SEMICONDUCTOR LIGHT EMITTING DIODES INCLUDING MULTIPLE BOND PADS ON A SINGLE SEMICONDUCTOR DIE
First Claim
Patent Images
1. A light emitting device comprising:
- a semiconductor light emitting diode that comprises a single semiconductor die; and
at least five bond pads on the single semiconductor die.
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Abstract
A light emitting device includes a single semiconductor die light emitting diode and at least five bond pads on the single semiconductor die. The bond pads may be in the four corners and at least one midpoint of the single semiconductor die. A wavelength conversion layer may be provided and bond pad extensions may extend through the wavelength conversion layer. Multiple wire bond connections may also be provided.
36 Citations
23 Claims
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1. A light emitting device comprising:
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a semiconductor light emitting diode that comprises a single semiconductor die; and at least five bond pads on the single semiconductor die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A light emitting device comprising:
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a semiconductor light emitting diode that comprises a single semiconductor die of at least about 4 mm2 in area that includes four sides, each of which includes a midpoint and which define four corners; and a plurality of bond pads on the single semiconductor die, a respective one of which is at each corner and at at least one midpoint of the single semiconductor die. - View Dependent Claims (11, 12, 13, 14, 15, 16)
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17. A light emitting device comprising:
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a semiconductor light emitting diode that comprises a single semiconductor die of at least about 4 mm2 in area; at least five bond pads on the single semiconductor die; a wavelength conversion layer on the single semiconductor die; and at least five bond pad extensions, a respective one of which is on a respective one of the bond pads and extends through the wavelength conversion layer. - View Dependent Claims (18, 19, 20, 21, 22, 23)
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Specification