POWER INVERTER

• US 20110032676A1
• Filed: 04/14/2010
• Published: 02/10/2011
• Est. Priority Date: 04/27/2006
• Status: Active Grant

• Current Assignee: Hitachi Astemo Ltd. (Hitachi, Ltd.)
• Original Assignee: Hitachi Automotive Systems Limited (Hitachi, Ltd.)
• Inventors: Matsuo, Takeshi, Nishihara, Atsuo, Musou, Masanori, Hamada, Haruki
• Granted Patent: US 8,072,760 B2
• Time in Patent Office: Days
• US Class Current: 361/703
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change

Abstract

Water paths for feeding a coolant water through a power converter mounted on an automobile are arranged in parallel, openings are formed on the water paths respectively, heat radiating fins project from the openings, and the openings are closed by a base plate of the power module. Further, the base plate of the power module includes a metal in addition to copper to increase a hardness of the base plate, so that a deterioration of the flatness during fixing the fins with brazing is restrained.

Claims

1. A power converter to be connected to a rotary motor mounted on a vehicle, comprising a metallic housing, a power module arranged in the housing, a capacitor module arranged in the housing, and a cooling path forming body forming a cooling path, wherein

an opening is formed on the cooling path,

the power module includes a metallic base plate, a heat radiating d fin fixed by brazing to a surface of the base plate, and a plurality of semiconductor chips held on another surface of the base plate,

the heat radiating fin of the power module projects from the opening into the cooling path, and the power module is fixed to the cooling path forming body so that the opening is closed by the base plate of the power module.