Solid State Light Strips Containing LED Dies in Series

• US 20110198632A1
• Filed: 04/28/2011
• Published: 08/18/2011
• Est. Priority Date: 08/27/2010
• Status: Active Grant

• Current Assignee: Quarkstar LLC
• Original Assignee: Quarkstar LLC
• Inventors: Ogonowsky, Brian D., Lerman, Louis, Steele, Robert, York, Allan Brent, Henry, Michael David
• Granted Patent: US 8,338,841 B2
• Time in Patent Office: Days
• US Class Current: 257/91
• CPC Class Codes: F21K 9/20 Light sources comprising attachment means
• CPC Class Codes: F21K 9/64 using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
• CPC Class Codes: F21S 8/06 by suspension
• CPC Class Codes: F21Y 2107/90 on two opposite sides of supports or substrates
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 2933/0075 relating to heat extraction or cooling elements
• CPC Class Codes: H01L 33/08 with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body H01L27/15 takes precedence
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01S 5/4025 Array arrangements, e.g. constituted by discrete laser diodes or laser bar H01S5/42 takes precedence

Abstract

A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate.

Claims

1. A lighting device comprising:

a first substrate having first connection locations electrically connected to first conductors formed on the first substrate;

a plurality of non-packaged light emitting diode (LED) dies, each die having at least a first die electrode and a second die electrode, the first die electrode of associated dies being aligned with and electrically connected to an associated first connection location on the first substrate without wire bonds; and

a second substrate affixed over the LED dies and first substrate, the first substrate and second substrate sandwiching at least a group of LED dies and forming a strip enclosing the group, at least portions of the first conductors connecting the LED dies in the group in series,

the second substrate allowing light from the group to pass through a surface of the strip.

2. The device of claim 1 wherein the second substrate has second connection locations electrically connected to second conductors formed on the second substrate, the second die electrode of associated dies being aligned with and electrically connected to an associated second connection location on the second substrate without wire bonds, and wherein portions of the first conductors and portions of the second conductors substantially overlap and electrically connect when the first substrate and the second substrate are brought together to create a series connection of the dies within the group without using wire bonds.

3. The device of claim 2 wherein the portions of the first conductors and the portions of the second conductors electrically connect with no intervening layer sandwiched between the first substrate and the second substrate.

4. The device of claim 2 wherein a portion of at least one of the first conductors and the second conductors is exposed after the dies are sandwiched between the first substrate and the second substrate in order to connect at least one of the first conductors and the second conductors to a source of current.

5. The device of claim 2 wherein the dies are vertical diodes having their first die electrodes on a first surface and their second die electrodes on an opposite surface, wherein at least some of the first conductors are connected to the first die electrodes and at least some of the second conductors are connected to the second die electrodes, wherein the first conductors align with the second conductors when the dies are sandwiched between the first substrate and the second substrate to connect the first die electrode of a first die to the second die electrode of an adjacent second die to connect the first die and the second die in series.

6. The device of claim 1 wherein at least a portion of the strip has a rounded light emitting surface.

7. The device of claim 1 wherein the strip has a plurality of cavities that accommodate at least a portion of a thickness of LED dies within the group.

8. The device of claim 1 wherein the strip conforms to a shape of the LED dies when sandwiching the LED dies.

9. The device of claim 1 wherein a wavelength converting material is selectively provided in the proximity of each LED die location to create an alternative composition of light wavelengths.

10. The device of claim 1 further comprising a phosphor over at least portions of a surface of the strip.

11. The device of claim 1 wherein the first substrate comprises at least a partially reflective portion for reflecting light through the strip.

12. The device of claim 1 wherein the first connection locations are connected to the first die electrodes of associated dies by at least a partially electrically conductive material.

13. The device of claim 1 wherein the first substrate and second substrate sandwich at least one linear column of series-connected LED dies.

14. The device of claim 1 further comprising a third substrate, wider than the strip, the third substrate having mounted on it the strip and additional strips of series-connected LED dies, the group of LED dies in the strip and groups of LED dies in at least some of the additional strips being electrically interconnected.

15. The device of claim 14 wherein the third substrate supports third conductors that electrically interconnect the group of LED dies in the strip and the groups of LED dies in the at least some of the additional strips.

16. The device of claim 14 wherein the third conductors electrically connect the group of LED dies in the strip and the groups of LED dies in the at least some of the additional strips in at least parallel.

17. The device of claim 14 wherein the third conductors are formed over the third substrate.

18. The device of claim 14 wherein the third substrate is approximately equal to or greater than 2×

2 feet, wherein a plurality of the groups are connected in parallel, and wherein the device forms an overhead lighting fixture.

19. The device of claim 1 wherein the first substrate and second substrate are preformed prior to sandwiching the LED dies.

20. The device of claim 1 wherein the strip is shaped to have a reflective portion that redirects light to create a desired emission pattern.