SEMICONDUCTOR DEVICE
First Claim
1. A semiconductor device, over an insulating substrate, comprising:
- a modulating circuit;
a demodulating circuit;
a logic circuit, wherein the demodulating circuit is operationally connected to the logic circuit;
a voltage boosting power source circuit;
a fuse memory circuit comprising a thin film transistor and a fuse element wherein the fuse memory circuit has a function of storing an output signal of the logic circuit; and
an antenna circuit, wherein the voltage boosting power source circuit, the modulating circuit, and the demodulating circuit are electrically connected to the antenna circuit,wherein the voltage boosting power source circuit is electrically connected to the fuse memory circuit, andwherein at least one of the modulating circuit, the demodulating circuit, and the logic circuit comprises a thin film transistor.
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Accused Products
Abstract
A semiconductor device which may be used as an ID chip and data may be rewritten only one time. In addition, a semiconductor device may be used as an ID chip and data may be written except when manufacturing the chip. The invention has a modulating circuit, a demodulating circuit, a logic circuit, a memory circuit, and an antenna circuit over an insulating substrate. The modulating circuit and the demodulating circuit are electrically connected to an antenna circuit, the demodulating circuit is connected to the logic circuit, the memory circuit stores an output signal of the logic circuit, and the memory circuit is a fuse memory circuit using a fuse element.
43 Citations
19 Claims
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1. A semiconductor device, over an insulating substrate, comprising:
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a modulating circuit; a demodulating circuit; a logic circuit, wherein the demodulating circuit is operationally connected to the logic circuit; a voltage boosting power source circuit; a fuse memory circuit comprising a thin film transistor and a fuse element wherein the fuse memory circuit has a function of storing an output signal of the logic circuit; and an antenna circuit, wherein the voltage boosting power source circuit, the modulating circuit, and the demodulating circuit are electrically connected to the antenna circuit, wherein the voltage boosting power source circuit is electrically connected to the fuse memory circuit, and wherein at least one of the modulating circuit, the demodulating circuit, and the logic circuit comprises a thin film transistor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A semiconductor device, over an insulating substrate, comprising:
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a modulating circuit; a demodulating circuit; a logic circuit, wherein the demodulating circuit is operationally connected to the logic circuit; a rectifier circuit; a stabilizing power circuit being electrically connected to the rectifier circuit; a voltage boosting power source circuit being electrically connected to the stabilizing power circuit; a fuse memory circuit comprising a thin film transistor and a fuse element wherein the fuse memory circuit has a function of storing an output signal of the logic circuit; and an antenna circuit, wherein the rectifier circuit, the modulating circuit, and the demodulating circuit are electrically connected to the antenna circuit, wherein the voltage boosting power source circuit is electrically connected to the fuse memory circuit, and wherein at least one of the modulating circuit, the demodulating circuit, and the logic circuit comprises a thin film transistor. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19)
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Specification