WIRELESS IC DEVICE AND METHOD OF MANUFACTURING THE SAME

• US 20110049249A1
• Filed: 11/05/2010
• Published: 03/03/2011
• Est. Priority Date: 05/22/2008
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: TANIGUCHI, Katsumi, KATO, Noboru, ISHINO, Satoshi, SASAKI, Jun
• Granted Patent: US 8,047,445 B2
• Time in Patent Office: Days
• US Class Current: 235/492
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: G06K 19/07783 the coil being planar
• CPC Class Codes: G06K 19/07784 the inductive antenna consisting of a plurality of coils stacked on top of one another
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H04B 5/26 using coils
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.

Abstract

A wireless IC device includes a plurality of insulating sheets that are stacked on top of one another. Coil electrodes are arranged so as to sandwich the insulating sheets therebetween and define an antenna coil by being connected to one another. The coil electrodes are superposed with one another and thereby define a single ring when viewed in plan from a z-axis direction.

Claims

1. A wireless IC device comprising:

an insulating sheet;

a plurality of coil electrodes defining an antenna coil and being arranged so as to sandwich the insulating sheet therebetween and to be connected to one another;

wherein

the plurality of coil electrodes are superposed with one another so as to define a single ring when viewed in plan from a direction extending perpendicular or substantially perpendicular to a direction in which a main surface of the insulating sheet extends.

2. The wireless IC device according to claim 1, wherein the insulating sheet includes a plurality of stacked layers and certain ones of the plurality of coil electrodes arranged at both ends in the direction extending perpendicular or substantially perpendicular to the direction in which a main surface of the insulating sheet extends wind through a length of less than one circuit around a coil axis of the coil antenna.

3. The wireless IC device according to claim 2, wherein the coil electrodes arranged at both ends have a line width greater than remaining coil electrodes of the plurality of coil electrodes.

4. The wireless IC device according to claim 3, wherein the coil electrodes arranged at both ends cover at least a portion of the remaining coil electrodes when viewed in plan from the direction extending perpendicular or substantially perpendicular to the direction in which a main surface of the insulating sheet extends.

5. The wireless IC device according to claim 2, wherein remaining ones of the plurality of coil electrodes other than those arranged at both ends wind through a length of at least one circuit around the coil axis.

6. The wireless IC device according to claim 2, further comprising:

a wireless IC that is connected to the antenna coil and arranged to process transmission and reception signals.

7. The wireless IC device according to claim 6, further comprising:

a first connector connected to the wireless IC and connected to the coil electrode on a layer of the plurality of layers of the insulating sheet arranged on an uppermost side in the direction extending perpendicular or substantially perpendicular to the direction in which a main surface of the insulating sheet extends;

a second connector connected to the wireless IC on a layer of the plurality of layers of the insulating sheet that is positioned on the uppermost side in the direction extending perpendicular or substantially perpendicular to the direction in which a main surface of the insulating sheet extends;

a third connector arranged on one of the plurality of layers of the insulating sheet other than the layers of the insulating sheets arranged on the uppermost side and on a lowermost side in the direction extending perpendicular or substantially perpendicular to the direction in which a main surface of the insulating sheet extends and superposed with the second connector when viewed in plan from the direction extending perpendicular or substantially perpendicular to the direction in which a main surface of the insulating sheet extends; and

a fourth connector connected to the coil electrode on the layer of the insulating sheet arranged on the lowermost side in the direction extending perpendicular or substantially perpendicular to the direction in which a main surface of the insulating sheet extends and superposed with the second connector when viewed in plan from the direction extending perpendicular or substantially perpendicular to the direction in which a main surface of the insulating sheet extends;

wherein

the first connector, the second connector, the third connector, and the fourth connector are connected to one another at the same or substantially the same location when viewed in plan from the direction extending perpendicular or substantially perpendicular to the direction in which a main surface of the insulating sheet extends.

8. The wireless IC device according to claim 2, further comprising:

an electromagnetic coupling module that includes a wireless IC that processes transmission and reception signals and a feeder circuit board including an inductance element connected to the wireless IC and connected to the antenna coil.

