×

SEMICONDUCTOR DEVICE AND PROGRAMMING METHOD

  • US 20110024922A1
  • Filed: 10/07/2010
  • Published: 02/03/2011
  • Est. Priority Date: 01/17/2006
  • Status: Active Grant
First Claim
Patent Images

1. A method for fabricating a semiconductor device comprising:

  • mounting a semiconductor chip on a chip mounting portion;

    disposing a sheet-shaped resin in contact with the semiconductor chip; and

    forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip.

View all claims
  • 6 Assignments
Timeline View
Assignment View
    ×
    ×