POWER SURFACE MOUNT LIGHT EMITTING DIE PACKAGE

• US 20110121345A1
• Filed: 02/07/2011
• Published: 05/26/2011
• Est. Priority Date: 09/04/2002
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Andrews, Peter Scott, Loh, Ban P.
• Granted Patent: US 8,530,915 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/0102 Calcium [Ca]
• CPC Class Codes: H01L 2924/01025 Manganese [Mn]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements
• CPC Class Codes: H01L 33/641 characterized by the materials
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

A light emitting die package is provided which includes a metal substrate having a first surface and a first conductive lead on the first surface. The first conductive lead is insulated from the substrate by an insulating film. The first conductive lead forms a mounting pad for mounting a light emitting device. The package includes a metal lead electrically connected to the first conductive lead and extending away from the first surface.

Claims

1. A light emitting die package, comprising:

a substrate having a first surface,

a first conductive lead on the first surface that is insulated from the substrate by an insulating film, the first conductive lead forming a mounting pad for mounting a light emitting device, and

a lead electrically connected to the first conductive lead and extending away from the first surface.

2. The package of claim 1, further comprising:

a second conductive lead, and a light emitting diode (LED) mounted on the substrate and connected to the first and second conductive leads.

3. The package of claim 2, wherein the LED is encapsulated within optically clear polymer.

4. The package of claim 1, wherein the substrate comprises a metal selected from the group consisting of copper, aluminum and a copper/aluminum alloy.

5. The package of claim 1, wherein the insulating film comprises a ceramic polymer film.

6. The package of claim 2, wherein the substrate comprises a second surface opposite the first surface, and further comprising at least one via hole through the substrate.

7. The package of claim 6, wherein a surface of the via hole is coated with an insulating film coating.

8. The package of claim 6, wherein the via hole includes a conductive trace there through, the conductive trace being insulated from the substrate by the insulating film coating, being in electrical contact with one of the first and second conductive leads.

9. The package of claim 1, wherein the lead electrically connected to the first conductive lead extends away from the mounting pad and around a side of the substrate.

10. The package of claim 1, further comprising:

a reflector plate coupled to the substrate and substantially surrounding the mounting pad, the reflector plate defining a reflection surface.

11. The package of claim 10, wherein the reflector plate comprises at least one leg mechanically engaging the substrate for increased thermal transfer.

12. The package of claim 10, wherein the substrate comprises flanges along at least one side for mechanically engaging the reflector plate.

13. The package of claim 10, wherein the reflector plate is a composed of a material having high thermal conductivity.

14. The package of claim 1, further comprising:

a lens substantially covering the mounting pad.

15. The package of claim 14, wherein the lens includes a trough adapted to receive optical chemicals.

16. The package of claim 14, wherein the lens includes materials selected from the group consisting of frequency shifting compounds, a diffusant, and a phosphor.