LIGHT EMITTING DEVICE PACKAGE
First Claim
Patent Images
1. A light emitting device package comprising:
- a sub-mount including a cavity;
a light emitting device chip provided in the cavity;
an electrode electrically connected to the light emitting chip;
a reflective layer on the cavity;
a dielectric pattern on the reflective layer; and
an encapsulant in the cavity.
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Accused Products
Abstract
Disclosed are a light emitting device package and a lighting system. The light emitting device package includes a sub-mount including a cavity, a light emitting device chip provided in the cavity, an electrode electrically connected to the light emitting chip, a reflective layer formed on a surface of the cavity, a dielectric pattern on the reflective layer, and an encapsulant filled in the cavity.
17 Citations
7 Claims
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1. A light emitting device package comprising:
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a sub-mount including a cavity; a light emitting device chip provided in the cavity; an electrode electrically connected to the light emitting chip; a reflective layer on the cavity; a dielectric pattern on the reflective layer; and an encapsulant in the cavity. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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Specification