ELECTRICAL DEVICE HAVING BOARDLESS ELECTRICAL COMPONENT MOUNTING ARRANGEMENT

• US 20110146068A1
• Filed: 03/02/2011
• Published: 06/23/2011
• Est. Priority Date: 08/21/2006
• Status: Active Grant

• Current Assignee: Innotec, Corp.
• Original Assignee: Innotec, Corp.
• Inventors: Weeda, Matthew S., Israels, Kyle A., Mulder, Jason R., Vander Kuyl, Paul T., Lanser, Michael L., Veenstra, Thomas J., Vander Pol, Mark W.
• Granted Patent: US 8,764,240 B2
• Time in Patent Office: Days
• US Class Current: 29/841
• CPC Class Codes: B29C 45/14639 for obtaining an insulating effect, e.g. for electrical components
• CPC Class Codes: B29C 45/1671 with an insert
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 31/04 Provision of filling media
• CPC Class Codes: F21W 2106/00 Interior vehicle lighting devices
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H05K 1/187 the patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate, e.g. on a temporary carrier
• CPC Class Codes: H05K 2201/09118 Moulded substrate
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2203/1316 Moulded encapsulation of mounted components
• CPC Class Codes: H05K 2203/1476 Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
• CPC Class Codes: H05K 3/202 using self-supporting metal foil pattern
• CPC Class Codes: Y10T 29/49146 with encapsulating, e.g., potting, etc.

Abstract

An electrical device such as an LED light assembly includes a conductive circuit and one or more electrical components connected to the circuit. The electrical components and the circuit are at least partially overmolded with a thermoplastic polymer material to encapsulate the components. The material utilized to cover the circuit and/or electrical components may also be utilized to form a housing or other structure of a finished part.

Claims

1. A method of forming an electrical device, the method comprising:

cutting a sheet of conductive material to form a circuit having at least two electrically conductive circuit elements, each having first and second opposite sides;

securing at least one electrical component to the first sides of the circuit elements;

positioning the circuit and electrical component in a first mold cavity having a first shape;

molding thermoplastic polymer material around the electrical component while it is in the first mold cavity to encapsulate the electrical component in a protective enclosure of polymer material and define an intermediate light assembly, the protective enclosure having a first portion in contact with the first sides of the conductive circuit elements around the electrical component, the protective enclosure having peripheral edge portions extending around at least a portion of the electrical component;

positioning the circuit element and electrical component in a second mold cavity having a second shape that is substantially different than the first shape;

molding thermoplastic polymer material over at least a portion of the protective enclosure while at least a substantial portion of the intermediate light assembly is disposed in the second mold cavity.

2. The method of claim 1, wherein:

the first sides of the conductive circuit elements define generally flat first surface portions;

the peripheral edge portions extend to the flat first surface portion and define a peripheral edge surface that is transverse to the flat surface portion.

3. The method of claim 2, wherein:

an exposed portion of the first surface portion is not covered by the protective enclosure of polymer prior to positioning the circuit and electrical component in the second mold cavity; and

including;

molding thermoplastic polymer material over the exposed portion.

4. The method of claim 3, wherein:

the first mold cavity is shaped to mold additional thermoplastic polymer material over at least a substantial portion of the first sides of the conductive circuit elements, wherein the additional thermoplastic material includes an edge portion that is spaced apart from the protective enclosure to define a groove extending around the electrical component.

5. The method of claim 4, wherein:

the groove formed by the first mold cavity is generally C-shaped in plan view, and wherein a bridge of polymer material extends from the additional polymer material to the protective enclosure.

6. The method of claim 4, wherein:

the groove defines a base surface, and at least a portion of the base surface comprises exposed conductive material.

7. The method of claim 1, wherein:

the step of securing at least one electrical circuit component includes soldering the circuit component to the circuit element.

8. The method of claim 1, wherein:

the step of securing at least one electrical circuit component includes deforming the conductive circuit element to crimp the circuit component to the conductive circuit element.

9. The method of claim 1, wherein:

the electrical component comprises an LED, and the electrical device comprises a light.

10. The method of claim 9, including:

molding a light-control feature over the LED utilizing the thermoplastic material.

