INTERCONNECT FOR ON-BODY ANALYTE MONITORING DEVICE

• US 20110191044A1
• Filed: 09/30/2010
• Published: 08/04/2011
• Est. Priority Date: 09/30/2009
• Status: Active Grant

• Current Assignee: Abbott Diabetes Care Incorporated (Abbott Laboratories Incorporated)
• Original Assignee: Abbott Diabetes Care Incorporated (Abbott Laboratories Incorporated)
• Inventors: Stafford, Gary A.
• Granted Patent: US 9,351,669 B2
• Time in Patent Office: Days
• US Class Current: 702/65
• CPC Class Codes: A61B 2560/0412 Low-profile patch shaped housings
• CPC Class Codes: A61B 2560/0443 Modular apparatus
• CPC Class Codes: A61B 2562/164 the sensor is mounted in or on a conformable substrate or carrier
• CPC Class Codes: A61B 2562/222 Electrical cables or leads therefor, e.g. coaxial cables or ribbon cables
• CPC Class Codes: A61B 2562/227 Sensors with electrical connectors
• CPC Class Codes: A61B 5/0002 Remote monitoring of patients using telemetry, e.g. transmission of vital signals via a communication network A61B5/07 takes precedence; transmission systems for measured values G08C; transmission H04B; transmission of digital information H04L; wireless communication networks H04W
• CPC Class Codes: A61B 5/14532 for measuring glucose, e.g. by tissue impedance measurement
• CPC Class Codes: A61B 5/14542 for measuring blood gases A61B5/14551 takes precedence
• CPC Class Codes: A61B 5/14546 for measuring analytes not otherwise provided for, e.g. ions, cytochromes
• CPC Class Codes: A61B 5/1477 non-invasive
• CPC Class Codes: A61B 5/14865 invasive, e.g. introduced into the body by a catheter or needle or using implanted sensors
• CPC Class Codes: A61B 5/742 using visual displays A61B5/339 takes precedence
• CPC Class Codes: A61B 5/743 Displaying an image simultaneously with additional graphical information, e.g. symbols, charts, function plots
• CPC Class Codes: C12Q 1/006 for glucose
• CPC Class Codes: H04L 67/12 specially adapted for proprietary or special-purpose networking environments, e.g. medical networks, sensor networks, networks in vehicles or remote metering networks

Abstract

Disclosed herein are systems and methods for providing a compressible interconnect for allowing electrical communication between an electronics unit and an analyte sensor in an on-body analyte monitoring device. In other embodiments, systems and methods are provided for reducing the Z-height of an on-body analyte monitoring device by utilizing novel interconnects.

Claims

1. An electronics unit for receiving one or more signals from an analyte sensor, the electronics unit comprising:

a body having a top surface, an opposing bottom surface and a sidewall defined therebetween,

a processor and a circuit board disposed within the body of the electronics unit, and

an elongate interconnect comprising conductive material defining a body of the interconnect, the body having a first end secured to the circuit board and a second end engaged to the body of the electronics unit, and a length extending laterally from the sidewall of the body of the electronics unit.

2. The electronics unit of claim 1, wherein the processor is an application specific integrated circuit (ASIC).

3. The electronics unit of claim 1, wherein the conductive material defines a conductive area.

4. The electronics unit of claim 3, wherein the conductive area contacts the circuit board disposed in the body of the electronics unit.

5. The electronics unit of claim 4, wherein the conductive area establishes electrical communication between the elongate interconnect and the circuit board.

6. The electronics unit of claim 1, wherein the elongate interconnect further comprises a contact plate disposed along a length of the interconnect body.

7. The electronics unit of claim 6, wherein the conductive plate is configured to contact or engage the analyte sensor, and further wherein such contact establishes electrical communication between the interconnect and the analyte sensor.

8. The electronics unit of claim 1, wherein the elongate interconnect is substantially U-shaped.

9. The electronics unit of claim 1, wherein the elongate interconnect comprises material sufficiently flexible to collapse upon engagement with an analyte sensor.

