THICK-FILM PASTES CONTAINING LEAD-TELLURIUM-BORON-OXIDES, AND THEIR USE IN THE MANUFACTURE OF SEMICONDUCTOR DEVICES
First Claim
Patent Images
1. A thick-film paste composition comprising:
- a) 85 to 99.5% by weight of an electrically conductive metal or derivative thereof, based on total solids in the composition;
b) 0.5 to 15% by weight based on solids of a lead-tellurium-boron-oxide; and
c) an organic medium.
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Abstract
The present invention provides a thick-film paste for printing the front side of a solar cell device having one or more insulating layers. The thick-film paste comprises an electrically conductive metal and a lead-tellurium-boron-oxide dispersed in an organic medium.
80 Citations
25 Claims
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1. A thick-film paste composition comprising:
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a) 85 to 99.5% by weight of an electrically conductive metal or derivative thereof, based on total solids in the composition; b) 0.5 to 15% by weight based on solids of a lead-tellurium-boron-oxide; and c) an organic medium. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 23, 25)
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11. A process comprising:
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(a) providing a semiconductor substrate comprising one or more insulating films deposited onto at least one surface of the semiconductor substrate; (b) applying a thick-film paste composition onto at least a portion of the insulating film to form a layered structure, wherein the thick-film paste composition comprises; i) 85 to 99.5% by weight of an electrically conductive metal or derivative thereof, based on total solids in the composition; ii) 0.5 to 15% by weight based on solids of a lead-tellurium-boron-oxide; and iii) an organic medium; and (c) firing the semiconductor substrate, insulating film, and thick-film paste, to form an electrode in contact with the insulating layer and in electrical contact with the semiconductor substrate. - View Dependent Claims (12, 13, 14)
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15. An article comprising:
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(a) a semiconductor substrate; (b) an insulating layer on the semiconductor substrate; and (c) an electrode in contact with the insulating layer and in electrical contact with the semiconductor substrate, the electrode comprising an electrically conductive metal and lead-tellurium-boron-oxide. - View Dependent Claims (16, 17, 18)
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19-22. -22. (canceled)
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24. (canceled)
Specification