11. The method of claim 9, wherein:

at least one additional electrical component in addition to the LED is secured to the circuit element; and

a protective enclosure of thermoplastic polymer material is molded over the additional electrical component.

12. The method of claim 9, wherein:

the enclosure is generally dome-shaped.

13. The method of claim 1, wherein:

the electrical component comprises an integrated circuit having a generally quadrilateral perimeter;

the peripheral edge of the enclosure of polymer material has a generally quadrilateral shape.

14. The method of claim 1, including:

forming a first generally flat portion of the conductive circuit element;

forming a second portion of the conductive circuit element that extends transversely from the first portion; and

molding polymer material over at least a substantial portion of the first and second portions of the conductive circuit element.

15. The method of claim 14, wherein:

the electrical device comprises a light, and the electrical component comprises an LED that is secured to the first portion of the conductive circuit element.

16. The method of claim 14, including:

forming a third portion of the conductive circuit element that extends transversely from the second portion;

forming at least two prongs that extend from the third portion; and

molding a receptacle in the form of a tubular wall forming a cavity having an open outer end, wherein the prongs are disposed in the cavity.

17. The method of claim 1, wherein:

the conductive circuit element defines an outer edge; and

including;

molding thermoplastic material to form a mounting flange that extends outwardly from the outer edge.

18. The method of claim 1, wherein:

the electrical device includes first and second opposite sides, and a periphery extending around the electrical device; and

including;

molding thermoplastic polymer material to form at least a portion of the periphery, wherein a substantial portion of the periphery is non-linear.

19. The method of claim 18, wherein:

a substantial portion of the periphery is curved.

20. The method of claim 19, wherein:

the electrical device comprises a disk-shaped light having a circular periphery.

21. The method of claim 20, wherein:

a plurality of the electrical components comprise LEDs; and

wherein;

the first side of the electrical device includes a generally planar surface portion, and a plurality of discrete convex raised portions, aligned with the LEDs, and wherein the raised portions protrude outwardly from the planar surface portion.

22. A method of forming an electrical device, the method comprising:

forming a circuit having at least two electrically conductive circuit elements that are spaced apart to define gaps between the two electrically conductive circuit elements, and wherein the two electrically conductive circuit elements are initially interconnected by connecting portions that extend across the gaps and physically interconnect the two electrically conductive circuit elements, each electrically conductive circuit element having first and second opposite sides;

securing at least one electrical component to the first sides of the circuit elements;

forming an intermediate assembly by molding protective thermoplastic polymer material around the one electrical component to at least partially cover the one electrical component with the polymer material;

allowing the protective thermoplastic polymer material to solidify;

cutting the connecting portions such that the electrically conductive circuit elements are disconnected from one another;

molding additional thermoplastic polymer material over at least a portion of the protective thermoplastic polymer material; and

allowing the additional thermoplastic polymer material to solidify.

23. The method of claim 22, including:

providing a mold defining a first mold cavity;

positioning at least a portion of the two electrically conductive circuit elements and the one electrical component in the first mold cavity; and

molding protective thermoplastic polymer material in the first mold cavity.

24. The method of claim 23, including:

forming at least one opening through at least one of the two electrically conductive circuit elements;

providing the mold with a locating member;

positioning the portion of the two electrically conductive circuit elements and the one electrical component in the first mold cavity with the locating member in engagement with the one opening.

25. The method of claim 22, wherein:

the two electrically conductive circuit elements are formed from sheet metal.

26. The method of claim 22, wherein:

molding protective thermoplastic polymer material includes encapsulating the one electrical component with thermoplastic polymer material.

27. The method of claim 22, wherein:

the first sides of the first and second electrically conductive circuit elements have generally flat first side portions that are spaced apart to form a gap;

the one electrical component is secured to the generally flat first side portions with the one electrical component extending across the gap; and

the protective thermoplastic polymer material is formed into a protective enclosure extending at least partially over and around the one electrical component and in contact with the first sides of the first and second electrically conductive members.

28. The method of claim 27, wherein:

the protective enclosure is formed to include a peripheral surface portion extending around the one electrical component and transversely away from the generally flat first side portions of the first and second electrically conductive circuit elements.

29. The method of claim 28, wherein:

the peripheral surface portion intersects the flat first side portions to define a curved edge when viewed along an axis that is normal to the flat first side portions.