9. The wireless IC device according to claim 8, further comprising:

a first connector that connected to the feeder circuit board and the coil electrode on a layer of the plurality of layers of the insulating sheet that is arranged on an uppermost side in the direction extending perpendicular or substantially perpendicular to the direction in which a main surface of the insulating sheet extends;

a second connector connected to the feeder circuit board on the layer of the insulating sheet that is arranged on the uppermost side in the direction extending perpendicular or substantially perpendicular to the direction in which a main surface of the insulating sheet extends;

a third connector arranged on a layer of the plurality of layers of the insulating sheets other than the layers of the insulating sheets arranged on the uppermost side and a lowermost side in the direction extending perpendicular or substantially perpendicular to the direction in which a main surface of the insulating sheet extends and being superposed with the second connector when viewed in plan from the direction extending perpendicular or substantially perpendicular to the direction in which a main surface of the insulating sheet extends; and

a fourth connector connected to the coil electrode on a layer of the plurality of layers of the insulating sheet arranged on the lowermost side in the direction extending perpendicular or substantially perpendicular to the direction in which a main surface of the insulating sheet extends and being superposed with the second connector when viewed in plan from the direction extending perpendicular or substantially perpendicular to the direction in which a main surface of the insulating sheet extends;

wherein the first connector, the second connector, the third connector, and the fourth connector are connected to one another at the same or substantially the same location when viewed in plan from the direction extending perpendicular or substantially perpendicular to the direction in which a main surface of the insulating sheet extends.

10. The wireless IC device according to claim 6, wherein the wireless IC is arranged so as to be superposed with the single ring defined by the plurality of coil electrodes when viewed in plan from the direction extending perpendicular or substantially perpendicular to the direction in which a main surface of the insulating sheet extends.

11. The wireless IC device according to claim 1, wherein a minimum value of a distance between an outer edge of the single ring and outer edges of the insulating sheet is greater than a distance in the direction extending perpendicular or substantially perpendicular to the direction in which a main surface of the insulating sheet extends between the plurality of coil electrodes.

12. The wireless IC device according to claim 2, further comprising:

a connection conductor arranged at a location superposed with the coil electrodes arranged at both ends the direction extending perpendicular or substantially perpendicular or substantially perpendicular to the direction in which a main surface of the insulating sheet extends and to connect the plurality of coil electrodes to one another.

13. The wireless IC device according to of claim 1, wherein a coil electrode of the plurality of coil electrodes arranged on an uppermost side or a coil electrode of the plurality of coil electrodes arranged on a lowermost side in the direction extending perpendicular or substantially perpendicular to the direction in which a main surface of the insulating sheet extends is separated from and is not side by side with the plurality of coil electrodes in a through region of the ring.

14. A method of manufacturing a wireless IC device, comprising:

a step of forming coil electrodes on a plurality of insulating sheets; and

a step of stacking the plurality of insulating sheets on top of one another such that the coil electrodes are superposed with one another and thereby form a single ring when viewed in plan from a direction extending perpendicular or substantially perpendicular to a direction in which main surfaces of the plurality of insulating sheets extend.

15. The method of manufacturing the wireless IC device according to claim 14, further comprising:

a step of forming a first connector that is connected to a coil electrode of the coil electrode arranged on an insulating sheet the plurality of insulating sheets that is arranged on an uppermost side in the direction extending perpendicular or substantially perpendicular to the direction in which main surfaces of the plurality of insulating sheet extend;

a step of forming a second connector on an insulating sheet of the plurality of insulating sheets that is arranged on the uppermost side in the direction extending perpendicular or substantially perpendicular to the direction in which main surfaces of the plurality of insulating sheet extend;

a step of forming a third connector on one of the plurality of insulating sheets other than the insulating sheets arranged on the uppermost side and a lowermost side in the direction extending perpendicular or substantially perpendicular to the direction in which main surfaces of the plurality of insulating sheet extend and that is superposed with the second connector when viewed in plan from the direction extending perpendicular or substantially perpendicular to the direction in which main surfaces of the plurality of insulating sheet extend;

a step of forming a fourth connector that is connected to the coil electrode on the insulating sheet arranged on the lowermost side in the direction extending perpendicular or substantially perpendicular to the direction in which main surfaces of the plurality of insulating sheet extend and that is superposed with the second connector when viewed in plan from the direction extending perpendicular or substantially perpendicular to the direction in which main surfaces of the plurality of insulating sheet extend; and

a step of connecting the first connector, the second connector, the third connector, and the fourth connector together, after stacking the plurality of insulating sheets on top of one another.

16. The method of manufacturing a wireless IC device according to claim 15, further comprising:

a step of mounting a wireless IC that processes transmission and reception signals such that the wireless IC is connected to the first connector and the second connector.

17. The method of manufacturing a wireless IC device according to claim 15, further comprising:

a step of mounting an electromagnetic coupling module that includes a wireless IC that processes transmission and reception signals and a feeder circuit board including an inductance element that is connected to the wireless IC so that the electromagnetic coupling module is connected to the first connector and the second connector.

18. The method of manufacturing a wireless IC device according to claim 14, further comprising:

a step of forming a connection conductor arranged to connect the coil electrodes on the plurality of insulating sheets to one another.