Method of Fabricating Capacitive Touch-Screen Panel

• US 20110099805A1
• Filed: 09/25/2009
• Published: 05/05/2011
• Est. Priority Date: 02/23/2009
• Status: Active Grant

• Current Assignee: TK Chemical Corporation
• Original Assignee: E&H. Co., Ltd.
• Inventors: Lee, Yong Hoon
• Granted Patent: US 9,360,969 B2
• Time in Patent Office: Days
• US Class Current: 29/846
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

Provided is a method of fabricating a capacitive touch-screen panel. The method includes preparing first and second substrates having first lateral surfaces on which first and second transparent conductive layers for forming first and second transparent electrode pattern units are disposed. Each of the first and second substrates has a screen region and an inactive region. Second lateral surfaces of the first and second substrates are bonded to each other by an interlayer adhesive. First and second metal layers for forming first and second outer electrode interconnections are disposed on exposed surfaces of the first and second transparent conductive layers, respectively. Double-side exposure and etching processes are performed to form the first transparent electrode pattern unit and the first outer electrode interconnection on the screen region and the inactive region of the first lateral surface of the first substrate, respectively, and simultaneously, form the second transparent electrode pattern unit and the second outer electrode interconnection on the screen region and the inactive region of the first lateral surface of the second substrate, respectively. The first and second outer electrode interconnections are electrically connected to the first and second transparent electrode pattern units, respectively. The method can efficiently reduce the fabrication cost of a touch screen and greatly simplify the fabrication process of the touch-screen panel.

Claims

1. A method of fabricating capacitive touch-screen panel, comprising:

preparing first and second substrates having first lateral surfaces on which first and second transparent conductive layers for forming first and second transparent electrode pattern units are disposed, each substrate having a screen region and an inactive region;

bonding second lateral surfaces of the first and second substrates to each other by an interlayer adhesive;

depositing first and second metal layers for forming first and second outer electrode interconnections on exposed surfaces of the first and second transparent conductive layers, respectively; and

performing double-side exposure and etching processes to form the first transparent electrode pattern unit and the first outer electrode interconnection on the screen region and the inactive region of the first lateral surface of the first substrate, respectively, and simultaneously, form the second transparent electrode pattern unit and the second outer electrode interconnection on the screen region and the inactive region of the first lateral surface of the second substrate, respectively, wherein the first and second outer electrode interconnections are electrically connected to the first and second transparent electrode pattern units, respectively.

3. The method of claim 1, wherein forming the first and second transparent electrode pattern units and the first and second outer electrode interconnections comprises:

sequentially blanket etching the first metal layer and the first transparent conductive layer to expose predetermined portions of the screen region and the inactive region of the first lateral surface of the first substrate, and the second metal layer and the second transparent conductive layer to expose predetermined portions of the screen region and the inactive region of the first lateral surface of the second substrate using a photolithography process; and

selectively etching the first and second metal layers to expose the first and second transparent conductive layers on the screen regions of the first and second substrates.

11. The method of any one of claim 1, claim 2, claim 4, claim 6, claim 7 or claim 9, wherein each of the first and second substrates is a transparent film formed of at least one selected from the group consisting of glass, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (PI), and acryl.

19. The method of any one of claim 1, claim 2, claim 4, claim 6, claim 7, claim 9 or claim 13 to claim 16, wherein the first and second transparent conductive layers are formed of at least one selected from the group consisting of indium tin oxide (ITO), indium zinc oxide (IZO), aluminum (Al)-doped ZnO (AZO), carbon nanotubes (CNT), poly(3,4-ethylenedioxythiophene) (PEDOT), silver (Ag) transparent ink, and copper (Cu) transparent ink.

20. The method of any one of claim 1, claim 2, claim 4, claim 6, claim 7, claim 9 or claim 13 to claim 16, wherein depositing the first and second metal layers comprises depositing at least one material selected from the group consisting of copper (Cu), nickel (Ni), aluminum (Al), chromium (Cr), molybdenum (Mo), silver (Ag), and gold (Au) using a sputtering process.

21. The method of any one of claim 1, claim 2, claim 4, claim 6, claim 7, claim 9 or claim 13 to claim 16, wherein a plurality of first transparent electrode patterns of the first transparent electrode pattern unit are spaced a predetermined distance apart from one another in a widthwise direction and connected to one another in a lengthwise direction such that vertices of a plurality of triangular or rectangular sensing pads are spaced a predetermined distance apart from one another, and a plurality of second transparent electrode patterns of the second transparent electrode pattern unit are spaced a predetermined distance apart from one another in a lengthwise direction at right angles to one another between the respective first transparent electrode patterns and connected to one another in a widthwise direction such that vertices of a plurality of triangular or rectangular sensing pads are spaced a predetermined distance apart from one another so that the first and second transparent electrode pattern units form a right-angled grating shape.

