LIGHT-EMITTING DEVICE AND ILLUMINATION DEVICE

• US 20110068674A1
• Filed: 09/17/2010
• Published: 03/24/2011
• Est. Priority Date: 09/24/2009
• Status: Active Grant

• Current Assignee: Toshiba Lighting & Technology Corporation (Toshiba Corporation)
• Original Assignee: Toshiba Lighting & Technology Corporation (Toshiba Corporation)
• Inventors: Sanpei, Tomohiro, TAKENAKA, Erika, Idezuki, Takeo
• Granted Patent: US 8,354,783 B2
• Time in Patent Office: Days
• US Class Current: 313/318.07
• CPC Class Codes: F21K 9/23 Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2933/005 relating to encapsulations

Abstract

According to one embodiment, a light-emitting device includes a substrate including power-supply conductors, a frame member, and a sealing member. The power-supply conductors are formed on the substrate. A plurality of light-emitting elements including electrodes are mounted on the substrate. The electrodes of the light-emitting elements adjacent to the power-supply conductors are electrically connected to the power-supply conductors by a plurality of bonding wires. The frame member is made of resin which is coated on the substrate so as to surround the light-emitting elements and the bonding wires. The sealing member is filled in an area surrounded by the frame member and seals the light-emitting elements and the bonding wires.

Claims

1. A light-emitting device comprising:

a substrate comprising power-supply conductors which are formed on the substrate;

a plurality of light-emitting elements mounted on the substrate, each of the light-emitting elements comprising electrodes;

a plurality of bonding wires which electrically connect the electrodes of particular ones of the light-emitting elements to the power-supply conductors, the particular ones of the light-emitting elements being adjacent to the power-supply conductors;

a frame member made of resin which is coated on the substrate so as to surround the light-emitting elements mounted on the substrate and the bonding wires; and

a sealing member which is filled in an area surrounded by the frame member and seals the light-emitting elements and the bonding wires.

2. The light-emitting device of claim 1, wherein the frame member comprises a thick part where the resin is coated double.

3. The light-emitting device of claim 2, wherein the frame member has a polygonal shape which has a plurality of corners and a plurality of edges connecting the corners, the thick part being positioned at one of the edges.

4. The light-emitting device of claim 2, wherein the frame member has a polygonal shape which has a plurality of corners and a plurality of edges connecting the corners, the resin is coated on the substrate along a locus which corresponds to the polygonal shape and starts from one of the plurality of corners as a start point, and an end point of the locus is positioned on one of the edges immediately after passing the stare point.

5. An illumination device comprising a body, and a light-emitting device supported on the body, wherein

the light-emitting device comprises:

a substrate comprising power-supply conductors which are formed on the substrate;

a plurality of light-emitting elements mounted on the substrate, each of the light-emitting elements comprising electrodes;

a plurality of bonding wires which connect the electrodes of particular ones of the light-emitting elements to the power-supply conductors, the particular ones of the light-emitting elements being adjacent to the power-supply conductors;

a frame member made of resin which is coated on the substrate so as to surround the light-emitting elements mounted on the substrate and the bonding wires; and

a sealing member which is filled in an area surrounded by the frame member and seals the light-emitting elements and the bonding wires.