10. The electronics unit of claim 1, wherein the conductive material comprises gold.

11. The electronics unit of claim 1, wherein the conductive material defines conductive traces, and further wherein the conductive traces are embedded in flexible material.

12. The electronics unit of claim 11, wherein the flexible material is formed from a thermoplastic material.

13. The electronics unit of claim 12, wherein the thermoplastic material includes polyimide.

14. The electronics unit of claim 13, wherein the polyimide is Kapton®

.

15. The electronics unit of claim 1, wherein the conductive material includes a plurality of conductive cables, and further wherein the plurality of conductive cables is encapsulated within a flexible sheath.

16. The electronics unit of claim 1, wherein the conductive material includes ribbon cables.

17. The electronics unit of claim 16, wherein the ribbon cables are embedded in a flexible material.

100. The electronics unit of claim 16, wherein the conductive material is formed from molded plastic using MID (molded interconnect device) techniques.

101. The electronics unit of claim 100, wherein the MID techniques utilize a LDS (laser direct structuring) process to form the conductive material.

18. An on-body analyte monitoring device comprising:

a mounting unit having a bottom surface adapted to attach to skin of a subject;

an analyte sensor configured to detect and monitor an analyte, the analyte sensor being disposed in the mounting unit;

an electronics unit for receiving one or more signals from the analyte sensor, the electronics unit comprising a body having a top surface, and opposing bottom surface and a sidewall defined therebetween, a processor and a PCB disposed within the body of the electronics unit; and

an elongate interconnect comprising conductive material defining a body of the interconnect, the body having a first end secured to the circuit board and a second end engaged to the body of the electronics unit, and a length extending laterally from the sidewall of the body of the electronics unit, wherein at least a section of the length directly contact the analyte sensor.

19. The on-body analyte monitoring device of claim 18, wherein the analyte sensor comprises one or more electrodes.

20. The on-body analyte monitoring device of claim 19, wherein the electrodes comprise gold.

21. The on-body analyte monitoring device of claim 20, wherein the gold electrodes are formed by at least ablation techniques.

22. The on-body analyte monitoring device of claim 21, wherein the ablation technique is laser ablation.

23. The on-body analyte monitoring device of claim 18, wherein the body of the electronics unit has a substantially circular shape.

24. The on-body analyte monitoring device of claim 18, wherein the body of the electronics unit has a substantially rectangular shape.

25. The on-body analyte monitoring device of claim 18, wherein the electronics unit is configured to communicate with a receiver unit.

26. The on-body analyte monitoring device of claim 25, wherein the communication between the electronics unit and receiver includes unidirectional or bidirectional communication.

27. The on-body analyte monitoring device of claim 18, wherein the analyte is glucose.

28. The on-body analyte monitoring device of claim 18, wherein the electronics unit further comprises a seal disposed proximate the elongate interconnect, and further wherein the seal encapsulate at least a portion of the elongate interconnect.

29. The on-body analyte monitoring device of claim 28, wherein the seal includes an opening to permit direct contact of the contact plate and the analyte sensor.

30. The on-body analyte monitoring device of claim 29, wherein the elongate interconnect is configured to collapse during engagement of the electronics unit and the analyte sensor.

31. The on-body analyte monitoring device of claim 30, wherein the elongate interconnect is configured to return to its non-collapsed configuration upon disengagement of the analyte sensor and the electronics unit.

32. The on-body analyte monitoring device of claim 18, wherein the processor is an application specific integrated circuit (ASIC).

33. The on-body analyte monitoring device of claim 18, wherein the conductive material includes a first conductive area defined by one or more conductive traces and conductive contacts.

34. The on-body analyte monitoring device of claim 33, wherein the first conductive area contacts the circuit board and establishes an electrical communication between the circuit board and the interconnect.

35. The on-body analyte monitoring device of claim 18, wherein the conductive material includes a second conductive area defined by one or more contact traces and one or more conductive contacts, wherein the second conductive area is contacts the analyte sensor to establish electrical communication between the interconnect and the analyte sensor.