2. A method of fabricating a capacitive touch-screen panel, comprising:

preparing first and second substrates having first lateral surfaces on which first and second transparent conductive layers for forming first and second transparent electrode pattern units are disposed, each substrate having a screen region and an inactive region;

depositing first and second metal layers for first and second outer electrode interconnections on exposed surfaces of the first and second transparent conductive layers;

bonding second lateral surfaces of the first and second substrates to each other by an interlayer adhesive; and

performing double-side exposure and etching processes to form the first transparent electrode pattern unit and the first outer electrode interconnection on the screen region and the inactive region of the first lateral surface of the first substrate, respectively, and simultaneously, form the second transparent electrode pattern unit and the second outer electrode interconnection on the screen region and the inactive region of the first lateral surface of the second substrate, respectively, wherein the first and second outer electrode interconnections are electrically connected to the first and second transparent electrode pattern units, respectively.

4. A method of fabricating a capacitive touch-screen panel, comprising:

preparing first and second substrates having first lateral surfaces on which first and second transparent conductive layers for forming first and second transparent electrode pattern units are disposed, each substrate having a screen region and an inactive region;

bonding second lateral surfaces of the first and second substrates to each other by an interlayer adhesive, and forming at least one through hole for forming at least one via hole on the inactive regions of the first and second substrates to penetrate the first and second transparent conductive layers;

depositing the first and second metal layers on exposed surfaces of the first and second transparent conductive layers having the respective through holes; and

performing double-side exposure and etching processes to form the first transparent electrode pattern unit on the screen region of the first lateral surface of the first substrate and simultaneously, form the second transparent electrode pattern unit on the screen region of the first lateral surface of the second substrate, and to form first and second outer electrode interconnections on the inactive region of the first lateral surface of the second substrate, wherein the first and second outer electrode interconnections are electrically connected to the first and second transparent electrode pattern units, respectively, through the respective via holes.

5. The method of claim 4, wherein forming the first and second transparent electrode pattern units and the first and second outer electrode interconnections comprises:

sequentially blanket etching the first metal layer and the first transparent conductive layer to expose predetermined portions of the screen region and the inactive region of the first lateral surface of the first substrate, and the second metal layer and the second transparent conductive layer to expose predetermined portions of the screen region and the inactive region of the first lateral surface of the second substrate using a photolithography process; and

selectively etching the first and second metal layers on the screen regions of the first and second substrates.

12. The method of any claim of claim 4 or claim 9, further comprising bonding a single-sided external driver to the inactive region of the second substrate to be electrically connected to the first and second outer electrode interconnections.

6. A method of fabricating a capacitive touch-screen panel, comprising:

preparing first and second substrates having first lateral surfaces on which first and second transparent conductive layers for forming first and second transparent electrode pattern units are disposed, each substrate having a screen region and an inactive region;

bonding second lateral surfaces of the first and second substrates to each other by an interlayer adhesive;

selectively depositing first and second metal layers for forming first and second outer electrode interconnections using first and second masks on predetermined exposed surfaces of the first and second transparent conductive layers formed on the inactive regions of the first and second substrates; and

performing double-side exposure and etching processes to form the first transparent electrode pattern unit and the first outer electrode interconnection on the screen region and the inactive region of the first lateral surface of the first substrate, respectively, and simultaneously, form the second transparent electrode pattern unit and the second outer electrode interconnection on the screen region and the inactive region of the first lateral surface of the second substrate, respectively, wherein the first and second outer electrode interconnections are electrically connected to the first and second transparent electrode pattern units, respectively.

8. The method of any claim of claim 6 or claim 7, wherein forming the first and second transparent electrode pattern units and the first and second outer electrode interconnections comprises blanket etching the first and second transparent conductive layers and the first and second metal layers using a photolithography process to expose predetermined portions of the screen region and the inactive region of the first lateral surfaces of the first and second substrates, respectively.

7. A method of fabricating a capacitive touch-screen panel, comprising:

preparing first and second substrates having first lateral surfaces on which first and second transparent conductive layers for forming first and second transparent electrode pattern units are disposed, each substrate having a screen region and an inactive region;

selectively depositing first and second metal layers for forming first and second outer electrode interconnections using first and second masks on predetermined exposed surfaces of the first and second transparent conductive layers formed on the inactive regions of the first and second substrates, respectively;

bonding second lateral surfaces of the first and second substrates to each other by an interlayer adhesive; and

performing double-side exposure and etching processes to form the first transparent electrode pattern unit and the first outer electrode interconnection on the screen region and the inactive region of the first lateral surface of the first substrate, respectively, and simultaneously, form the second transparent electrode pattern unit and the second outer electrode interconnection on the screen region and the inactive region of the first lateral surface of the second substrate, respectively, wherein the first and second outer electrode interconnections are electrically connected to the first and second transparent electrode pattern units, respectively.

