ANTENNA PATTERN FRAME, CASE OF ELECTRONIC DEVICE AND MOULD FOR MANUFACTURING THE SAME

• US 20110205127A1
• Filed: 02/07/2011
• Published: 08/25/2011
• Est. Priority Date: 02/25/2010
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: SUNG, Jae Suk, HONG, Ha Ryong, CHO, Sung Eun, AN, Chan Gwang, HAN, Chang Mok, CHANG, Ki Won, LEE, Dae Kyu, LEE, Duk Woo, BAE, Sang Woo
• Granted Patent: US 8,773,314 B2
• Time in Patent Office: Days
• US Class Current: 343/702
• CPC Class Codes: B29C 45/14065 Positioning or centering articles in the mould
• CPC Class Codes: B29C 45/14639 for obtaining an insulating effect, e.g. for electrical components
• CPC Class Codes: B29C 45/1671 with an insert
• CPC Class Codes: B29C 45/2606 Guiding or centering means
• CPC Class Codes: B29L 2031/3431 Telephones, Earphones
• CPC Class Codes: B29L 2031/3437 Cellular phones
• CPC Class Codes: B29L 2031/3456 Antennas, e.g. radomes
• CPC Class Codes: B29L 2031/3481 Housings or casings incorporating or embedding electric or electronic elements
• CPC Class Codes: H01Q 1/2266 disposed inside the computer
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 9/42 with folded element, the folded parts being spaced apart a small fraction of the operating wavelength

Abstract

There is provided an antenna pattern frame, including: a radiator that includes an antenna pattern part transmitting and receiving signals and a connection terminal part transmitting and receiving the signals to and from a circuit substrate of an electronic device; and a radiator frame that embeds the antenna pattern part in a case of the electronic device and supports the radiator, the radiator being manufactured by injection molding, wherein the radiator frame forms a guide boss inserted into a manufacturing mould for injection-molding the case of the electronic device in which the radiator is embedded.

Claims

1. An antenna pattern frame, comprising:

a radiator that includes an antenna pattern part transmitting and receiving signals and a connection terminal part transmitting and receiving the signals to and from a circuit substrate of an electronic device; and

a radiator frame that embeds the antenna pattern part in a case of the electronic device and supports the radiator, the radiator being manufactured by injection molding,

wherein the radiator frame a guide boss inserted into a manufacturing mould for injection-molding the case of the electronic device in which the radiator is embedded.

2. The antenna pattern frame of claim 1, wherein the guide boss includes a slot part therein so that it is elastically supported and fixed to the manufacturing mould.

3. The antenna pattern frame of claim 1, wherein the radiator frame includes an introducing hole formed to introduce a resin material when injection-molding the case of the electronic device.

4. The antenna pattern frame of claim 1, wherein the radiator includes a connection part that is a part of the radiator and connects the antenna pattern part to the connection terminal part, and

the connection part is formed so that the antenna pattern part is formed on one surface of the radiator frame and the connection terminal part is formed on an opposite surface to the one surface.

5. The antenna pattern frame of claim 1, wherein the connection terminal part contacts and supports the radiator supporting part that is protruded from the opposite surface of the one surface on which the antenna pattern part of the radiator frame is formed.

6. A case of an electronic device, comprising:

a radiator that includes an antenna pattern part transmitting and receiving signals and a connection terminal part transmitting and receiving the signals to and from a circuit substrate of an electronic device;

a radiator frame including a guide boss that supports and fixes the radiator and is inserted in the manufacturing mould for injection-molding the case of the electronic device in which the radiator is embedded, the radiator being manufactured by injection molding; and

a case frame that covers one surface of the radiator frame to embed the antennat pattern part between the radiator frames.

7. The case of the electronic device of claim 6, wherein the guide boss includes a slot part so that it is elastically supported and fixed to the manufacturing mould.

8. The case of the electronic device of claim 6, wherein the radiator frame includes an introducing hole formed to introduce a resin material when injection-molding the case of the electronic device.

9. The case of the electronic device of claim 8, wherein the introducing hole is formed to integrate a resin material introduced through the introducing hole with the guide boss.

10. The case of the electronic device of claim 6, wherein the connection part is formed so that the antenna pattern part is formed on one surface of the radiator frame and the connection terminal part is formed on an opposite surface to the one surface.

11. The case of the electronic device of claim 6, wherein the connection terminal part contacts and supports the radiator supporting part that is protruded from the opposite surface of the one surface on which the antenna pattern part of the radiator frame is formed.

12. A mould for manufacturing an antenna pattern frame, comprising:

upper and lower moulds receiving a radiator that includes an antenna pattern part transmitting and receiving signals, a connection terminal part connected to a circuit substrate of an electronic device, and a connection part connecting the antenna pattern part to the connection terminal part; and

when the upper and lower moulds are combined with each other, a resin material introducing part formed in any one of the upper, lower, or upper and lower moulds to introduce a resin material into an inner space so that the inner space of the upper and lower moulds becomes the radiator frame to embed the antenna pattern part in the case of the electronic device,

wherein the lower mould includes a guide groove so that the radiator frame includes a guide boss that is inserted into the manufacturing mould for injection-molding the case of the electronic device and the radiator is the radiator frame by the inner space.

13. The mould for manufacturing an antenna pattern frame of claim 12, wherein the lower mould includes a protruding part corresponding to the slot part in the guide groove to form a slot part in the guide boss.

14. The mould for manufacturing an antenna pattern frame of claim 12, wherein any one of the upper, lower, or upper and lower moulds includes an interrupting boss that prevents the resin material from being introduced in order to form an introducing hole for introducing the resin material on the antenna pattern frame when the case of the electronic device is injection-molded.

15. The mould for manufacturing an antenna pattern frame of claim 12, wherein the inner space of the upper and lower moulds receives the connection terminal part and includes a radiator supporting part forming groove in order to form the radiator supporting part supporting the connection terminal part.

16. The mould for manufacturing an antenna pattern frame of claim 12, wherein any one of the upper, lower or upper and lower moulds is provided with a compression pin that compresses the connection terminal part disposed in the radiator supporting part forming groove.

17. A mould for manufacturing a case of an electronic device, comprising:

upper and lower moulds that receive a radiator including an antenna pattern part transmitting or receiving signals, a radiator including a connection terminal part contacting a circuit substrate of an electronic device, a radiator frame supporting the radiator, and an antenna pattern frame including a guide boss formed to be protruded from one surface of the radiator frame; and

when the upper and lower moulds are combined with each other, a resin material introducing part formed in any one of the upper, lower, or upper and lower moulds to form a case of an electronic device by combining the antenna pattern frame with the resin material due to the introduction of the resin material in the inner space of the upper and lower moulds;

wherein the lower mould includes a guide groove formed to insert the guide boss and the antenna pattern frame is the case of the electronic device by the inner space.

18. The mould for manufacturing the case of the electronic device of claim 17, wherein the guide groove includes the guide boss receiving part to fix and support the guide boss.

19. The mould for manufacturing the case of the electronic device of claim 18, wherein the guide boss receiving part is configured of a variable part having a diameter larger than that of the guide boss and a fixing part having a diameter smaller than that of the variable part.

20. The mould for manufacturing the case of the electronic device of claim 19, wherein the variable part receives the guide boss by being protruded to the upper portion of the lower mould before the guide boss is inserted, and is inserted into the guide groove of the lower mould after the guide boss is received.