36. The on-body analyte monitoring device of claim 18, wherein the elongate interconnect is substantially U-shaped.

37. The on-body analyte monitoring device of claim 18, wherein the elongate interconnect comprises collapsible material.

38. The on-body analyte monitoring device of claim 18, wherein the conductive material comprises gold.

39. The on-body analyte monitoring device of claim 38, wherein the conductive material is embedded in a flexible material.

40. The on-body analyte monitoring device of claim 39, wherein the flexible material is formed from a thermoplastic material.

41. The on-body analyte monitoring device of claim 40, wherein the thermoplastic material includes polyimide.

42. The on-body analyte monitoring device of claim 41, wherein the polyimide is Kapton®

.

43. The on-body analyte monitoring device of claim 18, wherein the conductive material includes a plurality of conductive cables, and further wherein the plurality of conductive cables is encapsulated in a flexible sheath.

44. The on-body analyte monitoring device of claim 18, wherein the conductive material includes ribbon cables.

45. The on-body analyte monitoring device of claim 18, wherein the on-body device further includes a seal formed of a flexible polymer, wherein the seal encapsulates at least a portion of the elongate interconnect.

46. The on-body analyte monitoring device of claim 18, wherein the second end of the elongate interconnect is slidingly engaged to the body of the electronics unit.

47. The on-body analyte monitoring device of claim 18, wherein the second end of the elongate interconnect is permanently affixed to the body of the electronics unit.

48. A molded interconnect device for an on-body analyte monitoring device comprising:

a body including a bottom surface connected to a top surface by a sidewall, the top surface including conductive material disposed thereon and a vertical surface extending downwardly from the top surface, the vertical surface including conductive material disposed thereon,

wherein at least one of the top or vertical surfaces is adapted to establish an electrical communication with an analyte sensor, and further wherein the body is configured to interconnect with an electronics unit to define an on-body analyte monitoring device.

49. The interconnect of claim 48, wherein the conductive material disposed on the top surface or the vertical surface includes conductive film.

50. The interconnect of claim 49, wherein the conductive film is a Z-conductive film.

51. The interconnect of claim 49, wherein the conductive film is an anisotropic film.

52. The interconnect of claim 49, wherein at least one of the conductive materials disposed on the top surface or the vertical surface includes an elastomeric connector.

53. The interconnect of claim 52, wherein the elastomeric connector is a Zebra®

style connector.

54. The interconnect of claim 49, wherein at least one of the conductive materials disposed on the top surface or the vertical surface is adapted to interface a circuit board (PCB) located on the electronics unit.

55. The interconnect of claim 48, wherein the body further includes conductive traces extending from the conductive material disposed on the top surface to the conductive material disposed on the vertical surface.

56. The interconnect of claim 48, further comprising an analyte sensor secured to the vertical surface of the interconnect body.

57. The interconnect of claim 56, wherein the interconnect is engaged to the electronics unit, and further wherein the conductive material disposed on the top surface of the interconnect body is in communication with the electronics unit.

58. The interconnect of claim 57, wherein the conductive material is in electrical communication with a PCB disposed within the electronics unit.

59. The interconnect of claim 58, wherein electrical communication is established between the analyte sensor and the electronics unit through the interconnect body.

60. The interconnect of claim 48, wherein the conductive material disposed on at least one of the top or vertical surface includes an adhesive.

61. The interconnect of claim 60, wherein the adhesive is a UV curable adhesive.

62. The interconnect of claim 60, wherein the adhesive is a multi-adhesive system.

63. The interconnect of claim 62, wherein the multi-adhesive system is a silver loaded epoxy.

64. The interconnect of claim 48, wherein the bottom surface of the interconnect includes adhesive to attach to human skin.