30. The method of claim 29, wherein:

the protective thermoplastic polymer material is formed to include first thermoplastic polymer material extending over at least a portion of the first sides of the first and second electrically conductive circuit elements adjacent the protective enclosure, wherein the first thermoplastic polymer material is spaced apart from the protective enclosure to form a gap, and including thermoplastic polymer material interconnecting the first thermoplastic polymer material and the protective thermoplastic polymer material.

31. The method of claim 30, including:

providing a mold cavity having a first portion that is utilized to form the first thermoplastic polymer material, and a second portion that is utilized to form the protective enclosure of thermoplastic polymer material, and a connecting portion forming a passageway extending between and fluidly interconnecting the first and second portions of the mold cavity; and

;

introducing molten thermoplastic material into the first portion of the mold cavity, and causing the molten thermoplastic polymer material to flow from the first portion of the mold cavity through the passageway and into the second portion of the mold cavity.

32. The method of claim 31, wherein:

the passageway restricts flow of molten thermoplastic polymer material from the first mold cavity portion to the second mold cavity portion, and prevents dislodgement of the one electrical component from the first and second electrically conductive circuit elements.

33. The method of claim 32, wherein:

the passageway has a cross-sectional area of approximately 0.0056 square inches.

34. The method of claim 31, wherein:

the passageway has a cross-sectional shape that is approximately semi-circular.

35. The method of claim 31, wherein:

the passageway defines a first volume; and

the second portion of the mold cavity defines a second volume that is much greater than the first volume.

36. The method of claim 31, wherein:

the mold cavity comprises a first mold cavity; and

including;

providing a second mold cavity;

removing the intermediate assembly from the first mold cavity;

positioning the intermediate assembly in the second mold cavity; and

introducing molten thermoplastic polymer material into the second mold cavity to thereby mold the additional thermoplastic polymer material over at least a portion of the protective thermoplastic polymer material.

37. The method of claim 22, including:

providing first and second electrical connectors that are electrically connected to the two electrically conductive circuit elements; and

forming the thermoplastic polymer material such that the first and second electrical connectors protrude outside the additional thermoplastic material after it solidifies.

38. The method of claim 37, wherein:

the first and second electrical connectors comprise prongs.

39. The method of claim 38, wherein:

the first and second electrically conductive members are made from sheet metal; and

the prongs are formed integrally from the sheet metal.

40. A method of forming an electrical device, the method including:

cutting sheet metal to form first and second conductive circuit elements having first and second sides and defining gaps between the first and second circuit elements;

securing a plurality of electrical components to the first and second conductive circuit elements;

providing a mold cavity having a first cavity portion and a second cavity portion, and a passageway defining a shape and interconnecting the first and second cavity portions;

molding first thermoplastic polymer material onto at least a portion of the first sides of the first and second conductive circuit elements by introducing molten thermoplastic polymer material into the first cavity portion;

causing molten thermoplastic polymer material to flow through the passageway from the first cavity portion to the second cavity portion to thereby mold protective thermoplastic polymer material over at least a portion of the first sides of the first and second conductive circuit elements;

permitting the thermoplastic polymer material in the mold cavity to solidify; and

wherein;

the thermoplastic polymer material forms enclosures that extend at least partially over and around the electrical components and contact the first sides of the first and second conductive circuit elements, and wherein the enclosures are connected to the first thermoplastic polymer material by thermoplastic polymer material forming a connector having a shape corresponding to the shape of the passageway.

41. The method of claim 40, wherein:

the enclosure is generally dome-shaped.

42. The method of claim 41, wherein:

the enclosure has a circular perimeter.

43. The method of claim 40, wherein:

the first thermoplastic polymer material and the thermoplastic polymer material forming the enclosure are spaced apart to define a gap therebetween.

44. The method of claim 43, wherein:

the gap extends around the enclosure and is generally C-shaped.

45. The method of claim 40, wherein:

the enclosure has a generally quadrilateral perimeter.

46. The method of claim 40, including:

providing a second mold cavity;

removing the first and second conductive circuit elements from the first mold cavity;

positioning at least a portion of the first and second conductive circuit elements in the second mold cavity; and

molding additional thermoplastic polymer material over at least one of the enclosures by introducing molten thermoplastic polymer material into the second mold cavity.