IMPLANTABLE ELECTRICAL LEAD INCLUDING A COOLING ASSEMBLY TO DISSIPATE MRI INDUCED ELECTRODE HEAT

• US 20110160805A1
• Filed: 10/19/2010
• Published: 06/30/2011
• Est. Priority Date: 12/30/2009
• Status: Active Grant

• Current Assignee: Cardiac Pacemakers Incorporated (Boston Scientific Corporation)
• Original Assignee: Cardiac Pacemakers Incorporated (Boston Scientific Corporation)
• Inventors: Erbstoeszer, Blair, Koop, Brendan E.
• Granted Patent: US 8,406,895 B2
• Time in Patent Office: Days
• US Class Current: 607/63
• CPC Class Codes: A61N 1/056 Transvascular endocardial electrode systems
• CPC Class Codes: A61N 1/086 Magnetic resonance imaging [MRI] compatible leads

Abstract

An implantable medical device lead includes an insulative lead body, an outer conductive coil extending through the lead body, and an inner conductive coil extending coaxially with the outer conductive coil. The outer conductive coil is coupled to a proximal electrode at a distal end of the outer conductive coil, and the inner conductive coil is coupled to a distal electrode at a distal end of the inner conductive coil. A cooling assembly is thermally coupled to the distal electrode to dissipate heat generated at the distal electrode during exposure to magnetic resonance imaging (MRI) fields.

Claims

1. An implantable medical device lead comprising:

an insulative lead body;

an outer conductive coil extending through the lead body, the outer conductive coil coupled to a proximal electrode at a distal end of the outer conductive coil;

an inner conductive coil extending coaxially with the outer conductive coil and coupled to a distal electrode at a distal end of the inner conductive coil; and

a cooling assembly thermally coupled to the distal electrode to dissipate heat generated at the distal electrode during exposure to magnetic resonance imaging (MRI) fields.

2. The implantable medical device lead of claim 1, wherein the cooling assembly comprises one or more thermoelectric elements encased in a thermally conductive biocompatible material.

3. The implantable medical device lead of claim 2, wherein the one or more thermoelectric elements are configured to electrically couple to an energy storage device that drives the one or more thermoelectric elements to pull heat from the distal electrode.

4. The implantable medical device lead of claim 3, wherein energy generated during exposure of the implantable medical device lead to MRI fields is stored in the energy storage device, and wherein the one or more thermoelectric elements are driven at least in part by the energy stored in the energy storage device during exposure of the implantable medical device lead to MRI fields.

5. The implantable medical device lead of claim 2, wherein the one or more thermoelectric elements are configured to electrically couple to an energy storage device that stores energy generated by the one or more thermoelectric elements when dissipating heat from the distal electrode.

6. The implantable medical device lead of claim 2, wherein the one or more thermoelectric elements are configured to electrically couple to a heat sink that dissipates energy generated by the one or more thermoelectric elements when dissipating heat from the distal electrode.

7. The implantable medical device lead of claim 2, wherein the one or more thermoelectric elements are arranged circumferentially around a distal end of the implantable medical device lead.

8. The implantable medical device lead of claim 2, wherein the one or more thermoelectric elements are arranged at a distal tip of the implantable medical device lead, and wherein the one or more thermoelectric elements include a central metal element and a metal ring element separated by a ring of heat transfer junction material.

9. A medical device comprising:

a pulse generator; and

a lead including a lead body, an outer conductive coil extending through the lead body, and an inner conductive coil extending coaxially with the outer conductive coil, the outer conductive coil coupled to a proximal electrode at a distal end of the outer conductive coil, and the inner conductive coil coupled to a distal electrode at a distal end of the inner conductive coil;

a cooling assembly thermally coupled to the distal electrode and electrically coupled to the pulse generator to dissipate heat generated at the distal electrode during exposure to magnetic resonance imaging (MRI) fields.

10. The medical device of claim 9, wherein the cooling assembly comprises one or more thermoelectric elements encased in a thermally conductive biocompatible material.

11. The medical device of claim 10, wherein the pulse generator includes an energy storage device, and wherein the one or more thermoelectric elements are electrically coupled to the energy storage device, the energy storage device driving the one or more thermoelectric elements to pull heat from the distal electrode.

12. The medical device of claim 11, wherein energy generated during exposure of the implantable medical device lead to MRI fields is stored in the energy storage device, and wherein the one or more thermoelectric elements are driven at least in part by the energy stored in the energy storage device during exposure of the implantable medical device lead to MRI fields.

13. The medical device of claim 10, wherein the pulse generator includes an energy storage device, and wherein the one or more thermoelectric elements are electrically coupled to the energy storage device to store energy generated by the one or more thermoelectric elements when dissipating heat from the distal electrode.

14. The medical device of claim 10, wherein the pulse generator includes a heat sink, and wherein the one or more thermoelectric elements are electrically coupled to the heat sink to dissipate energy generated by the one or more thermoelectric elements when dissipating heat from the distal electrode.

15. The medical device of claim 10, wherein the one or more thermoelectric elements are arranged circumferentially around a distal end of the implantable medical device lead.

16. The medical device of claim 10, wherein the one or more thermoelectric elements are arranged at a distal tip of the implantable medical device lead, and wherein the one or more thermoelectric elements include a central metal element and a metal ring element separated by a ring of heat transfer junction material.

17. A medical device comprising:

a pulse generator including an energy storage device; and

a lead comprising;

an insulative lead body;

a conductor assembly extending through the lead body and including at least first, second, and third filars, wherein the first filar is coupled to the pulse generator at a proximal end of the first filar and to a distal electrode at a distal end of the first filar; and

a cooling assembly thermally coupled to the distal electrode to dissipate heat generated at the distal electrode during exposure to magnetic resonance imaging (MRI) fields, the cooling assembly electrically coupled to the energy storage device via the second and third filars.

18. The medical device of claim 17, wherein the first, second, and third filars of the conductor assembly are co-radial.

21. The medical device of claim 17, wherein the cooling assembly comprises one or more thermoelectric elements encased in a thermally conductive biocompatible material.

22. The medical device of claim 21, wherein the one or more thermoelectric elements are arranged circumferentially around a distal end of the implantable medical device lead.

23. The medical device of claim 21, wherein the one or more thermoelectric elements are arranged at a distal tip of the implantable medical device lead, and wherein the one or more thermoelectric elements include a central metal element and a second metal ring element separated by a ring of heat transfer junction material.

19. The medical device of claim 19, wherein the energy storage device drives the cooling assembly to pull heat from the distal electrode.

20. The medical device of claim 19, wherein the cooling assembly generates energy when dissipating heat from the distal electrode, and wherein the energy generated by the cooling assembly is stored in the energy storage device.