TAPE RESIDUE-FREE BUMP AREA AFTER WAFER BACK GRINDING

  • US 20110230043A1
  • Filed: 03/17/2010
  • Published: 09/22/2011
  • Est. Priority Date: 03/17/2010
  • Status: Active Grant
First Claim
Patent Images

1. A method comprising:

  • providing a partially fabricated semiconductor device on a substrate having a first surface and bumps thereon;

    applying a bump template layer on the bumps;

    laminating an organic-adhesive tape over the first surface and bumps;

    de-laminating the organic-adhesive tape from the first surface, wherein a portion of the organic-adhesive tape remains adhered on the bumps; and

    ,removing all of the portion of the organic-adhesive tape and the bump template layer by cleaning the first surface with a first solution

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