ELECTRONIC EQUIPMENT AND METHOD FOR CONNECTING ELECTRONIC CIRCUIT SUBSTRATE

• US 20110043050A1
• Filed: 03/12/2009
• Published: 02/24/2011
• Est. Priority Date: 05/22/2008
• Status: Active Grant

• Current Assignee: Mitsubishi Electric Corporation
• Original Assignee: Mitsubishi Electric Corporation
• Inventors: Koizumi, Yoshiaki, Yabe, Masaaki, Kushiro, Noriyuki, Higuma, Toshiyasu
• Granted Patent: US 8,643,219 B2
• Time in Patent Office: Days
• US Class Current: 307/104
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 38/14 Inductive couplings for wireless supply or distribution of electric power using inductive coupling H02J50/10
• CPC Class Codes: H02J 50/12 of the resonant type
• CPC Class Codes: H02J 50/70 involving the reduction of electric, magnetic or electromagnetic leakage fields
• CPC Class Codes: H02J 50/80 involving the exchange of data, concerning supply or distribution of electric power, between transmitting devices and receiving devices
• CPC Class Codes: H04B 5/263 Multiple coils at either side
• CPC Class Codes: H04B 5/72 for local intradevice communication
• CPC Class Codes: H04B 5/79 for data transfer in combination with power transfer

Abstract

Wireless power supply and information communication are achieved between electronic circuit substrates in the electronic equipment, and the size of the circuitry for achieving the above is reduced. There are provided a first electronic circuit substrate, a second electronic circuit substrate, a first coil connected to the first electronic circuit substrate, and a second coil connected to the second electronic circuit substrate. Power is transmitted from the first coil to the second coil by electromagnetic induction so that the first electronic circuit substrate and the second electronic circuit substrate are electrically connected.

Claims

1. Electronic equipment comprising:

a first electronic circuit substrate;

a second electronic circuit substrate;

a first coil connected to said first electronic circuit substrate; and

a second coil connected to said second electronic circuit substrate, wherein;

power is transmitted from said first coil to said second coil by electromagnetic induction so that said first electronic circuit substrate and said second electronic circuit substrate are electrically connected,

wherein said first coil has;

a first power coil that transmits power from said first electronic circuit substrate to said second electronic circuit substrate; and

a first communication coil that communicates between said first electronic circuit substrate and said second electronic circuit substrate,

and wherein said second coil has;

a second power coil that receives power transmitted by said first power coil; and

a second communication coil that communicates with said first communication coil.

6. The electronic equipment of claim 1, wherein said first coil and said second coil are stacked in the plane direction to be disposed.

7. The electronic equipment of claim 6, wherein:

said first power coil and said second power coil are arranged to face each other in the plane direction;

said first communication coil and said second communication coil are arranged to face each other in the plane direction; and

a first set composed of said first power coil and said second power coil and a second set composed of said first communication coil and said second communication coil are stacked in the plane direction through magnetic substance.

8. The electronic equipment of claim 7, wherein magnetic substance is arranged outside of the coils positioned on the opposite side of the opposite faces of said first set and said second set.

9. The electronic equipment of claim 7, wherein a magnetic shielding material is arranged between said first set and said second set.

10. The electronic equipment of claim 1, wherein:

said first coil and said second coil are configured in such a way that by dividing a single coil into two coils at a center tap so that said first power coil and said first communication coil and said second power coil and said second communication coil are provided.

11. The electronic equipment of claim 1, wherein:

the number of coil turns of at least one of said first coil and said second coil is adjusted by serially connecting a plurality of coils and being stacked in the plane direction.

12. The electronic equipment of claim 1, wherein:

the current capacity of at least one of said first coil and said second coil is adjusted by connecting a plurality of coils in parallel and being stacked in the plane direction.

13. The electronic equipment of claim 1, wherein:

at least one of said first coil and said second coil

is configured by a flexible substrate;

is fixed to the opposite face of the face where an electronic circuit of said first electronic circuit substrate or said second electronic circuit substrate is mounted, and

is connected to said electronic circuit after being bent at an end of said first electronic circuit substrate or said second electronic circuit substrate and extended toward the face side where said electronic circuit is mounted.

18. The electronic equipment of claim 1, wherein said first coil and said second coil transmit and receive serial data each other.

19. The electronic equipment of claim 18, further comprising data synthesis means for synthesizing data transmitted by said first coil or said second coil with said serial data into a single transmission data, wherein:

said first coil or said second coil transmits said transmission data synthesized by said data synthesis means.

20. The electronic equipment of claim 19, further comprising data dividing means for dividing said transmission data received by said first coil or said second coil into each data before the synthesis by said data synthesis means.

21. The electronic equipment of claim 1, wherein the communication signal speed between said first coil and said second coil is made to be faster than the communication signal speed used by electronic parts mounted on said first electronic circuit substrate and said second electronic circuit substrate.

22. The electronic equipment of claim 1, wherein said first coil and said second coil have different winding specifications.

23. The electronic equipment of claim 1, wherein said first electronic circuit substrate and said second electronic circuit substrate are removably connected to each other.

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