LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

• US 20110044029A1
• Filed: 10/29/2010
• Published: 02/24/2011
• Est. Priority Date: 03/15/2007
• Status: Active Grant

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Hata, Toshio, Agatani, Makoto, Konishi, Masahiro
• Granted Patent: US 8,427,048 B2
• Time in Patent Office: Days
• US Class Current: 362/97.2
• CPC Class Codes: F21K 9/20 Light sources comprising attachment means
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21V 23/002 Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/45169 Platinum (Pt) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01068 Erbium [Er]
• CPC Class Codes: H01L 2924/01087 : Francium [Fr]
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01L 33/32 : containing nitrogen
• CPC Class Codes: H01L 33/36 : characterised by the electrodes
• CPC Class Codes: H01L 33/38 : with a particular shape
• CPC Class Codes: H01L 33/502 : Wavelength conversion materials
• CPC Class Codes: H01L 33/56 : Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 : Reflective elements
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/641 : characterized by the materials

Abstract

By using a light emitting device including an insulating substrate and a light emitting unit formed on the insulating substrate, the light emitting unit including: a plurality of linear wiring patterns disposed on the insulating substrate in parallel with one another, a plurality of light emitting elements that are mounted between the wiring patterns while being electrically connected to the wiring patterns, and a sealing member for sealing the light emitting elements, as well as a method for manufacturing thereof, it becomes possible to provide a light emitting device that achieves sufficient electrical insulation and has simple manufacturing processes so that it can be manufactured at a low cost, and a method for manufacturing the same.

Claims

1. A light emitting device comprising:

a substrate; and

a light emitting unit formed on the substrate,

a peripheral area surrounding the light emitting unit,

a positive electrode externally connecting land and a negative electrode externally connecting land provided on the substrate in the peripheral area,

wherein the light emitting unit includes;

wiring patterns including a cathode wiring pattern and an anode wiring pattern disposed on the substrate;

a plurality of light emitting elements mounted between the wiring patterns; and

a sealing member for sealing the light emitting elements,

wherein the positive electrode externally connecting land and the negative electrode externally connecting land are connected to the anode wiring pattern and the cathode wiring pattern, respectively,

and wherein the peripheral area is not covered by the sealing member.

2. The light emitting device of claim 1, wherein a through hole or hole having a cut-out shape is formed in the peripheral area.

7. One of a backlight light source of a liquid crystal display and a light source for illumination, comprising the light emitting device of claim 1 attached to a matching member.

9. The light source for illumination of claim 7, being one of a light bulb-type LED lamp and a fluorescent lighting-type LED lamp.

3. A light emitting device comprising:

a substrate; and

a light emitting unit comprised of a light emitting element mounted on said substrate and a resin seal covering said light emitting element, wherein;

on said substrate, there is a peripheral area free of said resin seal and completely surrounding said light emitting unit; and

in said peripheral area, there are a positive electrode externally connecting land, a negative electrode externally connecting land, and one of a through hole and a hole having a cut-out shape.

8. One of a backlight light source of a liquid crystal display and a light source for illumination, comprising the light emitting device of claim 3 secured to a matching member with one of a screw and a jig inserted into said one of said through hole and said hole having said cut-out shape.

4. A light emitting device comprising:

a substrate; and

a light emitting unit comprised of a light emitting element mounted on said substrate and a resin seal covering said light emitting element, wherein;

on said substrate, there is a peripheral area free of said resin seal and completely surrounding said light emitting unit;

in said peripheral area, there are a positive electrode externally connecting land, a negative electrode externally connecting land, and one of a through hole and a hole having a cut-out shape; and

said one of said through hole and said hole having said cut-out shape is opposite to another one of a through hole and a hole having a cut-out shape, with said light emitting unit disposed therebetween.

5. The light emitting device of claim 4, wherein:

said substrate is shaped as one of a hexagon, a rectangle and a square; and

there is one of a plurality of through holes and a plurality of holes having a cut-out shape on a diagonal line of said substrate.

6. The light emitting device of claim 4, wherein:

said substrate is round; and

there is one of a plurality of through holes and a plurality of holes having a cut-out shape on a straight line passing through a center of said substrate.