×

LOW TEMPERATURE AMORPHOUS SILICON SACRIFICIAL LAYER FOR CONTROLLED ADHESION IN MEMS DEVICES

  • US 20110051224A1
  • Filed: 11/04/2010
  • Published: 03/03/2011
  • Est. Priority Date: 06/05/2008
  • Status: Active Grant
First Claim
Patent Images

1. An unreleased MEMS substrate comprising:

  • an optical stack;

    a sacrificial layer comprising amorphous silicon; and

    a metal layer overlaying and forming an interface with the sacrificial layer;

    wherein the interface of the sacrificial layer and the metal layer comprises a surface roughness that is effective to reduce stiction between the metal layer and the optical stack after removal of the sacrificial layer to form a cavity.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×