65. The interconnect of claim 48, wherein the interconnect body is formed from a thermoplastic material.

66. The interconnect of claim 48, wherein the conductive material comprises gold.

67. The interconnect of claim 66, wherein the gold conductive material is formed by ablation techniques.

68. The interconnect of claim 67, wherein the ablation technique is laser ablation.

69. An on-body analyte monitoring device comprising:

an analyte sensor configured to measure analyte levels;

an electronics unit configured to process signals generated by the analyte sensor relating to the analyte levels; and

an interconnect comprising a body including a bottom surface connected to a top surface by a sidewall, the top surface a vertical surface extending downwardly from the top surface, the vertical surface coupled to the analyte sensor and the interconnect body engaged to the electronics unit, wherein the interconnect is in electrical communication with the analyte sensor and the electronics unit.

70. The on-body analyte monitoring device of claim 69, wherein the interconnect includes conductive material disposed on at least the top and vertical surfaces.

71. The on-body analyte monitoring device of claim 70, wherein the conductive material includes conductive film

72. The on-body analyte monitoring device of claim 71, wherein the conductive film is a Z-conductive film.

73. The on-body analyte monitoring device of claim 71, wherein the conductive film is an anisotropic film.

74. The on-body analyte monitoring device of claim 70, wherein the conductive material includes an elastomeric connector.

75. The on-body analyte monitoring device of claim 74, wherein the elastomeric connector is a Zebra®

style connector.

76. The on-body analyte monitoring device of claim 69, wherein the interconnect includes conductive material interfaced with a PCB located within the electronics unit.

77. The on-body analyte monitoring device of claim 69, wherein the interconnect further includes conductive traces extending from the conductive material disposed on the vertical surface to the conductive material disposed on the horizontal surface.

78. The on-body analyte monitoring device of claim 69, wherein the analyte sensor and electronics unit are in electrical communication.

79. The on-body analyte monitoring device of claim 69, wherein at least the conductive material disposed on the top surface or the vertical surface of the interconnect comprises an adhesive.

80. The on-body analyte monitoring device of claim 79, wherein the adhesive is a UV curable adhesive.

81. The on-body analyte monitoring device of claim 79, wherein the adhesive comprises a multi-adhesive system.

82. The on-body analyte monitoring device of claim 81, wherein the multi-adhesive system is a silver loaded epoxy.

83. The on-body analyte monitoring device of claim 69, wherein the conductive material comprises gold.

84. The on-body analyte monitoring device of claim 83, wherein the gold conductive material is formed by ablation techniques.

85. The on-body analyte monitoring device of claim 84, wherein the ablation technique is laser ablation.

86. The on-body analyte monitoring device of claim 69, wherein the bottom surface of the interconnect comprises adhesive to attach to human skin.

87. The on-body analyte monitoring device of claim 69, wherein the interconnect is formed from a thermoplastic material.

88. The on-body analyte monitoring device of claim 69, wherein the analyte sensor and the vertical surface of the interconnect are joined by a conductive film.

89. The on-body analyte monitoring device of claim 88, wherein the conductive film is an anisotropic film.

90. The on-body analyte monitoring device of claim 69, wherein the electronics unit and interconnect are adapted to be slidingly engageable.

91. The on-body analyte monitoring device of claim 69, wherein the circuit board comprises gold contacts.

92. The on-body analyte monitoring device of claim 91, wherein the gold contacts are formed by ablation techniques.

93. The on-body analyte monitoring device of claim 92, wherein the ablation technique is laser ablation.

94. The on-body analyte monitoring device of claim 69, wherein the sensor includes one or more electrodes, and further wherein one or more of the electrodes comprise gold.

95. The on-body analyte monitoring device of claim 94, wherein the one or more gold electrodes are formed by ablation techniques.

96. The on-body analyte monitoring device of claim 95, wherein the ablation technique is laser ablation.

97. The on-body analyte monitoring device of claim 69, wherein the interconnect further comprises a battery.

98. The on-body analyte monitoring device of claim 97, wherein the battery is adapted to provide power to the electronics unit.

99. The on-body analyte monitoring device of claim 97, wherein the electronics unit does not require an internal power source.