Wired circuit board and producing method thereof

  • US 20110048785A1
  • Filed: 08/16/2010
  • Published: 03/03/2011
  • Est. Priority Date: 08/26/2009
  • Status: Active Grant
First Claim
Patent Images

1. A wired circuit board, comprising:

  • a metal supporting layer;

    an insulating layer formed on the metal supporting layer; and

    a conductive layer formed on the insulating layer, whereina reference hole for positioning is formed in the metal supporting layer, anda stepped portion is formed so as to surround the reference hole.

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