SEALING OF AN IMPLANTABLE MEDICAL DEVICE
First Claim
1. A method of adhering a protective layer to a substrate region of an implantable medical device (IMD) to form a covered substrate region, comprising:
- depositing an intermediate layer on a portion of the substrate region such that the intermediate layer binds to the portion of the substrate region to create a modified substrate region;
depositing the protective layer onto at least the intermediate layer; and
adhering the protective layer to the intermediate layer such that an increased adhesion exists between the protective layer and the modified substrate region relative to adhesion that would be present between the portion of the substrate region and the protective layer.
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Accused Products
Abstract
A method of adhering a protective layer applied to a substrate region of an implantable medical device (IMD) to form a covered substrate region. The method includes obtaining the IMD, depositing an intermediate layer on a portion of the substrate region of the IMD such that the intermediate layer binds to the portion of the substrate region to create a modified substrate region, and depositing the protective layer after depositing the intermediate layer onto the intermediate layer and adhering the protective layer to the intermediate layer. In an embodiment of the present invention, this method enhances the sealing characteristics of the protective layer by, for example, reducing the likelihood of delamination of the protective layer from the IMD relative to IMDs prepared by certain other methods.
16 Citations
20 Claims
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1. A method of adhering a protective layer to a substrate region of an implantable medical device (IMD) to form a covered substrate region, comprising:
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depositing an intermediate layer on a portion of the substrate region such that the intermediate layer binds to the portion of the substrate region to create a modified substrate region; depositing the protective layer onto at least the intermediate layer; and adhering the protective layer to the intermediate layer such that an increased adhesion exists between the protective layer and the modified substrate region relative to adhesion that would be present between the portion of the substrate region and the protective layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. An implantable medical device (IMD), comprising:
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a housing assembly containing electronics components, the housing assembly including a substrate region; an intermediate layer adhering to the substrate region; and a protective layer adhering to at least the intermediate layer, wherein an increased adhesion exists between the protective layer and the intermediate layer relative to adhesion that would be present between the substrate region and the protective layer. - View Dependent Claims (16, 17, 18, 19)
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20. An implantable medical device (IMD), comprising:
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a housing assembly containing electronics components, the housing assembly including a substrate region; an intermediate layer adhering to the substrate region; and a protective layer adhering to at least the intermediate layer, wherein a bond between the intermediate layer and the protective layer is a Ti—
O—
Si bond, and wherein the Ti—
O—
Si bond is more stable than a PT-O—
Si bond.
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Specification