SEMICONDUCTOR DEVICE AND PROGRAMMING METHOD
First Claim
1. A method for fabricating a semiconductor device comprising:
- mounting a semiconductor chip on a chip mounting portion;
disposing a sheet-shaped resin in contact with the semiconductor chip; and
forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip.
6 Assignments
0 Petitions
Accused Products
Abstract
The present invention include a semiconductor device and a method therefor, the method includes disposing a sheet-shaped resin at a side opposite to the chip mounting portion mounting semiconductor chips to be mounted on the chip mounting portion, and forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chips. According to an aspect of the present invention, it is possible to provide a semiconductor device and a fabrication method therefor, by which it is possible to reduce the size of the package and to prevent the generation of an unfilled portion in a resin sealing portion or a filler-removed portion or to prevent the exposure of wire from the resin sealing portion.
12 Citations
20 Claims
-
1. A method for fabricating a semiconductor device comprising:
-
mounting a semiconductor chip on a chip mounting portion; disposing a sheet-shaped resin in contact with the semiconductor chip; and forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
-
-
11. A system comprising:
-
means for mounting a semiconductor chip on a chip mounting portion; means for disposing the sheet-shaped resin comprises disposing the sheet-shaped resin in contact with the semiconductor chip; and means for forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18)
-
-
19. A method for fabricating a semiconductor device comprising:
-
mounting a semiconductor chip on an upper die portion; disposing a sheet-shaped resin on a lower die portion, wherein the sheet-shaped resin is disposed in contact with the semiconductor chip; and assembling the upper die portion and the lower die portion; and sealing the semiconductor chip with a sealing resin, wherein the sealing resin forms a resin sealing portion between the sheet-shaped resin and the upper die portion, to seal the semiconductor chip. - View Dependent Claims (20)
-
Specification