METHODS OF FORMING NICKEL SULPHIDE FILM ON A SEMICONDUCTOR DEVICE
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Abstract
Embodiments of the present invention describe a method of forming nickel sulfide layer on a semiconductor device. A nickel sulfide layer is formed on a substrate by alternatingly exposing the substrate to a nickel-containing precursor and a sulfur-containing precursor.
18 Citations
46 Claims
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1-22. -22. (canceled)
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23. A semiconductor device, comprising:
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a substrate having a gate electrode formed thereon; a source region and a drain region formed on the substrate, wherein the source and drain regions are formed on opposite sides of the gate electrode; a first nickel sulfide layer formed on the source region; and a second nickel sulfide layer formed on the drain region. - View Dependent Claims (24, 25, 26, 27, 28, 29)
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30. A semiconductor device formed by a process comprising:
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providing a substrate; exposing a desired region of the substrate to a nickel-containing precursor; exposing the desired region of the substrate to a sulfur-containing precursor to form a nickel sulfide film on the desired region; and exposing the desired region of the substrate to a chemical treatment to form a hydrogen-terminated surface thereon before exposing the desired region to the nickel-containing precursor or the sulfur-containing precursor. - View Dependent Claims (31, 32, 33, 34, 35, 36)
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37. A semiconductor device formed by a process comprising:
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providing a substrate; exposing a desired region of the substrate to a nickel-containing precursor; exposing the desired region of the substrate to a sulfur-containing precursor to form a nickel sulfide film on the desired region; and performing a plasma treatment on the desired region of substrate. - View Dependent Claims (38, 39, 40, 41, 42, 43, 44, 45, 46)
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Specification