ELECTRONIC PACKAGE, DISPLAY DEVICE AND ELECTRONIC APPARATUS

• US 20110120770A1
• Filed: 06/23/2009
• Published: 05/26/2011
• Est. Priority Date: 08/22/2008
• Status: Abandoned Application

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Yokonuma, Shinsuke
• Application Number:
  US13/055,141
• Publication Number:
  US 20110120770A1
• Time in Patent Office: Days
• US Class Current: 174/94.S
• CPC Class Codes: G02F 1/133334 Electromagnetic shields
• CPC Class Codes: H05K 1/0215 Grounding of printed circuits by connection to external grounding means
• CPC Class Codes: H05K 1/118 specially for flexible printed circuits, e.g. using folded portions
• CPC Class Codes: H05K 2201/0311 Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
• CPC Class Codes: H05K 2201/0397 Tab forming integral conductive tabs H05K3/4092
• CPC Class Codes: H05K 2201/056 Folded around rigid support or component
• CPC Class Codes: H05K 2201/09054 Raised area or protrusion of metal substrate
• CPC Class Codes: H05K 2201/091 Locally and permanently deformed areas including dielectric material
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 3/326 the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits H05K3/365 takes precedence

Abstract

Provided is an electronic package wherein a built-in chassis (CS) and an FPC substrate (11) including a ground pattern (12) are mounted on a front bezel (BZ1) and a back bezel (BZ2) formed of a conductive material. A ground pattern (12) is arranged between the back bezel (BZ2) and the built-in chassis (CS), and the back bezel (BZ2) includes a claw section (22) for pressing the ground pattern (12) to the built-in chassis (CS). The claw section (22) has elasticity when the claw section is in a linear state, and presses the ground pattern (12) by a leading end (22T) formed by bending an outer periphery.

Claims

1. :

An electronic package in which a chassis and a circuit board including a ground pattern are disposed in a housing, wherein

the ground pattern is present between the housing and the chassis;

the housing includes a push piece that pushes the ground pattern against the chassis; and

the push piece has elasticity in a linear state and pushes the ground pattern by means of a tip end whose outer edge is rounded.

3. :

A display device incorporating the electronic package according to claim 1.

4. :

An electronic apparatus incorporating the display device according to claim 3.

2. :

An electronic package in which a chassis and a circuit board including a ground pattern are disposed in a housing, wherein

the ground pattern is present between the housing and the chassis;

the housing includes a push piece that pushes the ground pattern against the chassis; and

the push piece swells from a surface of the housing, a tip end of the swelling is formed into a curved surface, and the tip end pushes the ground pattern.

5. :

A display device incorporating the electronic package according to claim 2.

6. :

An electronic apparatus incorporating the display device according to claim 5.