CONNECTING PAD PRODUCING METHOD

• US 20110217837A1
• Filed: 12/22/2010
• Published: 09/08/2011
• Est. Priority Date: 03/03/2010
• Status: Abandoned Application

• Current Assignee: Omron Corporation
• Original Assignee: Omron Corporation
• Inventors: Kuratani, Naoto, Maekawa, Tomofumi, Ono, Kazuyuki
• Application Number:
  US12/976,473
• Publication Number:
  US 20110217837A1
• Time in Patent Office: Days
• US Class Current: 438/612
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81B 2207/07 Interconnects
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: H01L 21/4878 Mechanical treatment, e.g. deforming
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48471 the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 23/049 the other leads being perpendicular to the base
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 23/13 characterised by the shape
• CPC Class Codes: H01L 23/49833 the chip support structure consisting of a plurality of insulating substrates
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/03 : Manufacturing methods
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 : Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1433 : Application-specific integrated circuit [ASIC]
• CPC Class Codes: H01L 2924/1461 : MEMS
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15156 : Side view
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/1517 : Multilayer substrate
• CPC Class Codes: H01L 2924/1617 : Cavity coating
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

A connecting pad producing method has a first process of projecting an insulating member in a surface of a base material such that a region where a connecting pad is formed is surrounded, a second process of forming a conductive layer in the surface of the base material such that the insulating member is coated with the conductive layer, and a third process of removing the conductive layer with which the insulating member is coated, exposing the insulating member over a whole periphery from the conductive layer, and forming the connecting pad including the conductive layer in a region surrounded by the insulating member.

Claims

1. A connecting pad producing method comprising:

a first process of projecting an insulating member in a surface of a base material such that a region where a connecting pad is formed is surrounded;

a second process of forming a conductive layer in the surface of the base material such that the insulating member is coated with the conductive layer; and

a third process of removing the conductive layer with which the insulating member is coated, exposing the insulating member over a whole periphery from the conductive layer, and forming the connecting pad including the conductive layer in a region surrounded by the insulating member.

2. The connecting pad producing method according to claim 1, wherein the insulating member is formed by adding an insulating material to the surface of the base material in the first process.

3. The connecting pad producing method according to claim 1, wherein the insulating member is formed integral with the base material in the first process.

4. The connecting pad producing method according to claim 1, wherein the conductive layer is provided in the surface of the base material having conductivity through a coated film made of an insulating material in the second process.

5. The connecting pad producing method according to claim 1, wherein the conductive layer with which the insulating member is coated is removed so as not to reach the conductive layer surface in a region adjacent to the insulating member in the third process.

6. The connecting pad producing method according to claim 1, wherein the conductive layer with which the insulating member is coated and the insulating member are removed to a surface of the conductive layer in a region adjacent to the insulating member in the third process.

7. The connecting pad producing method according to claim 1, wherein the conductive layer is removed by machine work in the third process.

8. The connecting pad producing method according to claim 1, wherein the conductive layer outside the region surrounded by the insulating member is an electromagnetic shield.

9. The connecting pad producing method according to claim 1, wherein the base material includes a recess,

the insulating member is formed in the surface of the base material in a region outside the recess in the first process, and

the conductive layer is formed in the whole surface of the base material including an inner surface of the recess in the second process.

10. The connecting pad producing method according to claim 1, wherein the base material is a member that constitutes at least part of a package for accommodating a semiconductor element.