MEMS PACKAGE AND A METHOD FOR MANUFACTURING THE SAME

• US 20110039372A1
• Filed: 08/13/2010
• Published: 02/17/2011
• Est. Priority Date: 08/13/2009
• Status: Active Grant

• Current Assignee: Knowles Electronics Llc (Knowles Corporation)
• Original Assignee: Knowles Electronics Llc (Knowles Corporation)
• Inventors: Czech, Denise P., Friel, Kurt B., Loeppert, Peter V., Grunert, Lawrence A., Wang, Qing
• Granted Patent: US 8,987,030 B2
• Time in Patent Office: Days
• US Class Current: 438/114
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 7/0061 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A method is provided for manufacturing a plurality of packages. The method comprises the steps of: applying a means for adhering two or more covers to a substrate; positioning the two or more covers onto the substrate to create one or more channels bounded by the two or more covers and the substrate; coupling the covers to the substrate; depositing a material into the one or more channels; performing a process on the material to affix the material; and singulating along the channels to create the plurality of packages.

Claims

1. A method of manufacturing a plurality of packages, the method comprising the steps of:

applying a means for adhering two or more covers to a substrate;

positioning the two or more covers onto the substrate to create one or more channels bounded by the two or more covers and the substrate;

coupling the covers to the substrate;

depositing a material into the one or more channels;

performing a process on the material to affix the material; and

singulating along the channels to create the plurality of packages.

2. The method of claim 1 wherein the means for adhering the covers to the substrate comprises one of an adhesive or solder.

3. The method of claim 1 wherein the covers are coupled mechanically.

4. The method of claim 1 wherein the covers are electrically coupled.

5. The method of claim 1 wherein the covers are coupled to the substrate by a curing process.

6. The method of claim 1 wherein the covers are coupled to the substrate by a reflow process.

7. The method of claim 1 wherein the material is a self-leveling fluid.

8. The method of claim 1 wherein the process is one of heating, exposure to light, use of a catalyst, and use of moisture.

9. The method of claim 1 wherein the material comprises one of a powder, paste and gel.

10. The method of claim 1 wherein the process self-levels and solidifies the material.

11. The method of claim 1 wherein the singulation is performed by a process selected from the group consisting of:

dicing, punching, routing, sawing, and scribing and breaking.

12. The method of claim 1 wherein the covers are positioned using a technique selected from the group consisting of:

individual pick-and-place, gang pick-and-place, and palletizing and flipping.

13. The method of claim 1 wherein depositing the material is performed using a technique selected from the group consisting of:

dispensing, jetting, pouring, printing, overfilling and scraping excess, spraying, and transfer stamping.

14. A method of manufacturing a plurality of packages, the method comprising the steps of:

positioning two or more covers onto a substrate to create one or more channels bounded by the two or more covers and the substrate;

depositing a material into the one or more channels;

performing a process on the material to affix the material wherein the affixation couples the covers to the substrate; and

singulating along the channels to create the plurality of packages.

15. The method of claim 14 wherein the covers are coupled mechanically.

16. The method of claim 14 wherein the covers are electrically coupled.

17. The method of claim 14 wherein the process is one of heating, exposure to light, use of a catalyst, and use of moisture.

18. The method of claim 14 wherein the material comprises one of a powder, paste and gel.

19. The method of claim 14 wherein the singulation is performed by a process selected from the group consisting of:

dicing, punching, routing, sawing, and scribing and breaking.

20. The method of claim 14 wherein the covers are positioned using a technique selected from the group consisting of:

individual pick-and-place, gang pick-and-place, and palletizing and flipping.