TEST SYSTEMS AND METHODS FOR TESTING ELECTRONIC DEVICES

• US 20110156734A1
• Filed: 12/27/2010
• Published: 06/30/2011
• Est. Priority Date: 12/31/2009
• Status: Active Grant

• Current Assignee: FormFactor Incorporated
• Original Assignee: FormFactor Incorporated
• Inventors: Berry, Tommie E., Wilson, Adrian S., Loranger, Marc, Slocum, Alexander H., Hobbs, Eric D., Breinlinger, Keith J.
• Granted Patent: US 8,587,331 B2
• Time in Patent Office: Days
• US Class Current: 324/750.19
• CPC Class Codes: G01R 31/2891 related to sensing or controlling of force, position, temperature G01R31/2874 takes precedence; sensing of force G01L; sensing of position G01B, G01D; sensing of temperature G01K; controlling in general G05

Abstract

Devices under test (DUTs) can be tested in a test system that includes an aligner and test cells. A DUT can be moved into and clamped in an aligned position on a carrier in the aligner. In the align position, electrically conductive terminals of the DUT can be in a predetermined position with respect to carrier alignment features of the carrier. The DUT/carrier combination can then be moved from the aligner into one of the test cells, where alignment features of the carrier are mechanically coupled with alignment features of a contactor in the test cell. The mechanical coupling automatically aligns terminals of the DUT with probes of the contactor. The probes thus contact and make electrical connections with the terminals of the DUT. The DUT is then tested. The aligner and each of the test cells can be separate and independent devices so that a DUT can be aligned in the aligner while other DUTs, having previously been aligned to a carrier in the aligner, are tested in a test cell.

Claims

1. A process of testing DUTs in a test system comprising an aligner and test cells, said process comprising:

positioning in said aligner a first DUT on a first carrier in an aligned position in which electrically conductive terminals of said first DUT are in a predetermined position with respect to carrier alignment features of said first carrier;

clamping said first DUT on said first carrier in said aligned position;

while said first DUT is clamped on said first carrier in said aligned position, moving said first carrier to a first one of said test cells, said first test cell comprising a first contactor comprising electrically conductive probes and contactor alignment features;

while said first DUT is clamped on said first carrier in said aligned position, mechanically coupling said carrier alignment features of said first carrier with said contactor alignment features of said first contactor, said coupling aligning said terminals of said first DUT with said probes of said first contactor; and

testing said first DUT in said first test cell by providing signals to and from said DUT through said first contactor.

2. The process of claim 1 further comprising, before completing said testing of said first DUT, positioning in said aligner a second DUT on a second carrier in an aligned position in which electrically conductive terminals of said second DUT are in a predetermined position with respect to carrier alignment features of said second carrier.

3. The process of claim 2 further comprising:

clamping said second DUT on said second carrier in said aligned position;

while said second DUT is clamped on said second carrier in said aligned position, moving said second carrier to a second one of said test cells, said second test cell comprising a second contactor comprising electrically conductive probes and contactor alignment features;

while said second DUT is clamped on said second carrier in said aligned position, mechanically docking said carrier alignment features of said second carrier with said contactor alignment features of said second contactor, said docking aligning said terminals of said second DUT with said probes of said second contactor; and

testing said second DUT in said second test cell by providing signals to and from said second DUT through said second contactor.

4. The process of claim 3, wherein said moving said second carrier and said docking said second carrier occur before completing said testing of said first DUT.

5. The process of claim 4, wherein said testing said second DUT starts before completing said testing of said first DUT.

6. The process of claim 1 further comprising:

mechanically coupling a camera system to said carrier alignment features of said first carrier, wherein cameras of said camera system are in predetermined positions with respect to said carrier alignment features while said camera system and said carrier alignment features are coupled; and

capturing with said cameras images of DUT alignment features on said first DUT,

wherein said positioning said first DUT on said first carrier comprises utilizing said images to move said first DUT until said DUT alignment features are in a predetermined position with respect to said carrier alignment features.

7. The process of claim 1, wherein said positioning said first DUT on said first carrier comprising:

disposing said first carrier with said first DUT clamped thereto on a chuck in said aligner;

unclamping said first DUT from said first carrier;

clamping said first DUT to said chuck; and

moving said chuck and said first DUT relative to said first carrier.

8. The process of claim 7, wherein:

said first carrier comprises a puck with a carrying surface that is smaller than said first DUT; and

said disposing said first carrier on said chuck comprises disposing said puck in a cavity in a surface of said chuck, wherein said first DUT is disposed in part on said carrying surface of said puck and in part on said surface of said chuck.

9. The process of claim 1, wherein:

said carrier alignment features comprise one of extensions or receptacles,

said contactor alignment features comprise the other of extension or receptacles, and

said mechanically coupling said carrier alignment features with said contactor alignment features comprises inserting said extensions into said receptacles, which mechanically aligns said terminals to said probes.

10. The process of claim 9, wherein said inserting said extensions into said receptacles kinematically aligns said terminals to said probes.

