SUBSTRATE LAYER ADAPTED TO CARRY SENSORS, ACTUATORS OR ELECTRICAL COMPONENTS

• US 20110069459A1
• Filed: 05/18/2009
• Published: 03/24/2011
• Est. Priority Date: 05/23/2008
• Status: Active Grant

• Current Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Original Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Inventors: Padiy, Alexander
• Granted Patent: US 9,587,991 B2
• Time in Patent Office: Days
• US Class Current: 361/748
• CPC Class Codes: A61B 2562/0271 Thermal or temperature sensors
• CPC Class Codes: A61B 2562/0276 comprising a thermosensitive compound
• CPC Class Codes: A61B 2562/164 the sensor is mounted in or on a conformable substrate or carrier
• CPC Class Codes: A61B 5/01 Measuring temperature of body parts ; Diagnostic temperature sensing, e.g. for malignant or inflamed tissue clinical contact thermometers G01K13/20
• CPC Class Codes: A61B 5/68 Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient
• CPC Class Codes: G01K 1/165 for application in zero heat flux sensors
• CPC Class Codes: G01K 13/20 Clinical contact thermometers for use with humans or animals
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 428/24314 Slit or elongated

Abstract

This invention relates to a substrate layer structure adapted to carry electronic device, or components, or electro-mechanical, or electro-chemical sensors, or a combination thereof, and adapted to be attached to a surface of a human or animal body or biological species. The surface of the flexible substrate layer structure is a patterned structure of pre-fixed geometry-formed by one or more slits, but this geometry being selected such that the stretchability of the substrate layer structure becomes adapted to the geometry of the body surface under it.

Claims

1. A substrate layer structure (100) adapted to carry sensors, actuators, electronic components, or a combination thereof (802, 804), and adapted to be attached to a surface of a human or animal body or biological species,

wherein the surface of the flexible substrate layer structure is a patterned structure of pre-fixed geometry formed by one or more slits (101-701, 502-702), the geometry being selected such that the stretchability of the substrate layer structure (100) becomes adapted to the geometry of the body surface under it.

2. A substrate layer structure according to claim 1, wherein the substrate layer structure (100) is made of an industry-standard printed circuit (PCB) board material.

3. A substrate layer structure according to claim 2, wherein the one or more slits (101-701, 502-702) and thus the patterned structure of pre-fixed geometry is formed by cutting the slits into the surface of the substrate layer structure.

4. A substrate layer structure according to claim 3, wherein the substrate layer structure (100) is a sandwiched like structure formed by two or more of the PCB patterned structures.

5. A substrate layer structure according to claim 1, wherein the patterned structure of pre-fixed geometry is formed by:

one or more substantially parallel straight lined slits (101), or

one or more substantially parallel S-shaped slits (201), or

a spiral shaped slit (301), or

a dual spiral shaped slit (401), or

a multi-spiral shaped slit, or

a slit forming a cam-like structure (501-502, 601-602), or

a combination of two or more spiral shaped slits,

a combination of a at least one S-shaped slit and at least one slit forming cam-like structure (701-702),

a combination of two or more of the above.

6. A method of manufacturing a substrate layer structure as claimed in claim 1, comprising:

providing said substrate layer structure (100),

forming said one or more slits (101-701, 502-702) of pre-fixed geometry into the surface of the substrate layer structure, and

placing or attaching said sensors, actuators, electronic components, or a combination thereof (802, 804), to the substrate layer structure (100).

7. A sensor assembly comprising the substrate layer structure (100) as claimed in claim 1 and sensors, actuators, electronic components, or a combination thereof (802, 804) attached or integrated into the substrate layer structure (100).