Semiconductor device and method for manufacturing same
2 Assignments
0 Petitions
Accused Products
Abstract
A hard mask material film is formed on a semiconductor substrate and a recess is formed immediately below an opening in an upper surface of the semiconductor substrate. Next, a p-type region is formed immediately below the recess by implanting impurities into an imaging region using the hard mask material film as a mask. Moreover, a trench is formed by further processing the recess in a processing region. A half-buried dielectric film and a STI are formed by burying a dielectric material in the recess and the trench to remove the hard mask material film. Next, two electrodes are formed so as to overlap the half-buried dielectric film and the STI, respectively, and impurities are implanted into the imaging region using one electrode and the half-buried dielectric film as a mask, and hence a n-type region constituting a photodiode is formed in a region being in contact with the p-type region in the semiconductor substrate.
6 Citations
32 Claims
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1-20. -20. (canceled)
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21. A semiconductor device, comprising:
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a semiconductor substrate; a first-conductivity-type region formed in an upper portion of the semiconductor substrate and having a first conductivity type; a second-conductivity-type region formed in an upper portion of the semiconductor substrate, being in contact with the first-conductivity-type region, and having a second conductivity type that is different from the first conductivity type; and a buried dielectric film provided immediately above the second-conductivity-type region, having a lower portion buried in the semiconductor substrate and an upper portion protruding from an upper surface of the semiconductor substrate, a lower surface of the buried dielectric film being at a level higher than a lower surface of the first-conductive-type region, the second-conductivity-type region and the buried dielectric film being in contact with the first-conductivity-type region and isolating the first-conductivity-type region from a region that is on opposite side of the first-conductivity-type region across the second-conductivity-type region and is in contact with the second-conductivity-type region. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32)
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Specification