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THICK-FILM PASTES CONTAINING LEAD-TELLURIUM-BORON-OXIDES, AND THEIR USE IN THE MANUFACTURE OF SEMICONDUCTOR DEVICES

  • US 20110232746A1
  • Filed: 05/04/2011
  • Published: 09/29/2011
  • Est. Priority Date: 05/04/2010
  • Status: Active Grant
First Claim
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1. A thick-film paste composition comprising:

  • a) 85 to 99.5% by weight of an electrically conductive metal or derivative thereof, based on total solids in the composition;

    b) 0.5 to 15% by weight based on solids of a lead-tellurium-boron-oxide; and

    c) an organic medium.

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