and electrically coupled to at least a portion of the power component and fluidly coupled to the dielectric fluid cooling circuit associated with the power component; and

each module connector mating with a corresponding receiver connector to form an electrical connection and a fluid connection between the module and the common support structure.

2. The system of claim 1 wherein the dielectric fluid cooling system and the dielectric fluid cooling circuit utilize a vaporizable dielectric refrigerant.

3. The system of claim 2 further including a plurality of modules.

4. The system of claim 3, wherein the plurality of modules are stacked together and secured to the common support structure.

5. The system of claim 4, wherein the common support structure is a rack or cabinet.

6. The system of claim 2, wherein the dielectric fluid cooling system comprises a plurality of fluid conduits, a pump, a condenser, and an evaporator, the evaporator positioned on the at least one module.

7. The system of claim 2, wherein the electrical connection and the fluid connection formed by each module connector mating with a corresponding receiver connector is a dry-break connection.

8. The system of claim 7, wherein the electrical connection and the fluid connection formed by each module connector mating with a corresponding receiver connector is a non-latching connection.

9. The system of claim 1, wherein the module connectors and the receiver connectors form a plug and socket connection.

10. The system of claim 9, wherein each plug and socket connection is formed at least in part as a hollow tube, at least a portion of the tube being conductive along its length and the tubes providing a fluid passageway when the plug is inserted into the tube.

11. The system of claim 1, wherein the module further comprises a cold plate operating at the potential of a power component bonded directly to the cold plate.

12. The system of claim 1, wherein at least portions of the module dielectric fluid cooling circuit associated with the power component are used as current carrying bus bars.

13. The system of claim 1, wherein the power component of the at least one module is a silicon disk or die.

14. The system of claim 13, wherein the at least one module further comprising a heat sink on both sides of the silicon disk or die, wherein the module dielectric fluid cooling circuit passes through both the heat sinks, at least a portion of the module dielectric fluid cooling circuit also providing an electrical connection to the power silicon disk or die.

15. The system of claim 13, wherein the at least one module further comprising a heat sink on both sides of the silicon disk or die, wherein the module dielectric fluid cooling circuit passes through both the heat sinks, at least a portion of the module dielectric fluid cooling circuit also providing an electrical connection to the power silicon disk or die.

16. The system of claim 1, wherein dielectric fluid of the module dielectric fluid cooling circuit is in direct contact with at least a portion of the silicon disk or die of the module, at least a portion of the module dielectric fluid cooling circuit also providing an electrical connection to the power silicon disk or die.

17. A cooling and power system comprising:

a vaporizable dielectric fluid cooling system having an evaporator positioned to cool at least one power silicon device, at least portions of a fluid conduit of the vaporizable dielectric fluid cooling system also providing an electrical connection to the power silicon device.

18. A connector comprising:

a plug and mating socket,

the plug and socket are formed at least in part as a hollow tube, at least a portion of the tube being conductive along its length, the plug and socket constructed to make an electrical connection between the plug and socket;

the plug and socket constructed to make a fluid connection between the plug and socket.

19. A method of cooling and powering a silicon device comprising the steps of:

providing a power silicon device

cooling the power silicon device by providing a cooling system utilizing a vaporizable dielectric refrigerant, the system comprising a plurality of fluid conduits, a pump, a condenser, and a cold plate, wherein the cold plate is positioned for cooling the power silicon device by promoting the vaporization of liquid refrigerant passing through the cold plate;

providing a source of power;

powering the silicon device by electrically connecting the source of power to the power silicon device utilizing at least a portion of the fluid conduit.