11. The process of claim 1 further comprising activating a temperature control device on said first carrier to bring said first DUT to a predetermined temperature, wherein said first DUT is at said temperature before said moving of said first carrier to said first test cell.

12. The process of claim 1, wherein said first DUT is a semiconductor wafer comprising unsingulated semiconductor dies.

13. The process of claim 12, wherein said positioning said first DUT on said first carrier comprises capturing with cameras disposed in said aligner images of DUT alignment features on said semiconductor wafer, wherein said process further comprises storing in a digital memory device positions of said DUT alignment features with respect to at least a portion of an edge of said semiconductor wafer.

14. The process of claim 1, wherein said positioning said first DUT on said first carrier comprising:

disposing said first carrier with said first DUT clamped thereto on a stage in said aligner;

unclamping said first DUT from said first carrier;

lifting, with moveable lifts that extend from said stage through holes in said first carrier, said DUT off of a carrying surface of said first carrier; and

moving in a plane generally parallel to said carrying surface said moveable lifts relative to said first carrier and thereby moving said DUT in said plane into said aligned position; and

lowering, with said moveable lifts, said first DUT onto said carrying surface of said carrier in said aligned position.

15. The process of claim 1 further comprising:

after said testing, determining positions of scrub marks on said terminals of said first DUT caused by contact with said probes; and

changing said aligned position for subsequent repetitions of said process for additional DUTs.

16. A DUT test system comprising:

an aligner comprising a moving mechanism configured to position a DUT on a carrier in an aligned position in which electrically conductive terminals of said DUT are in a predetermined position with respect to carrier alignment features of said carrier;

test cells, each said test cell comprising a contactor, said contactor comprising electrically conductive probes and contactor alignment features, wherein mechanically coupling said carrier alignment features of said carrier with said contactor alignment features of said contactor aligns said terminals of said DUT with said probes of said contactor; and

a mover comprising a robotic mechanism configured to remove said carrier with said DUT clamped in said aligned position from said aligner to one of said test cells.

17. The test system of claim 16, wherein said aligner is distinct from and operates independently of each of said test cells.

18. The test system of claim 17, wherein said moving mechanism of said aligner can position a first said DUT on a first said carrier while a second said carrier with a second said DUT is in one of said test cells.

19. The test system of claim 16, wherein said carrier comprises a clamping mechanism configured selectively to clamp said DUT in place on said carrier and to release said DUT from said carrier so that said DUT can move with respect to said carrier.

20. The test system of claim 16, wherein:

said carrier comprises a puck with a carrying surface that is smaller than said DUT; and

said aligner further comprises a first moveable chuck comprising;

a first surface; and

a first cavity in said first surface, said first cavity configured to receive said puck, wherein, while said puck is disposed in said first cavity, a DUT disposed on said carry surface is also disposed on said first surface of said first chuck.

21. The test system of claim 20, wherein said first cavity comprises alignment features configured to couple mechanically with corresponding alignment features on a surface of said puck that is opposite said carrying surface.

22. The test system of claim 21, wherein said movable chuck comprises vacuum grooves in said first surface configured to clamp and unclamp selectively said DUT to said first surface of said chuck.

23. The test system of claim 21, wherein each test cell further comprises a second moveable chuck comprising:

a second surface; and

a second cavity in said second surface, said second cavity configured to receive said puck, wherein, while said puck is disposed in said second cavity, a DUT disposed on said carry surface is also disposed on said second surface of said second chuck.

24. The test system of claim 23, wherein said second cavity comprises alignment features configured to couple mechanically with said alignment features on said surface of said puck that is opposite said carrying surface.

25. The test system of claim 16, wherein

said carrier alignment features comprise one of extensions or receptacles,

said contactor alignment features comprise the other of extension or receptacles, and

inserting said extensions into said receptacles mechanically aligns said terminals to said probes.

26. The test system of claim 25, wherein said inserting said extensions into said receptacles kinematically aligns said terminals to said probes.

27. The test system of claim 16, wherein said aligner further comprises a camera system comprising:

camera alignment features that can couple mechanically with said carrier alignment features; and

cameras disposed in predetermined positions with respect to said camera alignment features.

28. The test system of claim 16, wherein said carrier further comprises a temperature control device.

29. The test system of claim 16, wherein said DUT is a semiconductor wafer comprising unsingulated semiconductor dies.

30. The test system of claim 16, wherein said moving mechanism of said aligner comprises:

a stage configured to hold said carrier with said DUT disposed on said carrier; and

moveable lifts extending from said stage and configured to lift said DUT off of said carrying surface of said carrier while said carrier is disposed on said stage, wherein said moveable lifts are moveable in a plane that is generally parallel with said carrying surface while said DUT is disposed on said stage.

31. The test system of claim 16, wherein said carrier comprises a puck with a carrying surface that is at least fifty percent smaller than said DUT.

32. The test system of claim 16, wherein said carrier comprises a membrane substrate with a thickness that is less than a thickness of said DUT.

33. The test system of claim 16 further comprising at least four of said test cells.