9. A method of fabricating a capacitive touch-screen panel, comprising:

preparing first and second substrates having first lateral surfaces on which first and second transparent conductive layers for forming first and second transparent electrode pattern units are disposed, each substrate having a screen region and an inactive region;

bonding second lateral surfaces of the first and second substrates by an interlayer adhesive, and forming at least one through hole for forming at least one via hole on the inactive regions of the first and second substrates to penetrate the first and second transparent conductive layers;

selectively depositing first and second metal layers using first and second masks on predetermined exposed surfaces of the first and second transparent conductive layers formed on the inactive regions of the first and second substrates including the respective via holes; and

performing double-side exposure and etching processes to form the first transparent electrode pattern unit on the screen region of the first lateral surface of the first substrate and simultaneously, form the second transparent electrode pattern unit on the screen region of the first lateral surface of the second substrate, and to form first and second outer electrode interconnections on the inactive region of the first lateral surface of the second substrate, wherein the first and second outer electrode interconnections are electrically connected to the first and second transparent electrode pattern units, respectively, through the respective via holes.

10. The method of claim 9, wherein forming the first and second transparent electrode pattern units and the first and second outer electrode interconnections comprises blanket etching the first and second transparent conductive layers and the first and second metal layers using a photolithography process to expose predetermined regions of the screen region and the inactive region of the first lateral surfaces of the first and second substrates, respectively.

13. A method of fabricating a capacitive touch-screen panel, comprising:

preparing a substrate having first and second lateral surfaces on which first and second transparent conductive layers for forming first and second transparent electrode pattern units are disposed, the substrate having a screen region and an inactive region;

depositing first and second metal layers for forming first and second outer electrode interconnections on exposed surfaces of the first and second transparent conductive layers; and

performing double-side exposure and etching processes to form the first transparent electrode pattern unit and the first outer electrode interconnection on the screen region and the inactive region of the first lateral surface of the substrate, respectively, and simultaneously, form the second transparent electrode pattern unit and the second outer electrode interconnection on the screen region and the inactive region of the second lateral surface of the substrate, respectively, wherein the first and second outer electrode interconnections are electrically connected to the first and second transparent electrode pattern units, respectively.

17. The method of any one of claim 13 to claim 16, wherein the substrate is a transparent film formed of at least one selected from the group consisting of PET, PI, acryl, PEN, and glass.

14. A method of fabricating a capacitive touch-screen panel, comprising:

preparing a substrate having first and second lateral surfaces on which first and second transparent conductive layers for forming first and second transparent electrode pattern units are disposed, the substrate having a screen region and an inactive region;

forming a plurality of through holes for forming a plurality of via holes on the inactive region of the substrate to penetrate the first and second transparent conductive layers;

depositing first and second metal layers on exposed surfaces of the first and second transparent conductive layers having the respective through holes; and

performing double-side exposure and etching processes to form the first transparent electrode pattern unit on the screen region of the first lateral surface of the substrate and simultaneously, form the second transparent electrode pattern unit on the screen region of the second lateral surface of the substrate, and to form first and second outer electrode interconnections on the inactive region of the second lateral surface of the substrate, wherein the first and second outer electrode interconnections are electrically connected to the first and second transparent electrode pattern units, respectively, through the respective via holes.

18. The method of any one of claim 14 or claim 16, further comprising bonding a single-sided external driver to the inactive region of the substrate to be electrically connected to the first and second outer electrode interconnections.

15. A method of fabricating a capacitive touch-screen panel, comprising:

preparing a substrate having first and second lateral surfaces on which first and second transparent conductive layers for forming first and second transparent electrode pattern units are disposed, the substrate having a screen region and an inactive region;

selectively depositing first and second metal layers for forming first and second outer electrode interconnections using first and second masks on predetermined exposed surfaces of the first and second transparent conductive layers formed on the inactive region of the substrate; and

performing double-side exposure and etching processes to form the first transparent electrode pattern unit and the first outer electrode interconnection on the screen region and the inactive region of the first lateral surface of the substrate, respectively, and simultaneously, form the second transparent electrode pattern unit and the second outer electrode interconnection on the screen region and the inactive region of the second lateral surface of the substrate, respectively, wherein the first and second outer electrode interconnections are electrically connected to the first and second transparent electrode pattern units, respectively.

16. A method of fabricating a capacitive touch-screen panel, comprising:

preparing a substrate having first and second lateral surfaces on which first and second transparent conductive layers for forming first and second transparent electrode pattern units are disposed, the substrate having a screen region and an inactive region;

forming at least one through hole for forming at least one via hole on the inactive region of the substrate to penetrate the first and second transparent conductive layers;

selectively depositing the first and second metal layers using first and second masks on predetermined exposed surfaces of the first and second transparent conductive layers formed on the inactive regions of the substrate; and

performing double-side exposure and etching processes to form the first transparent electrode pattern unit on the screen region of the first lateral surface of the substrate and simultaneously, form the second transparent electrode pattern unit on the screen region of the second lateral surface of the substrate, and to form first and second outer electrode interconnections on the inactive region of the second lateral surface of the substrate, wherein the first and second outer electrode interconnections are electrically connected to the first and second transparent electrode pattern units, respectively.