HIGH-FREQUENCY DEVICE AND WIRELESS IC DEVICE

• US 20110199713A1
• Filed: 04/27/2011
• Published: 08/18/2011
• Est. Priority Date: 01/16/2009
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: DOKAI, Yuya, SHIROKI, Koji, KATO, Noboru, IKEMOTO, Nobuo
• Granted Patent: US 8,583,043 B2
• Time in Patent Office: Days
• US Class Current: 361/212
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07735 the record carrier comprising means for protecting against electrostatic discharge
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 23/60 Protection against electrostatic charges or discharges, e.g. Faraday shields
• CPC Class Codes: H01L 23/642 Capacitive arrangements H01L23/49589, H01L23/645, H01L23/647, H01L23/66 take precedence; capacitive effects between wiring layers on the semiconductor body H01L23/5222
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 9/24 Shunt feed arrangements to single active elements, e.g. for delta matching
• CPC Class Codes: H01Q 9/285 Planar dipole H01Q9/065 takes precedence; patch antenna H01Q9/0407

Abstract

A high-frequency device includes a wireless IC chip and a board which is coupled to the wireless IC chip and electrically connected to radiator plates, and an inductor and/or a capacitance are provided as a static electricity countermeasure element in the board. The inductor is connected in parallel between the wireless IC chip and the radiator plates, and its impedance at the frequency of static electricity is less than an impedance of the wireless IC chip.

Claims

1. A high-frequency device comprising:

a wireless IC;

a radiator plate; and

a board coupled to the wireless IC and electrically connected to the radiator plate;

wherein

a static electricity countermeasure element is provided in the board.

2. The high-frequency device according to claim 1, wherein

the static electricity countermeasure element includes an inductor connected in parallel between the wireless IC and the radiator plate;

and

an impedance of the inductor at a frequency of static electricity is less than an impedance of the wireless IC.

3. The high-frequency device according to claim 1, wherein the static electricity countermeasure element includes a capacitance connected in series between the wireless IC and the radiator plate.

4. The high-frequency device according to claim 3, wherein

the wireless IC includes two coupling portions coupled to the board;

and

the static electricity countermeasure element includes two capacitances connected in series between the two coupling portions and the radiator plate, the two capacitances having the same or substantially the same capacitance value.

5. The high-frequency device according to claim 1, wherein the board includes a plurality of electrode layers.

6. The high-frequency device according to claim 5, wherein the plurality of electrode layers overlap each other in a plan view.

7. The high-frequency device according to claim 1, wherein the board is made of a flexible material.

8. A wireless IC device comprising:

a wireless IC;

a radiator plate; and

a board coupled to the wireless IC and electrically connected to the radiator plate;

wherein

a static electricity countermeasure element is provided in the board.

9. The wireless IC device according to claim 8, wherein

the static electricity countermeasure element includes an inductor connected in parallel between the wireless IC and the radiator plate;

and

an impedance of the inductor at a frequency of static electricity is less than an impedance of the wireless IC.

10. The wireless IC device according to claim 8, wherein the static electricity countermeasure element includes a capacitance connected in series between the wireless IC and the radiator plate.

11. The wireless IC device according to claim 10, wherein

the wireless IC includes two coupling portions coupled to the board;

and

the static electricity countermeasure element includes two capacitances connected in series between the two coupling portions and the radiator plate, the two capacitances having the same or substantially the same capacitance value.

12. The wireless IC device according to claim 8, wherein the radiator plate includes, at least at a pair of end portions, loop electrodes coupled to the static electricity countermeasure element.

13. The wireless IC device according to claim 9, wherein

the radiator plate includes, at least at a pair of end portions thereof, loop electrodes coupled to the static electricity countermeasure element;

and

a resonant frequency defined by the loop electrodes and the inductor substantially corresponds to a frequency of a high-frequency signal used in RFID.

14. The wireless IC device according to claim 10, wherein

the radiator plate includes, at least at a pair of end portions thereof, loop electrodes coupled to the static electricity countermeasure element;

and

a resonant frequency defined by the loop electrodes and the capacitance substantially corresponds to a frequency of a high-frequency signal used in RFID.

15. The wireless IC device according to claim 8, wherein the radiator plate includes, at least at a pair of end portions thereof, loop electrodes coupled to the static electricity countermeasure element, and dipole electrodes coupled to the loop electrodes.