LIGHT-EMITTING DIODE

• US 20110062483A1
• Filed: 08/13/2010
• Published: 03/17/2011
• Est. Priority Date: 09/15/2009
• Status: Active Grant

• Current Assignee: Maintek Computer Company Limited (Pegatron Corporation), Pegatron Corporation
• Original Assignee: Maintek Computer Company Limited (Pegatron Corporation), Pegatron Corporation
• Inventors: Chan, Ming-Wei, Wang, Wenbing
• Granted Patent: US 8,294,169 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements
• CPC Class Codes: H05K 2201/062 Means for thermal insulation, e.g. for protection of parts
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2203/044 Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
• CPC Class Codes: H05K 2203/304 Protecting a component during manufacturing
• CPC Class Codes: H05K 3/3447 Lead-in-hole components H05K3/3415 takes precedence
• CPC Class Codes: H05K 3/3468 Applying molten solder

Abstract

This invention provides a light-emitting diode (LED). The LED is electrically connected with a circuit board. The LED includes a light-emitting chip, an encapsulating element, a lead, and a heat insulating element. The encapsulating element encapsulates the light-emitting chip. The lead is coupled with the light-emitting chip and the circuit board. The lead and the encapsulating element form a first connecting place. The lead and the circuit board form a second connecting place. The heat insulating element is disposed between the first connecting place and the second connecting place.

Claims

1. A light-emitting diode (LED) electrically connected with a circuit board, the LED comprising:

a light-emitting chip;

an encapsulating element encapsulating the light-emitting chip;

a lead coupled with the light-emitting chip and the circuit board, the lead and the encapsulating element forming a first connecting place, the lead and the circuit board forming a second connecting place; and

a heat insulating element disposed between the first connecting place and the second connecting place.

2. The LED according to claim 1, wherein the lead is L-shaped.

3. The LED according to claim 2, wherein the heat insulating element is disposed at a bending place of the L-shaped lead.

4. The LED according to claim 1, wherein the LED further comprises a gold wire and a covering element, the gold wire is coupled with the light-emitting chip and the lead, and the covering element covers a portion of the lead.

5. The LED according to claim 1, wherein the heat insulating element is made of a red adhesive or an ultraviolet curable adhesive.

6. The LED according to claim 1, wherein the encapsulating element is made of epoxy and a glass transition temperature of the encapsulating element is 130 degrees Celsius.